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    MULTI-CHIP PACKAGE MEMORY Search Results

    MULTI-CHIP PACKAGE MEMORY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    MULTI-CHIP PACKAGE MEMORY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    toshiba NAND ID code

    Abstract: TH50VPN5640EBSB bad block PSEUDO SRAM
    Text: TH50VPN5640EBSB TENTATIVE TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM MEMORY MIXED MULTI-CHIP PACKAGE DESCRIPTION The TH50VPN5640EBSB is a mixed multi-chip package containing a 32-Mbit 33,554,432 bit pseudo static RAM


    Original     		PDF TH50VPN5640EBSB TH50VPN5640EBSB 32-Mbit 64-Mbit 528bytes 16pages 1024blocks. 69-pin toshiba NAND ID code bad block PSEUDO SRAM

    lqfp 64 Shipping Trays

    Abstract: DS310H
    Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging


    Original     		PDF

    PSRAM

    Abstract: RAM 2112 256 word J-STD-020B M30L0R8000B0 M30L0R8000T0 M36L0R8060B1 M36L0R8060T1 M69KB096AA
    Text: M36L0R8060T1 M36L0R8060B1 256 Mbit Multiple Bank, Multi-Level, Burst Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 256 Mbit (16Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory


    Original     		PDF M36L0R8060T1 M36L0R8060B1 M36L0R8060T1: 880Dh M36L0R8060B1: 880Eh 54MHz PSRAM RAM 2112 256 word J-STD-020B M30L0R8000B0 M30L0R8000T0 M36L0R8060B1 M36L0R8060T1 M69KB096AA

    PSRAM

    Abstract: M36P0R9060E0 M58PR512J M69KB096AM M58PRxxxJ
    Text: M36P0R9060E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 64 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • ■ Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory


    Original     		PDF M36P0R9060E0 TFBGA107 108MHz, 66MHz PSRAM M36P0R9060E0 M58PR512J M69KB096AM M58PRxxxJ

    M69KR096A

    Abstract: J-STD-020B M30L0R8000B0 M30L0R8000T0 M36L0R8060B0 M36L0R8060T0
    Text: M36L0R8060T0 M36L0R8060B0 256 Mbit Multiple Bank, Multi-Level, Burst Flash Memory 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package PRELIMINARY DATA FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 256 Mbit (16Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory


    Original     		PDF M36L0R8060T0 M36L0R8060B0 M36L0R8060T0: 880Dh M36L0R8060B0: 880Eh 54MHz M69KR096A J-STD-020B M30L0R8000B0 M30L0R8000T0 M36L0R8060B0 M36L0R8060T0

    nor flash 1.8V

    Abstract: PSRAM M36P0R9060E0 M58PR512J
    Text: M36P0R9060E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 64 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • ■ Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory


    Original     		PDF M36P0R9060E0 TFBGA107 108MHz, 66MHz nor flash 1.8V PSRAM M36P0R9060E0 M58PR512J

    M30L0T7000T0

    Abstract: J-STD-020B M36L0T7050B0 M36L0T7050T0 M69AW048B Flash Memory 32Mbit M30L0T7000
    Text: M36L0T7050T0 M36L0T7050B0 128Mbit Multiple Bank, Multi-Level, Burst Flash Memory 32Mbit (2M x16) PSRAM, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 128Mbit (8Mx16, Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 32Mbit (2Mx16) Pseudo SRAM


    Original     		PDF M36L0T7050T0 M36L0T7050B0 128Mbit 32Mbit 8Mx16, 2Mx16) M36L0T7050T0: 88C4h M30L0T7000T0 J-STD-020B M36L0T7050B0 M36L0T7050T0 M69AW048B Flash Memory 32Mbit M30L0T7000

    TFBGA105

    Abstract: M58PR512J JESD97 M39P0R9080E0 TFBGA-105 strataflash 512mbit
    Text: M39P0R9080E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash Memory 256 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package Feature summary • ■ Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory


    Original     		PDF M39P0R9080E0 TFBGA105 TFBGA105 M58PR512J JESD97 M39P0R9080E0 TFBGA-105 strataflash 512mbit

    7900f-d

    Abstract: No abstract text available
    Text: M36LLR8860T1, M36LLR8860D1 M36LLR8860M1, M36LLR8860B1 2 x 256 Mbit Multiple Bank, Multi-Level, Burst Flash Memory 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 2 dice of 256 Mbit (16Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory


