Untitled
Abstract: No abstract text available
Text: ,ï l l u n , . HY5141OOA Series >79 I U N U n I 4M x 1-blt CMOS DRAM DESCRIPTION The HY5141 OOA is the 2nd generation and fast dynamic RAM organized 4,194,304 x 1-bit. The HY5141 OOA utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating
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HY5141OOA
HY5141
HY51410QA
such1380
1AC06-30-MAY94
HY514100A
HY514100AJ
HY514100AU
HY514100AT
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Untitled
Abstract: No abstract text available
Text: H Y C 5 3 6 4 1 0 • • H Y U N D A I S e r i e s 4Mx36 DRAM CARD DESCRIPTION The HYC536410 is the DRAM memory card consisting of eight HY5117400ASLTand four HY5141OOALT built in the metal plate housing. The Hyundai DRAM card is optimized forthe applications such as buffering, main and add-in
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4Mx36
HYC536410
HY5117400ASLTand
HY5141OOALT
x36/18
50fla
1MC04-01-FEB95
0004DSB
HYC536410-Series
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jeida dram 88 pin
Abstract: No abstract text available
Text: 'HYUNDAI HYC536410 Series 4Mx36 DRAM CARD DESCRIPTION The HYC536410 is the DRAM memory card consisting of eight HY5117400ASLTand four HY5141OOALT built in the metal plate housing. The Hyundai DRAM card is optimized forthe applications such as buffering, main and add-in
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HYC536410
4Mx36
HY5117400ASLTand
HY5141OOALT
x36/18
1MC04-01-FEBB5
HYC536410-Series
1MC04-01-FEB95
jeida dram 88 pin
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Untitled
Abstract: No abstract text available
Text: •HYUNDAI H Y SEMICONDUCTOR 514100A S e rie s 4M x 1-bit CMOS DRAM DESCRIPTION The HY514100A is the new generation and fast dynamic RAM organized 4,194,304 x 1-bit. The HV514100A utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating
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14100A
HY514100A
HV514100A
1AC06-20-APR93
4b75DÃ
HY514100AJ
HY514100AU
HY514100AT
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HYM532810
Abstract: HY5117400 HYM53
Text: ••HYUNDAI HYM532810 M-Series 8M X 32-blt CM O S DRAM MODULE DESCRIPTION The HYM532810 is a 8M x 32-bit Fast page mode C M O S DRAM module consisting of sixteen HY5117400 in 24/28 pin S O J on a 72 pin glass-epoxy printed circuit board. 0.22fi? decoupling capacitor is mounted for each DRAM,
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HYM532810
32-blt
32-bit
HY5117400
HYM532810M/LM
HYM532810MG/LMG
1CF02-10-JUN94
4b75D
0D03577
HYM53
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U5SB
Abstract: 1621-B AY83
Text: •HYUNDAI SEMICONDUCTOR HYM584000A Series 4M X 8-bit CMOS DRAM MODULE DESCRIPTION The HYM584000A is a 4M x 8-bit Fast page mode CM O S DRAM module consisting of eight HY514100A in 20/26 pin SO J on a 30 pin glass-epoxy printed circuit board. 0.2^uF decoupling capacitor Is mounted for each DRAM.
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HYM584000A
HY514100A
HYM584000AM/ALM
1BC03-10-M
005f0
061MAX.
U5SB
1621-B
AY83
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HY514100A
Abstract: 512Kx1+DRAM
Text: HYUNDAI HY514100A Series SEMICONDUCTOR 4M X 1-bit CMOS DRAM DESCRIPTION The HY514100A is the new generation and fast dynamic RAM organized 4,194,304 x 1-bit. The HY514100A utilizes Hyundai's CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating
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HY514100A
HY5141OOA
1AC06-20-APR93
HY514100AJ
HY514100AU
HY51410QAT
HY514100ALT
512Kx1+DRAM
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Untitled
Abstract: No abstract text available
Text: HY514100A Series "H Y U N D A I 4M X 1-b it CMOS DRAM DESCRIPTION The HY514100A is the 2nd generation and fast dynamic RAM organized 4,194,304 x 1-bit. The HY514100A utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating
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HY514100A
Schot0300
1AC06-30-MAY94
D002U0Q
HY514100AJ
HY514100AU
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r4kf
Abstract: HY53C464LS fr4k HY53C256LS HY531000J
Text: «HYUNDAI QUICK REFERENCE DRAM ORGANIZATION PARTNUMBER SPEEDfiw FEATURES PACKAGE 256K bit 256Kx 1) HY53C256S HY53C256LS HY53C256F HY53C256LF HY53C464S HY53C464LS HY53C464F HY53C464LF HY531000S HY531000J HY531000AS HY531000ALS HY531000AJ HY531000AU HY534256S
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256Kx
64Kx4)
HY53C256S
HY53C256LS
HY53C256F
HY53C256LF
HY53C464S
HY53C464LS
HY53C464F
HY53C464LF
r4kf
fr4k
HY531000J
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Untitled
Abstract: No abstract text available
Text: H Y U ND A I HYM536400A Series SEMICONDUCTOR 4M x 36-bit CMOS DRAM MODULE PRELIMINARY DESCRIPTION The HYM536400A is a 4M x 36-bit Fast page mode CMOS DRAM module consisting of thirty six HY514100A in 20/26 pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.2^uF decoupling capacitor is mounted for each
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HYM536400A
36-bit
HY514100A
HYM536400AM/ALM
HYM536400AMG/ALMG
198-OmW
power23
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HY51V18164
Abstract: HY5118164 HY514260 HY51V65400 HY51V17804CJ
Text: «HYUNDAI DRAM ORDERING INFORMATION ORGANIZATION 1M bit 256Kx4 2M bit (256x8) 2M bit (128Kx16) 4M bit (4Mx1) 4M bit (1 Mx4) Note : FP PART NUMBER HY534256AJ HY534256ALJ HY512800J HY512800LJ HY512800SLJ HY512264JC HY512264LJC HY512264SLJC HY512264TC HY512264LTC
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256Kx4)
256x8)
128Kx16)
HY534256AJ
HY534256ALJ
HY512800J
HY512800LJ
HY512800SLJ
HY512264JC
HY512264LJC
HY51V18164
HY5118164
HY514260
HY51V65400
HY51V17804CJ
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