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    Untitled

    Abstract: No abstract text available
    Text: application brief AB13 Soldering SuperFlux LEDs SuperFlux LEDs HPWx xxxx Standard Part Numbers Caution is recommended with the preheat conditions to ensure that the LED lamps are not damaged due to prestressing. Prestress damage can result in cracks and/or delamination of structures within the device.


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    CSDA1BA

    Abstract: Honeywell CSDA1BC CSDB1CC
    Text: Installation Instructions for CS Series Digital Current Detectors PK 87893 SOLDERING INSTRUCTIONS CLEANING Hand Soldering - Use 60/40 rosin core solder, employing a 399°C 750°F controlled temperature, 1/8" chisel tip soldering iron. To avoid delamination of


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    PDF 106A35 CSDA1BA Honeywell CSDA1BC CSDB1CC

    JEDEC J-STD-033b.1

    Abstract: ipc-JEDEC J-STD-033 JEDEC J-STD-033b J-STD-020D J-STD-033 Drypacked Devices AN-2029
    Text: National Semiconductor Application Note 2029 Martin Schnepf June 18, 2010 Introduction inside the package can create excessive internal pressure resulting in delamination or even cracked package popcorn effect . NSC’s components that are considered moisture sensitive


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    PDF J-STD-020 J-STD-033 AN-2029 JEDEC J-STD-033b.1 ipc-JEDEC J-STD-033 JEDEC J-STD-033b J-STD-020D Drypacked Devices AN-2029

    TRILITHIC

    Abstract: P-TO263-15-1 BTS 7740 G 7741 7740 windscreen wiper P-TO-263-15-1 7741G
    Text: Powe r Key Features: • No bond damage, wire necking, bond lifting, die lifting, delamination after MSL1 at 260°C ■ Green materials - no antimony III Robust Package for OptiMOS BTS 7741G & BTS 7751G Join the TrilithIC Family As a result of recent environmental concerns regarding the use of lead, the


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    PDF 7741G 7751G 7741G 120mOhm P-TO263-15-1 P-DSO-28-9 220mOhm TRILITHIC P-TO263-15-1 BTS 7740 G 7741 7740 windscreen wiper P-TO-263-15-1

    sdc 603

    Abstract: SDC-602 plcc 52 SOCKET sdc603 MX-500P-21 sdc 606 sdc606 STTC-136 132 qfp extraction tool METCAL SP200
    Text: soldering desoldering & rework systems contents and preface Contents 1 Introducing the QX2 2 QX2 system elements and functions 3 QX2 system elements and functions 4 Part numbers for the QX2 5 The power of SmartHeat 6 The power of SmartHeat 7 MX rework systems


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    Untitled

    Abstract: No abstract text available
    Text: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166I April 2001 – Revised January 2006 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not


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    PDF TMS320VC5502 SPRS166I TMS320VC5502 SPRS166I SPRS166H

    Untitled

    Abstract: No abstract text available
    Text: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166H April 2001 – Revised November 2004 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not


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    PDF TMS320VC5502 SPRS166H TMS320VC5502 SPRS166H SPRS166G

    CD17

    Abstract: No abstract text available
    Text: Types CD17, CD18 & CDV18, High-Frequency, Mica Capacitors High-Frequency Capacitors for CATV and RF Applications Types CD17 and CD18 assure controlled, resonancefree performance through 1 GHz. Insertion loss data is typically flat within ±0.1 dB over the entire


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    PDF CDV18, CDV19. CD17

    ERA monolithic amplifier

    Abstract: M109959
    Text: Surface Mount Monolithic Amplifier DC-2 GHz Product Features • DC-2 GHz • Single Voltage Supply • Internally Matched to 50 Ohm • Unconditionally Stable • Low Performance Variation Over Temperature • Transient Protected • Aqueous washable • Protected By US Patent 6,943,629


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    PDF ERA-50SM+ WW107 2002/95/EC) wideb45 C/85RH ERA monolithic amplifier M109959

    mcl 49

    Abstract: mcl m1 PL-252 body marking MCL MCL49
    Text: Surface Mount Monolithic Amplifier DC-5 GHz Product Features • DC-5 GHz • Output power, 15.8 dBm typ. • Excellent package for heat dissipation, exposed metal bottom • Flat output power to 10 GHz • Aqueous washable • Protected by US Patent 6,943,629


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    PDF LEE-49+ FG873 2002/95/EC) C/85RH mcl 49 mcl m1 PL-252 body marking MCL MCL49

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount Monolithic Amplifier DC-4 GHz Product Features • InGaP HBT microwave amplifier • Miniature SOT-89 package • Frequency range, DC to 4 GHz • Output power, 15.8 dBm typ. • Excellent package for heat dissipation, exposed metal bottom


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    PDF OT-89 DF782 2002/95/EC) C/85RH

    marking YB SOT89

    Abstract: No abstract text available
    Text: Surface Mount Monolithic Amplifier DC-2 GHz Features • InGaP HBT microwave amplifier • Miniture SOT-89 Package • Frequency range, DC to 2000 MHz • 15.5 dBm typ., output power • Excellent package for heat dissipation, exposed metal bottom • Low thermal resistance for high reliability


