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Catalog Datasheet	MFG & Type	PDF	Document Tags
MS-034 Abstract: sot783 Text: PDF: 2002 Aug 13 Philips Semiconductors Package outline HBGA1172: plastic thermal enhanced ball grid array package; 1172 balls; body 40 x 40 x 2.4 mm; heatsink B D SOT783-1 A ball A1 index area A A2 E A1 detail X C e1 C A B ∅w M C b e AV AT AP AM AK AH AF	Original	PDF	HBGA1172: OT783-1 MS-034 MS-034 sot783

Catalog Datasheet

MFG & Type

PDF

Document Tags

MS-034

Abstract: sot783
Text: PDF: 2002 Aug 13 Philips Semiconductors Package outline HBGA1172: plastic thermal enhanced ball grid array package; 1172 balls; body 40 x 40 x 2.4 mm; heatsink B D SOT783-1 A ball A1 index area A A2 E A1 detail X C e1 C A B ∅w M C b e AV AT AP AM AK AH AF

Original

PDF

HBGA1172: OT783-1 MS-034 MS-034 sot783