DS87520
Abstract: P2305 P23855
Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH833179ADA
P23057
P23178
DN825394AAB
P23415
P23306
P23307
J-STD-020
DS87520
P2305
P23855
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DS1232L
Abstract: DS1620 C2 ti 9815
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 DM821478AIB 8 PIN SOIC STRESS:
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DM821478AIB
DS2502
P23041
DM821478AIB
P23123
DK826585AA
DS1232L
DS1620 C2
ti 9815
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DS2175D1
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Single Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2401 READ POINT QTY FAILS C2 MAR '99 P23371 9851 CARSEM DM832008AIA
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DM832008AIA
DK826547AA
DS2401
P23371
P23673
DS80C320
DK826547AA
DS2175D1
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