    Original     		PDF M36LLR8860T1, M36LLR8860D1 M36LLR8860M1, M36LLR8860B1 M36LLR8860T1: 880Dh M36LLR8860D1: 880Eh 7900f-d

    TFBGA105

    Abstract: TFBGA-105 M39P0R9070E0 M58PR512J M65KA128AL
    Text: M39P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash Memory 128 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package PRELIMINARY DATA Features summary • Multi-chip package – 1die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory


    Original     		PDF M39P0R9070E0 TFBGA105 TFBGA105 TFBGA-105 M39P0R9070E0 M58PR512J M65KA128AL

    M30L0R8000T

    Abstract: RAM 2112 256 word J-STD-020B M30L0R8000B0 M30L0R8000T0 M36LLR8860D1
    Text: M36LLR8860T1, M36LLR8860D1 M36LLR8860M1, M36LLR8860B1 2 x 256 Mbit Multiple Bank, Multi-Level, Burst Flash Memory 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 2 dice of 256 Mbit (16Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory


    Original     		PDF M36LLR8860T1, M36LLR8860D1 M36LLR8860M1, M36LLR8860B1 M36LLR8860T1: 880Dh M36LLR8860D1: 880Eh M30L0R8000T RAM 2112 256 word J-STD-020B M30L0R8000B0 M30L0R8000T0 M36LLR8860D1

    ty9000

    Abstract: TY9000A 1g nand mcp TY9000A000CMGF SD4051 TY9000A000 tc58dyg02f2 nand toshiba ty9000 FBGA149 toshiba mcp
    Text: TY9000A000CMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY9000A000CMGF is a mixed multi-chip package containing a 536,870,912-bit Low Power Synchronous


    Original     		PDF TY9000A000CMGF TY9000A000CMGF 912-bit 256-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 TY9000A 1g nand mcp SD4051 TY9000A000 tc58dyg02f2 nand toshiba ty9000 FBGA149 toshiba mcp

    ty9000

    Abstract: TY9000A ty9000a400 MCP 256M nand toshiba TY9000A400BMGF 1g nand mcp toshiba mcp 512M nand mcp ty90 MCP 1g nand toshiba
    Text: TY9000A400BMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY9000A400BMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices


    Original     		PDF TY9000A400BMGF TY9000A400BMGF 912-bit 456-bit 256-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 TY9000A ty9000a400 MCP 256M nand toshiba 1g nand mcp toshiba mcp 512M nand mcp ty90 MCP 1g nand toshiba

    M69KB096AB

    Abstract: PSRAM M36P0R9060E0 M58PR512J
    Text: M36P0R9060E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash Memory 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package PRELIMINARY DATA Features summary • ■ ■ ■ Multi-chip package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory


    Original     		PDF M36P0R9060E0 108MHz, 66MHz TFBGA10thout M69KB096AB PSRAM M36P0R9060E0 M58PR512J

    ty9000

    Abstract: MCP 256M nand toshiba ty90 TY90009400DMGF toshiba mcp ty900 nand toshiba ty9000 FBGA149 toshiba nand TM P-FBGA149-1013-0
    Text: TY90009400DMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY90009400DMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices


    Original     		PDF TY90009400DMGF TY90009400DMGF 912-bit 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 MCP 256M nand toshiba ty90 toshiba mcp ty900 nand toshiba ty9000 FBGA149 toshiba nand TM

    M58LT128HT

    Abstract: Numonyx M36L0T7050T2 M58LT128HB M58LT128HTB 32-Mbit
    Text: M36L0T7050T2 M36L0T7050B2 128 Mbit Multiple Bank, Multi-Level, Burst Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package Preliminary Data Feature summary • ■ ■ ■ Multi-Chip Package – 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory


    Original     		PDF M36L0T7050T2 M36L0T7050B2 M36L0T7050T2: 88C4h M36L0T7050B2: 88C5h 52MHz M58LT128HT Numonyx M36L0T7050T2 M58LT128HB M58LT128HTB 32-Mbit

    TY9000

    Abstract: MCP 256M nand toshiba toshiba mcp nand toshiba mcp ty900 TY90009 512M x 8 Bit nand FBGA149 toshiba nand TM TY90009400FMGF
    Text: TY90009400FMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY90009400FMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices


