P2272
Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
Text: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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DS1210S
DN801581AAC
P22330
P22398
P22690
P22728
P22729
P22730
P22731
P2272
P2274
P2147
dl817
P22770
P22522
P22328
dm803
DS2165Q
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DS87520
Abstract: dm8304 P2271 DS2165Q
Text: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DL817678ABB
P22755
P22778
J-STD-020
DS87520
DN825394AAB
DS87C520
P23306
dm8304
P2271
DS2165Q
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TSOC 6
Abstract: P22713 P23162 dallas date code ds12887
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: +85°C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY DS1620 D1 SEP 98 P22710 9746 LOT NO. PACKAGE ALPHTK-BANGKOK NSEB DJ711527ABD 8PN SOIC, 208MIL READ POINT QTY FAIL 50 42
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DS1620
P22710
DJ711527ABD
208MIL
J-STD-020
DS1232L
DS1233
DS1267
TSOC 6
P22713
P23162
dallas date code ds12887
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P22518
Abstract: mar 9746 dallas date code ds1230 9830 TO92 P22522 P2274 P22071 P22405 P22403 DS2165Q
Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -55 TO 125°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA AICL DN801581AAC 16 PIN SOIC 300 40 DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA (AICL)
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DS1210S
DS1232L
DS1232S
DS1233
DS1233Z
P22518
mar 9746
dallas date code ds1230
9830 TO92
P22522
P2274
P22071
P22405
P22403
DS2165Q
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