Hyundai 9944
Abstract: nseb ds1000m-100 DS2165Q
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1000M-100
DS1000
DH927108AJC
DS87C520
DN901118AAB
Hyundai 9944
nseb
DS2165Q
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DS-1000
Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH927108AJC
J-STD-020
30C/60%
DS-1000
DS1302 DIE REVISION
DH020
25409
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74 HTC 00
Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH927108AJC
DK935356AAB
J-STD-020
30C/60%
74 HTC 00
74 HTC 08
DS1302 DIE REVISION
Hyundai 9944
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dallas date code ds1230
Abstract: 25091 e8 sot223 24446
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC
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DS1621
DS1869
DK815282AAB
DJ824247ABA
DM846764AA
DS2502
DS87C520
DN901118AAB
DK935356AAB
dallas date code ds1230
25091
e8 sot223
24446
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DS1233 a5
Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC
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DS1621
DK815282AAB
DK906731AAC
DS1869
DJ821534ABB
DJ824252AAC
DJ824247ABA
DS1233 a5
e8 sot223
9915
dallas 25010
DN819
densit
DS1232L
ds1232l datasheet
DS1869
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA
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DM941226AA
DM941230AG
DS2502
DM941230AG
DM941226AA
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DN901118AAB
Abstract: c5 99 sot223 dk91
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA
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DM846764AA
DM849359AC
DS2502
DM849359AC
DN901118AAB
c5 99 sot223
dk91
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dallas date code ds1230
Abstract: dallas date code dallas ds1230 code 25807
Text: RELIABILITY MONITOR STRESS: VAPOR PHASE REFLOW CONDITIONS: 217C MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS5002 C4 PACKAGE READ POINT QTY FAIL APR '00 25428 0004 Carsem DM925587AAF MQFP 3 203 DS87C520 A14 NOV '99 24798 9931 ATK Anam, K
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DS5002
DS87C520
DM925587AAF
DN901118AAB
DK935356AAB
J-STD-020
DM929359AB
DS1232
DS1233
dallas date code ds1230
dallas date code
dallas ds1230
code 25807
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218E-08
Abstract: ti 9919
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C2 MAR '99 24153 9913 Carsem S DM842206AL
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DM842206AL
DM846764AA
DS2502
DM846764AA
DM842206AL
218E-08
ti 9919
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