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    TEXAS INSTRUMENTS, DIE ATTACH Search Results

    TEXAS INSTRUMENTS, DIE ATTACH Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-SAS2MUKPTR-000.5 Amphenol Cables on Demand Amphenol CS-SAS2MUKPTR-000.5 External Mini-SAS Cable (Pull-Tab) - 4x Mini-SAS (SFF-8088) to 4x Mini-SAS (SFF-8088) 0.5m Datasheet
    CS-SAS2MUKPTR-002 Amphenol Cables on Demand Amphenol CS-SAS2MUKPTR-002 External Mini-SAS Cable (Pull-Tab) - 4x Mini-SAS (SFF-8088) to 4x Mini-SAS (SFF-8088) 2m Datasheet
    CS-SAS2MUKPTR-006 Amphenol Cables on Demand Amphenol CS-SAS2MUKPTR-006 External Mini-SAS Cable (Pull-Tab) - 4x Mini-SAS (SFF-8088) to 4x Mini-SAS (SFF-8088) 6m Datasheet
    CS-SASMINTOHD-002 Amphenol Cables on Demand Amphenol CS-SASMINTOHD-002 2m (6.6') External 4x Mini-SAS to HD Mini-SAS Cable - 4x Mini-SAS HD (SFF-8644) to 4x Mini-SAS 26-pin (SFF-8088) Passive Copper Cable [28 AWG] - 6G SAS 2.1 / iPass+™ HD Datasheet
    CS-SASMINTOHD-003 Amphenol Cables on Demand Amphenol CS-SASMINTOHD-003 3m (9.8') External 4x Mini-SAS to HD Mini-SAS Cable - 4x Mini-SAS HD (SFF-8644) to 4x Mini-SAS 26-pin (SFF-8088) Passive Copper Cable [28 AWG] - 6G SAS 2.1 / iPass+™ HD Datasheet

    TEXAS INSTRUMENTS, DIE ATTACH Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MAX232

    Abstract: EN-4088Z SN74ABT16240 SN74ABT16240A SN74ABT16241 SN74ABT16241A 1500KV ABT16241 Hitachi EN-4088Z ABT16240A
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16240A and SN74ABT16241A, Die Revision D February 20, 1997 Abstract Texas Instruments qualified the SN74ABT16240A and SN74ABT16241A die revision D replacing die revision B. Die revision D includes an all layer change, which incorporates timing


    Original     		PDF SN74ABT16240A SN74ABT16241A, SN74ABT16240A SN74ABT16241A SN74ABT16240 SN74ABT16241 ABT16241 ABT16241A MAX232 EN-4088Z 1500KV ABT16241 Hitachi EN-4088Z ABT16240A

    ABT16541A

    Abstract: SN74ABT16540 SN74ABT16540A SN74ABT16541 SN74ABT16541A abt245n ASL2B SN74ABT245 EN4088Z
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16540A and SN74ABT16541A, Die Revision D May 14, 1997 Abstract Texas Instruments qualified the SN74ABT16540A and SN74ABT16541A die revision D, replacing die revision B. Die revision D includes an all layer change and improves the


    Original     		PDF SN74ABT16540A SN74ABT16541A, SN74ABT16540A SN74ABT16541A SN74ABT16540 SN74ABT16541 SN74ABT16541 SN74ABT16541A ABT16541A abt245n ASL2B SN74ABT245 EN4088Z

    ABT841A

    Abstract: 74ABT841 SN74ABT841 SN74ABT841A
    Text: TEXAS INSTRUMENTS Device Revision Notification for the SN74ABT841A, Die Revision B August 21, 1996 Abstract Texas Instruments has qualified the SN74ABT841A, Die Revision B, to replace the SN74ABT841, ‘No-Rev’ die revision. Die revision B was redesigned to improve Capacitive Discharge Model CDM


