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Catalog Datasheet	MFG & Type	PDF	Document Tags
P2272 Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q Text: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)	Original	PDF	DS1210S DN801581AAC P22330 P22398 P22690 P22728 P22729 P22730 P22731 P2272 P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
DS1620 C2 Abstract: 9814 DS1621 P22328 DS2165Q Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti	Original	PDF	DM821478AIB DS2502 P23041 DS2153Q P23108 P22556 DN811539AAB DN733468AAB DS2108 DS1620 C2 9814 DS1621 P22328 DS2165Q
DS87520 Abstract: dm8304 P2271 DS2165Q Text: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7	Original	PDF	DS1232L DL817678ABB P22755 P22778 J-STD-020 DS87520 DN825394AAB DS87C520 P23306 dm8304 P2271 DS2165Q
DS1232L Abstract: DS1620 C2 ti 9815 Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 DM821478AIB 8 PIN SOIC STRESS:	Original	PDF	DM821478AIB DS2502 P23041 DM821478AIB P23123 DK826585AA DS1232L DS1620 C2 ti 9815