xc9572xl
Abstract: XC9572XL-10VQG44I XC9572XL TQG100 xc9572xl pin xc9572xl pin configuration XC9572XL-5PCG44C TQFP 144 PACKAGE footprint DS058 XC9572XL-5VQG44C XC9572XL-7PC44
Text: XC9572XL High Performance CPLD R DS057 v1.9 March 22, 2006 Product Specification Features Power Estimation • • • • Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell
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XC9572XL
DS057
44-pin
48-pin
64-pin
100-pin
220oC.
XC9572XL-10VQG44I
XC9572XL TQG100
xc9572xl pin
xc9572xl pin configuration
XC9572XL-5PCG44C
TQFP 144 PACKAGE footprint
DS058
XC9572XL-5VQG44C
XC9572XL-7PC44
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XC9572XL
Abstract: xc9572xl pin configuration XC9572XL-5VQ44C XAPP114 XAPP427 XC9500XL XC9572 XC9572XL-10 XC9572XL-5 XC9572XL-7
Text: XC9572XL High Performance CPLD R DS057 v1.8 July 15, 2005 5 Product Specification Features Power Estimation • • • • Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell
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XC9572XL
DS057
XC9500XL
220oC.
xc9572xl pin configuration
XC9572XL-5VQ44C
XAPP114
XAPP427
XC9572
XC9572XL-10
XC9572XL-5
XC9572XL-7
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xc9572xl pin configuration
Abstract: XC9572XL TQG100 XC9572XL-10VQG44I xc9572xl XC9572XL-10TQG100C XC9572XL-10-TQ100 xc9572xl pin XC9572XL-10TQG100I VQ64 XC9572XL-7VQG64I
Text: XC9572XL High Performance CPLD R DS057 v1.7 April 29, 2005 5 Preliminary Product Specification Features Power Estimation • • • • Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell
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XC9572XL
DS057
44-pin
48-pin
64-pin
100-pin
220oC.
xc9572xl pin configuration
XC9572XL TQG100
XC9572XL-10VQG44I
XC9572XL-10TQG100C
XC9572XL-10-TQ100
xc9572xl pin
XC9572XL-10TQG100I
VQ64
XC9572XL-7VQG64I
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xc9572xl pin configuration
Abstract: XC9572XL XC9572XL-7TQG100C XC9572XL-5VQG44C XAPP427 44 VQFP package 84 PLCC pin configuration XC9572XL-10TQ100C XC9572XL-7CSG48C XC9572XL-7VQ44I
Text: XC9572XL High Performance CPLD R DS057 v1.6 September 15, 2004 5 Preliminary Product Specification Features Power Estimation • • • • Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output
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XC9572XL
DS057
XC9500XL
220oC.
xc9572xl pin configuration
XC9572XL-7TQG100C
XC9572XL-5VQG44C
XAPP427
44 VQFP package
84 PLCC pin configuration
XC9572XL-10TQ100C
XC9572XL-7CSG48C
XC9572XL-7VQ44I
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Untitled
Abstract: No abstract text available
Text: XC9572XL High Performance CPLD R DS057 v1.5 July 15, 2004 5 Preliminary Product Specification Features Power Estimation • • • • Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell
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XC9572XL
DS057
XC9500XL
220oC.
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xc9572xl pin configuration
Abstract: XC9572XL XC9572XL-10PCG44C XC9572XL-10CS48I XC9572XL-10VQG44C XC9572XL-7TQ100C XC9572XL-10PC44C xc9572xl-10PCG44C pin XC9572XL-7PCG44C XC9572XL-5TQG100C
Text: XC9572XL High Performance CPLD R DS057 v2.0 April 3, 2007 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 178 MHz 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins)
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XC9572XL
DS057
44-pin
48-pin
64-pin
100-pin
220oC.