    Original     		PDF SN74ABT841A, SN74ABT841, ABT841A 74ABT841 74ABT841A ABT841A 74ABT841 SN74ABT841 SN74ABT841A

    SN74FB2041A

    Abstract: 84-1LMIS SN74FB2031 SN74FB2041ARC
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74FB2041A, Die Revision C January 15, 1996 Abstract Texas Instruments has qualified the SN74FB2041A, Die Revision C, to replace the SN74FB2041, Die Revision B. Die revision C was designed to improve propagation delay times. Data sheet changes are


    Original     		PDF SN74FB2041A, SN74FB2041, SN74FB2041A 84-1LMIS SN74FB2031 SN74FB2041ARC

    GTL16622A

    Abstract: SN74GTL16622 SN74GTL16622A EN-4065
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74GTL16622A, Die Revision A July 22, 1998 Abstract Texas Instruments has qualified the SN74GTL16622A, Die Revision A, to replace the SN74GTL16622, Die Revision X. This device was redesigned in order to incorporate 5-V tolerant


    Original     		PDF SN74GTL16622A, SN74GTL16622, 100uA GTL16622A SN74GTL16622 SN74GTL16622A EN-4065

    4088Z

    Abstract: 74ALVCH162830 SN74ALVCHR16269A EN-4065
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ALVCHR16269A, Die Revision C September 22, 1998 Abstract Texas Instruments has qualified the SN74ALVCHR16269A, die revision “C”, to replace the SN74ALVCHR162269, Die Revision “B”. This device was redesigned in order to incorporate a speed


    Original     		PDF SN74ALVCHR16269A, SN74ALVCHR162269, ALVCHR162269 ALVCHR16269A 4088Z 74ALVCH162830 SN74ALVCHR16269A EN-4065

    EPIC-1ZS

    Abstract: sn74cbt3384dw relco a016 CBT16209 CBT16212 SN74CBT16209 SN74CBT16209A SN74CBT16212 SN74CBT16212A
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16209A, Die Revision E and SN74CBT16212A, Die Revision D April 1, 1998 Abstract Texas Instruments has qualified a device revision for the CBT16212A, die revision ‘D’ and the SN74CBT16209A, die revision ‘E’. These devices were redesigned in order to incorporate improved


    Original     		PDF SN74CBT16209A, SN74CBT16212A, CBT16212A, CBT16212, CBT16212 CBT16212A EPIC-1ZS sn74cbt3384dw relco a016 CBT16209 CBT16212 SN74CBT16209 SN74CBT16209A SN74CBT16212 SN74CBT16212A

    Ablebond 71-1

    Abstract: Ablebond 71 BCT8373 SN74BCT8373 SN74BCT8373A 5247 8 pin
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74BCT8373A, Die Revision B February 7, 1996 Abstract Texas Instruments has qualified the SN74BCT8373A, Die Revision B, to replace the SN74BCT8373, no die revision. Die revision B was redesigned to conform to IEEE Standard 1149.11990 JTAG . The die and device revision are necessary to change the TDO drive state controls to


    Original     		PDF SN74BCT8373A, SN74BCT8373, Ablebond 71-1 Ablebond 71 BCT8373 SN74BCT8373 SN74BCT8373A 5247 8 pin

    Ablebond 71-1

    Abstract: Ablebond 71 Ablebond SN74ABT162827 SN74ABT162827A
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT162827A, Die Revision A October 17, 1996 Abstract Texas Instruments has qualified a device revision for the ABT162827A ‘A’ die. This device was redesigned in order to incorporate improved ESD protection circuitry. Included in this revision was an


    Original     		PDF SN74ABT162827A, ABT162827A SN74ABT162827A SN74ABT162827 ABT162827A, ABT162827, ABT162827 Ablebond 71-1 Ablebond 71 Ablebond SN74ABT162827 SN74ABT162827A

    SN74LV00

    Abstract: SN74LVxx SN74LV00A SN74LV04A SN74LV08A SN74LV14A SN74LV240A SN74LV244A SN74LV245A SN74LV32A
    Text: TEXAS INSTRUMENTS Qualification Notification for Selected SN74LV/SN74LV-A Device Redesigns October 15, 1997 Abstract Texas Instruments qualified the SN74LV00A, SN74LV08A, SN74LV32A, SN74LV240A and SN74LV244A Die Revision I; SN74LV245A, SN74LV04A, SN74LV14A