    Original     		PDF TY90009400FMGF TY90009400FMGF 912-bit 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-29/29 TY9000 MCP 256M nand toshiba toshiba mcp nand toshiba mcp ty900 TY90009 512M x 8 Bit nand FBGA149 toshiba nand TM

    TFBGA105

    Abstract: KF256 TFBGA-105 M39P0R8070E2 M58PR256J M58PR512J M65KA128AE A12-Amax
    Text: M39P0R8070E2 M39P0R9070E2 256 or 512Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package Feature summary • Multi-Chip Package – 1 die of 256 (16Mb x 16) or 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst)


    Original     		PDF M39P0R8070E2 M39P0R9070E2 512Mbit TFBGA105 64-bit TFBGA105 KF256 TFBGA-105 M39P0R8070E2 M58PR256J M58PR512J M65KA128AE A12-Amax

    M36LLR8760x1

    Abstract: M36LLR8760T1 M30L0R8000 PSRAM RAM 2112 256 word M36LLR8760B1 M36LLR8760D1 M36LLR8760M1 M69KB096AA
    Text: M36LLR8760T1, M36LLR8760D1 M36LLR8760M1, M36LLR8760B1 256 + 128 Mbit Multiple Bank, Multi-Level, Burst Flash Memory 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package TARGET SPECIFICATION FEATURES SUMMARY • ■ ■ ■ MULTI-CHIP PACKAGE – 1 die of 256 Mbit (16Mb x16, Multiple


    Original     		PDF M36LLR8760T1, M36LLR8760D1 M36LLR8760M1, M36LLR8760B1 M36LLR8760T1: 880Dh 88C4h M36LLR8760D1: 880Eh M36LLR8760x1 M36LLR8760T1 M30L0R8000 PSRAM RAM 2112 256 word M36LLR8760B1 M36LLR8760D1 M36LLR8760M1 M69KB096AA

    23LIST

    Abstract: No abstract text available
    Text: M36P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash Memory – 1 die of 128Mbit (8Mb x16) PSRAM


    Original     		PDF M36P0R9070E0 128Mbit TFBGA107 M36P0R9070E0ZAQF M36P0R9070E0 23LIST

    Untitled

    Abstract: No abstract text available
    Text: M36L0R7040T0 M36L0R7040B0 128 Mbit Multiple Bank, Multi-Level, Burst Flash Memory and 16 Mbit PSRAM, 1.8V Supply, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 16 Mbit (1Mb x16) Pseudo SRAM


    Original     		PDF M36L0R7040T0 M36L0R7040B0 M36L0R7040T0: 88C4h M36L0R7040B0: 88C5h 54MHz

    M36P0R9070E0

    Abstract: M58PR512J M69KB128AB
    Text: M36P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package Feature summary • Multi-Chip Package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash Memory – 1 die of 128Mbit (8Mb x16) PSRAM


    Original     		PDF M36P0R9070E0 128Mbit TFBGA107 108MHz, 66MHz M36P0R9070E0 M58PR512J M69KB128AB

    8a21

    Abstract: ba1s F2480 A12F TH50VSF2480AASB TH50VSF2481AASB a19t
    Text: SFP- TOSHIBA Multi Chip Package SRAM & FLASH Memory 4M BIT SRAM X 8/ X16 16M BIT FLASH ( X 8/X 16) Data Sheet TOSHIBA TH50VSF2480/2481AASB TENTATIVE TOSHIBA MULTI CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI CHIP PACKAGE DESCRIPTION


    OCR Scan     		PDF F2480/2481 TH50VSF2480/2481AASB 304-bits 216-bits 65-pin P-LFBGA65-1209-0 8a21 ba1s F2480 A12F TH50VSF2480AASB TH50VSF2481AASB a19t

    ba1s

    Abstract: a19t TH50VSF1480AASB TH50VSF1481AASB
    Text: SFP- I TOSHIBA Multi Chip Package SRAM & FLASH Memory 2M BIT SRAM X 8/X 16 16M BIT FLASH ( X 8/ X 16) Data Sheet TOSHIBA TH 50VSF1480/1481A A S B TENTATIVE TOSHIBA MULTI CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI CHIP PACKAGE


    OCR Scan     		PDF F1480/1481 TH50VSF1480/1481AASB 152-bit 216-bit 65-pin P-LFBGA65-1209-0 ba1s a19t TH50VSF1480AASB TH50VSF1481AASB