xc9572xl pin configuration
XC9572XL-10PCG44C
XC9572XL-10CS48I
XC9572XL-10VQG44C
XC9572XL-7TQ100C
XC9572XL-10PC44C
xc9572xl-10PCG44C pin
XC9572XL-7PCG44C
XC9572XL-5TQG100C
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vqg44
Abstract: xc9572xl vqg TQG100 AEC-Q100 XA9500XL XC9500XL XC95144XL XC9536XL XC9572XL VQG64
Text: k XA9500XL High-Performance CPLD Automotive XA Product Family R DS108-1 v1.5 September 29, 2005 Preliminary Product Specification Features • • • • • • • • • AEC-Q100 device qualification and full PPAP support available in both extended temperature Q-grade and
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XA9500XL
DS108-1
AEC-Q100
XC9500XL,
XC9536XL,
XC9572XL
vqg44
xc9572xl vqg
TQG100
XC9500XL
XC95144XL
XC9536XL
VQG64
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XCV100 TQ144
Abstract: XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116
Text: Device Reliability Report First Quarter 2009 [optional] UG116 v5.5 June 15, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG116
611GU
FGG676
FFG1152
XCV100 TQ144
XCS20XL pqg208
XC3S700AN FGG484
WS609
x2 type ac capacitor
UG-116
xc3s200an pqg208
SPARTAN-3 XC3S400 PQ208
XC3S200 RELIABILITY REPORT
UG116
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XC6SLX45t-fgg484
Abstract: XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow
Text: Device Reliability Report Third Quarter 2010 UG116 v5.11 November 1, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG116
611GU
FGG676
FFG1152
XC6SLX45t-fgg484
XC6SLX16-CSG324
XC6SLX100-FGG676
XC6SLX45 FGG484
x2 type ac capacitor
XC6SLX16 FIT rate
xc3s3400a
UG116
XC95288
Virtex-6 reflow
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Virtex-6 reflow
Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the
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UG116
611GU
FGG676
FFG1152
Virtex-6 reflow
WS609
xc3s3400a
xcv400e-b
UG116
XCS20XL pqg208
UG-116
XC1702L
XCE4VSX25
xc3s500e fg320
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XC9572XL TQ100
Abstract: XC9500XL
Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.3 April 3, 2007 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs
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XC9500XL
DS054
XC95288XL
CS280
DS054
44-pin
XC9572XL TQ100
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XC95288XL pinout
Abstract: Xilinx jtag cable pcb Schematic XC9572XL TQ100 micron 3*3 resistor
Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.1 March 22, 2006 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs
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XC9500XL
DS054
all03/22/06
XC95288XL
CS280
DS054
44-pin
XC95288XL pinout
Xilinx jtag cable pcb Schematic
XC9572XL TQ100
micron 3*3 resistor
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XC9572XL TQG100
Abstract: XC9500XL schematic of TTL XOR Gates XC9572XL XC9572XL Series PC44 VQ44 XC9500 XC95144XL XC95288XL
Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.2 July 25, 2006 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs
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XC9500XL
DS054
XC95288XL
CS280
DS054
44-pin
XC9572XL TQG100
schematic of TTL XOR Gates
XC9572XL
XC9572XL Series
PC44
VQ44
XC9500
XC95144XL
XC95288XL
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DS600
Abstract: XA9500XL XA95144XL XC9500XL AEC-Q100 XA9572XL -15 VQG 44Q Xa9500 DS598 VQG64
Text: k XA9500XL Automotive CPLD Product Family R DS108-1 v1.7 April 3, 2007 Features • • • • • • • • • Product Specification • AEC-Q100 device qualification and full PPAP support available in both extended temperature Q-grade and I-grade.
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XA9500XL
DS108-1
AEC-Q100
XC9500XL,
XC9536XL,
XC9572XL
DS600
XA95144XL
XC9500XL
XA9572XL -15 VQG 44Q
Xa9500
DS598
VQG64
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XC9500XL
Abstract: No abstract text available
Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v1.9 November 11, 2004 Preliminary Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz
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XC9500XL
DS054
XC95288XL
CS280
DS054
44-pin
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Untitled
Abstract: No abstract text available
Text: k XA9500XL Automotive CPLD Product Family R DS108-1 v1.7 April 3, 2007 Features • • • • • • • • • Product Specification • AEC-Q100 device qualification and full PPAP support available in both extended temperature Q-grade and I-grade.
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XA9500XL
DS108-1
AEC-Q100
XC9500XL,
XC9536XL,
XC9572XL
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XC9572XL
Abstract: PC44 VQ44 XC9500 XC9500XL XC95144XL XC95288XL XC9536XL XC95288XL pinout
Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.5 May 22, 2009 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs
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XC9500XL
DS054
XC9572XL
PC44
VQ44
XC9500
XC95144XL
XC95288XL
XC9536XL
XC95288XL pinout
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Untitled
Abstract: No abstract text available
Text: k XA9500XL Automotive CPLD Product Family R DS108-1 v1.6 January 12, 2007 Features • • • • • • • • • AEC-Q100 device qualification and full PPAP support available in both extended temperature Q-grade and I-grade. Guaranteed to meet full electrical specifications over
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XA9500XL
DS108-1
AEC-Q100
XC9500XL,
XC9536XL,
XC9572XL
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camera-link to hd-SDI converter
Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400
Text: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6
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XC3S250E TQ144 STARTER KIT BOARD
Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
Text: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6
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BFG95
Abstract: No abstract text available
Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG112
UG072,
UG075,
XAPP427,
BFG95
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XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
XILINX/part marking Hot
SMT, FPGA FINE PITCH BGA 456 BALL
PC84/PCG84
XCDAISY
TT 2076
XC2VP7 reflow profile
SPARTAN-II xc2s50 pq208
sn63pb37 solder SPHERES
qfn 3x3 tray dimension
HQG160
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xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx topside marking
xilinx part marking
pcb footprint FS48, and FSG48
smd code v36
CF1752
reballing
recommended layout CSG324
BGA reflow guide
XC2VP7 reflow profile
SMD MARKING CODE C1G
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xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx part marking
xilinx topside marking
UG112
qfn 3x3 tray dimension
FGG484
HQG160
reballing
top marking 957 so8
FF1148
fcBGA PACKAGE thermal resistance
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