    Original     		PDF SN74LV/SN74LV-A SN74LV00A, SN74LV08A, SN74LV32A, SN74LV240A SN74LV244A SN74LV245A, SN74LV04A, SN74LV14A SN74LV74A SN74LV00 SN74LVxx SN74LV00A SN74LV04A SN74LV08A SN74LV14A SN74LV240A SN74LV245A SN74LV32A

    Ablebond 71-1

    Abstract: j 5804 Ablebond SN54ABT2240A SN74ABT2240A TEXAS INSTRUMENTS, Mold Compound ASL2B
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT2240A, Die Revision J September 17, 1996 Abstract Texas Instruments has qualified a device revision for the ABT2240A, die revision ‘J’ . This device was redesigned in order to incorporate improved ESD protection circuitry. Revision to the A device is


    Original     		PDF SN74ABT2240A, ABT2240A, SN74ABT2240A ABT2240 ABT2240A Ablebond 71-1 j 5804 Ablebond SN54ABT2240A TEXAS INSTRUMENTS, Mold Compound ASL2B

    TGC3000

    Abstract: wafer fab control plan ASIC TGC2000 Qual wafer fab control TEXAS INSTRUMENTS, die attach TGB2000 F642790
    Text: ASIC QRA / PROCESS & PACKAGE QUAL METHODOLOGY Design Libraries Specs Qual Cycle Time “GENERIC” QUALIFICATION Die Sizes Package Pincounts & Types Assembly Locations Wafer Fab Locations Wafer Fab Processes Texas Instruments - ASIC CQE Qual By Similarity


    Original     		PDF

    ABT823

    Abstract: 80368 SN74ABT823A SN74ABT821 SN74ABT821A SN74ABT823 106 6152 Texas Instruments abt821a
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT821A and SN74ABT823, Die Revision B November 28, 1995 Revised January 9, 1996 Revision to PCN # 5242 PCN # 5242A corrects the device revision for the SN74ABT823 in PCN # 5242. PCN # 5242 incorrectly stated the device revision for the SN74ABT823 would be SN74ABT823A. The correct


    Original     		PDF SN74ABT821A SN74ABT823, SN74ABT823 SN74ABT823A. SN74ABT823. SN74ABT821A SN74ABT821 ABT823 80368 SN74ABT823A 106 6152 Texas Instruments abt821a

    GE1030

    Abstract: ge1030t JESD22 B100 JESD22-A102 GE-1030T CLVCH16T245MDGGREP JESD22-A101 JESD22-A108 JESD22-A110 F-459
    Text: Texas Instruments Incorporated Post Office Box 84 Sherman, Texas 75090 6412 Highway 75 South Sherman, Texas 75090 903 868-7111 Texas Instruments Enhanced Products Reliability Report (Subject To Attached Disclaimers) Device Type/Device Family: Package Type:


    Original     		PDF CLVCH16T245MDGGREP JESD22-A108 GE1030 ge1030t JESD22 B100 JESD22-A102 GE-1030T CLVCH16T245MDGGREP JESD22-A101 JESD22-A108 JESD22-A110 F-459

    CERAMIC FLATPACK

    Abstract: SMD Transistor jd
    Text: May 1, 1997 Dear Customer: Texas Instruments Semiconductor Group continually monitors sales and billings activities on all the products offered to its customers. The activity for the products attached has declined to a level which warrants discontinuance of these products by the Military Products Semiconductor


    Original     		PDF MT4C1004 EDI414096 CERAMIC FLATPACK SMD Transistor jd

    delamination

    Abstract: delamination leadframe CSAM J-STD-020C die paddle SLZA002 texas instruments reliability report
    Text: Moisture-Sensitivity Classification of Flange-Mounted Packages at Texas Instruments Application Report Literature Number: SLZA002 September 2007 2 SLZA002 – September 2007 Submit Documentation Feedback Contents 1 2 3 4 Introduction. 5


    Original     		PDF SLZA002 delamination delamination leadframe CSAM J-STD-020C die paddle SLZA002 texas instruments reliability report

