DS87530
Abstract: DS87520 C72701
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 972 371–4000 Date: April 7, 1997 Subject: PRODUCT CHANGE NOTICE – C72701 Description: DS87520 / DS87530 Revision Change Description of Change: The DS87520 and DS87530 Microcontrollers are being changed from revision A10 to A11. This
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C72701
DS87520
DS87530
yywwA11,
yywwA10
C72701
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DS87520
Abstract: DS87C520 DS87C530
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: May 13th, 1997 Subject: PRODUCT CHANGE NOTICE - E70201 Description: DS87520 and DS87530 passivation process changed.
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E70201
DS87520
DS87530
DS87C520
DS87C530
DS87C530
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DS1235YW
Abstract: ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A
Text: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1315 DS17485 DS21S07A DS2153 DS1868 DS1706 DS1800 DS1817 DS1866 DS1305 DS17285 DS1306 DS17485 DS1307 DS17885
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DS87520
DS87523
DS87530
DS2118
DS1302
DS1315
DS17485
DS1721
DS83CH20
DS1235YW
ds1480
DS1235YWl
DS2228-1MG
DS1242
DS2402
ds2403
DS1990A-f50
DS2228-4MG
DS1833A
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DS1235YW
Abstract: DS1235YWL DS2228-1MG DS1242 DS1868 DS1187 ds1480 DS1671 DS83520 DS1241
Text: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE DS87520 TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1585 DS1306 DS17485 DS1307 DS17885 DS1315 DS1803 DS1623 DS1806 DS1627 DS2430A DS1670 DS2437 DS1673
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DS87520
DS87523
DS87530
DS2118
DS1302
DS1302
DS1721
DS83CH20
DS12885B
DS1235YW
DS1235YWL
DS2228-1MG
DS1242
DS1868
DS1187
ds1480
DS1671
DS83520
DS1241
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DS87520
Abstract: No abstract text available
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – A70702 Description: DS87520/DS87530 Revision Change Description of Change: The DS87520 and DS87530 Microcontrollers are being changed from revision A7 to revision A10.
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A70702
DS87520/DS87530
DS87520
DS87530
yywwA10,
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Hyundai 9944
Abstract: nseb ds1000m-100 DS2165Q
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1000M-100
DS1000
DH927108AJC
DS87C520
DN901118AAB
Hyundai 9944
nseb
DS2165Q
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74 HTC 192
Abstract: DS2165Q
Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS China 9847 PROCESS Single Poly, Single Metal DH833179ADA 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH833179ADA
HOUR99
DS87C520
DN825394AAB
J-STD-020
30C/60%
74 HTC 192
DS2165Q
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Ablebond
Abstract: ABLEBONd 84-1 Ablebond 8361J DS83520 8361J 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – B70302 Description: Die Attach Adhesive Change for PLCC Devices Description of Change: The die attach adhesive will be changed from Ablebond 84–1 LMIS to Ablebond 8361J for all PLCC
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B70302
8361J
DS1212
DS2012
DS1284
DS2130
DS1285
DS2141
DS2009
DS2143
Ablebond
ABLEBONd 84-1
Ablebond 8361J
DS83520
84-1 LMIs
DS1684
DS80320
Dallas DS1212
DS2130
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DS87520
Abstract: P2305 P23855
Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH833179ADA
P23057
P23178
DN825394AAB
P23415
P23306
P23307
J-STD-020
DS87520
P2305
P23855
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DS87520
Abstract: dm8304 P2271 DS2165Q
Text: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DL817678ABB
P22755
P22778
J-STD-020
DS87520
DN825394AAB
DS87C520
P23306
dm8304
P2271
DS2165Q
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MP8000C
Abstract: DS2141A DS2151 DS2153 DS2180A DS2181A DS80320 DS87520 mold compound MP-8000
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972-371-4000 Date: 8/26/98 Subject: PRODUCT CHANGE NOTIFICATION Description: Qualification of MP8000C Mold Compound and adding Hana, Hong Kong as a second source for 44L PLCC packages.
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MP8000C
Aff3520
DS2141A
DS2151
DS2153
DS2180A
DS2181A
DS80320
DS87520
mold compound
MP-8000
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