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    ComSIT USA M39P0R9070E0ZADF 17,426
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    M39P0R9070E0 Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    M39P0R9070E0 STMicroelectronics 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package Original PDF
    M39P0R9070E0ZAD STMicroelectronics 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package Original PDF
    M39P0R9070E0ZADE STMicroelectronics 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package Original PDF
    M39P0R9070E0ZADF STMicroelectronics 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package Original PDF

    M39P0R9070E0 Datasheets Context Search

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    TFBGA105

    Abstract: M39P0R9070E0 M58PR512J M65KA128AL
    Text: M39P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash Memory 128 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package Feature summary • Multi-Chip Package – 1die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory – 1 die of 128 Mbit (4 Banks of 2Mb x16) Low


    Original
    PDF M39P0R9070E0 TFBGA105 64-bit 2112-bit TFBGA105 M39P0R9070E0 M58PR512J M65KA128AL

    TFBGA105

    Abstract: TFBGA-105 M39P0R9070E0 M58PR512J M65KA128AL
    Text: M39P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash Memory 128 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package PRELIMINARY DATA Features summary • Multi-chip package – 1die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory


    Original
    PDF M39P0R9070E0 TFBGA105 TFBGA105 TFBGA-105 M39P0R9070E0 M58PR512J M65KA128AL