    SMJ320C31

    Abstract: SMJ320LC31 TMP320C31KGDB 320C4X
    Text: TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS023B – APRIL 1997 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D Commercial Operating Free-Air Temperature Range –0°C to 70°C Military Operating Free-Air


    Original     		PDF TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB SGUS023B 32-Bit 24-Bit SMJ320C31 SMJ320LC31 TMP320C31KGDB 320C4X

    dr1 315.00

    Abstract: 0.18 um CMOS parameters SMJ320C30 SMJ320C30KGDB
    Text: SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019C – NOVEMBER 1995 – REVISED OCTOBER 2001 D D D D D D D D D D D D D Military Operating Temperature Range –55°C to 125°C, QML Processing Fast Instruction Cycle Time of 50 ns and


    Original     		PDF SMJ320C30KGDB SGUS019C 32-Bit 24-Bit 40-Bit dr1 315.00 0.18 um CMOS parameters SMJ320C30 SMJ320C30KGDB

    SPRS030

    Abstract: 224K-word XDS510PP dsp processor Architecture of TMS320C5X
    Text: TMP320C50KGD, TMP320LC50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGZS008C – JULY 1996 – REVISED JUNE 2000 D 25-ns, 35-ns, and 50-ns Single-Cycle D D D D D D Instruction Execution Time for 5-V Operation 50-ns Single-Cycle Instruction Execution Time for 3.3-V Operation


    Original     		PDF TMP320C50KGD, TMP320LC50KGD SGZS008C 25-ns, 35-ns, 50-ns 16-Bit 056-Word SPRS030 224K-word XDS510PP dsp processor Architecture of TMS320C5X

    F741583

    Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
    Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001


    Original     		PDF EN-4085S2K3 96mils L3/260C UL94-V0 TMS471R1F138 85C/85 3/260C F741583 sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV

    TMP320C50KGD

    Abstract: TMP320LC50KGD 8405
    Text: TMP320C50KGD, TMP320LC50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGZS008B – JULY 1996 – REVISED JUNE 1999 D D D D D D D 35-ns and 50-ns Single-Cycle Instruction Execution Time for 5 V Operation 50-ns Single-Cycle Instruction Execution Time for 3.3 V Operation


    Original     		PDF TMP320C50KGD, TMP320LC50KGD SGZS008B 35-ns 50-ns 16-Bit 056-Word TMP320C50KGD TMP320LC50KGD 8405

    1784

    Abstract: SMJ320C30 SMJ320C30KGDB qmi 3555 dr1 315.00
    Text: SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019C – NOVEMBER 1995 – REVISED OCTOBER 2001 D D D D D D D D D D D D D Military Operating Temperature Range –55°C to 125°C, QML Processing Fast Instruction Cycle Time of 50 ns and


    Original     		PDF SMJ320C30KGDB SGUS019C 32-Bit 24-Bit 40-Bit 1784 SMJ320C30 SMJ320C30KGDB qmi 3555 dr1 315.00

    qmi 3555

    Abstract: 103717 MC 4093 XD7 TI 4327 MP 6154 SMJ320C30 SMJ320C30KGDB 4325.02
    Text: SMJ320C30KGDB FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 D Military Operating Temperature Range D D D D D D D D D D D D −55°C to 125°C, QML Processing Fast Instruction Cycle Time of 50 ns and


    Original     		PDF SMJ320C30KGDB SGUS019D 32-Bit 24-Bit 40-Bit qmi 3555 103717 MC 4093 XD7 TI 4327 MP 6154 SMJ320C30 SMJ320C30KGDB 4325.02

    TGA8021

    Abstract: No abstract text available
    Text: Texas Instruments TGA8021 Monolithic X-Band Low-Noise Amplifier Features • 25-dB gain and 2.5-dB noise figure from 9 to 10 GHz ■ Input and output SWR less than 1.5:1 for packaged MMIC ■ Single-ended feedback design minimizes die size Description The Texas Instruments TGA8021 is a monolithic


    OCR Scan     		PDF TGA8021 25-dB TGA8021