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    PDF OT-89 DF782 2002/95/EC) C/85RH marking YB SOT89

    MARKING 4F DBM

    Abstract: SOT-89 marking YB
    Text: Surface Mount Monolithic Amplifier DC-4 GHz Product Features • InGaP HBT microwave amplifier • Miniature SOT-89 package • Frequency range, DC to 4 GHz • Output power, 15.3 dBm typ. • Excellent package for heat dissipation, exposed metal bottom


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    PDF OT-89 DF782 2002/95/EC) C/85RH MARKING 4F DBM SOT-89 marking YB

    ERA-2

    Abstract: MMIC Amplifier Micro-X marking 11
    Text: Drop-In Monolithic Amplifier DC-6 GHz Product Features • DC-6 GHz • Single voltage supply • Internally matched to 50 ohms • Unconditionally stable • Low performance variation over temperature • Transient protected • Protected By US Patent 6,943,629


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    PDF VV105 2002/95/EC) C/85RH ERA-2 MMIC Amplifier Micro-X marking 11

    pcb warpage in ipc standard

    Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
    Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1


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    PDF AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029

    TMS320VC5501PGF300

    Abstract: No abstract text available
    Text: TMS320VC5501 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS206H December 2002 − Revised November 2004 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments


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    PDF TMS320VC5501 SPRS206H MTQF020A S-PQFP-G176) MS-026 TMS320VC5501PGF300

    Untitled

    Abstract: No abstract text available
    Text: HLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323, HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615, HLMP-C623 T-1¾ Super Ultra-Bright LED Lamps Data Sheet Description Features These non-diffused lamps are designed to produce a bright


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    PDF HLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323, HLMP-C415, HLMP-C423, HLMP-C515,

    Untitled

    Abstract: No abstract text available
    Text: HLMP-DS25/DM25/NS30/NM31 T-1¾ 5 mm , T-1 (3 mm) InGaN LED Lamps Data Sheet Description Features The blue HLMP-DS25 and HLMP-NS30, and green HLMP-DM25 and HLMP-NM31 LEDs are designed in an industry standard T-1¾ and T-1 pack-ages with clear and nondiffused optics.


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    PDF HLMP-DS25/DM25/NS30/NM31 HLMP-DS25 HLMP-NS30, HLMP-DM25 HLMP-NM31 AV02-1029EN

    201203

    Abstract: mains isolators
    Text: Finisar Semi-double Stage Isolator Finisar free space isolators offer excellent performance with low insertion loss and high isolation. Our proprietary bonding process, and years of volume manufacturing experience, results in a high reliability record. Bare isolator chips


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    PDF 000hrs 1480nm, 1520nm, 1560nm, 1600nm) 201203 mains isolators

    Untitled

    Abstract: No abstract text available
    Text: F -2 0 2 -1 m sarnle c GFZ— 2 0 -0 1 -G -1 0 -A D c SOLDERLESS INTERFACES Board Stacking Modular-to-Board LGA Interfaces Solderless Interconnects No solder pad delamination Minimizes Coefficient of Thermal Expansion CTE issues No solder joint reliability


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    PDF 1-800-SAMTEC-9

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    Abstract: No abstract text available
    Text: TRUNKING FIXED STATION A N TEN N AS Yägl 'Il I *1 T 872-960 MHz 4-Element Economy Antenna M odels ARA-764 ASA-767 Typical Patterns Low Cost — innovative laminated construction Durable — RTV sealed with perimeter bonding, edged with neoprene U-channel, resists delamination


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    PDF ARA-764 ASA-767 ARA-764 ARA-764) ASA-767) RG-58/U

    Untitled

    Abstract: No abstract text available
    Text: 4. Reliability and Handling Precautions for Device 1. Maximum Rating To guarantee IC ’s Life time and reliability, maximum rating the rating mentioned in this document means the 'absolute maximum rating' should never be exceeded. The maximum rating value of an IC is determined by structural material and


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    Untitled

    Abstract: No abstract text available
    Text: PCS FIXED STATION ANTENNAS Dipole Array Antenna M o d el ASPKM986 Typical Patterns Precision Engineered — solid state feed and cable are laminated between expanded PVC radomes Aesthetically Pleasing — thin profile provides unobtrusive appearance Broadband Perform ance — covers 280 MHz at


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    PDF ASPKM986 RG-188/U

    Untitled

    Abstract: No abstract text available
    Text: TRUNKING FIXED STATION ANTENNAS 872-960 MHz 4-Element Economy Antenna Models ARA-764 ASA-767 Typical Patterns: !5 '' 1 •'0 ; ' ‘ / ' - - • ■ / ,/•. 3" "• ARA-764 H-Plane Low Cost — innovative laminated construction D urable — RTV sealed with perimeter bonding, edged


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    PDF ARA-764 ASA-767 ARA-764) ASA-767) 87kfii/b) RG-58/U ARA-764