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    Vishay Intertechnologies VS-GT80DA60U

    IGBT Modules MODULES IGBT - SOT-227 IGBT
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    Vishay Intertechnologies VS-U5FX120EA120

    Diode Modules MODULES RECTIFIERS - SOT-227
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    TTI VS-U5FX120EA120 Tube 160
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    SOT27 Datasheets (6)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT270-1 NXP Semiconductors Plastic shrink dual in-line package; 42 leads (600 mil) Original PDF
    SOT27-1 Philips Semiconductors Package outline Original PDF
    SOT273A NXP Semiconductors Flanged ceramic package; 2 mounting holes; 6 leads Original PDF
    SOT274-1 NXP Semiconductors Plastic shrink dual in-line package; 64 leads (750 mil) Original PDF
    SOT274-2 NXP Semiconductors Plastic shrink dual in-line package; 64 leads (750 mil); face down Original PDF
    SOT279A_112 NXP Semiconductors CDFM4; blister pack; standard product orientation 12NC ending 112 Original PDF

    SOT27 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DIP14

    Abstract: DIP-14 SOT27-1 MAR111
    Text: Philips Semiconductors Package outlines DIP14: plastic dual in-line package; 14 leads 300 mil 1995 Mar 11 1 SOT27-1


    Original     		PDF DIP14: OT27-1 DIP14 DIP-14 SOT27-1 MAR111

    sot27-1

    Abstract: MO-001AA
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP14: OT27-1 OT27-1 050G04 MO-001AA sot27-1

    sot274

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF SDIP64: OT274-1 OT274-1 sot274

    4330-030

    Abstract: UHF amplifier module BGY201 SC09
    Text: DISCRETE SEMICONDUCTORS DATA SHEET BGY201 UHF amplifier module Product specification Supersedes data of June 1994 File under Discrete Semiconductors, SC09 1996 May 22 Philips Semiconductors Product specification UHF amplifier module BGY201 FEATURES PINNING - SOT278A


    Original     		PDF BGY201 OT278A BGY201 4330-030 UHF amplifier module SC09

    SSOP20 300 mil

    Abstract: DIP20 SC603 Package Outline philips ic06
    Text: INTEGRATED CIRCUITS DATA SHEET Package outline drawings January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DESCRIPTION PAGE DIP SOT27-1 plastic dual in-line package; 14 leads 300 mil 3


    Original     		PDF OT27-1 OT38-4 OT146-1 OT101-1 OT222-1 OT117-1 OT96-1 OT108-1 OT355-1 MO-153AD SSOP20 300 mil DIP20 SC603 Package Outline philips ic06

    SDIP64

    Abstract: No abstract text available
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF SDIP64: OT274-1 MS-021 SDIP64

    MO-001

    Abstract: sot27
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP14: OT27-1 77ensions) 050G04 MO-001 SC-501-14 MO-001 sot27

    Untitled

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT278B D A F y U q q1 A U2 E U1 p L 1 2 3 4 bp e2 e1 w M e 10 c v A Z Q 20 mm scale DIMENSIONS mm are the original dimensions


    Original     		PDF OT278B

    sot279a

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT279A D A F 5 D1 U1 B q C w2 M C M H1 1 c 4 E1 H U2 E A 2 w1 M A M B M p 3 w3 M b Q e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions


    Original     		PDF OT279A 51dimensions sot279a

    MLD233

    Abstract: 2322 731 2222 101 18103 transistor c5 5XL10 BLV946 ferroxcube 4322 philips 18103
    Text: DISCRETE SEMICONDUCTORS DATA SHEET BLV946 UHF power transistor Product specification Supersedes data of 1995 Jun 29 1997 Oct 30 Philips Semiconductors Product specification UHF power transistor BLV946 FEATURES PINNING - SOT273A • Internal input and output matching for easy matching,


    Original     		PDF BLV946 OT273A SCA55 127067/00/03/pp12 MLD233 2322 731 2222 101 18103 transistor c5 5XL10 BLV946 ferroxcube 4322 philips 18103

    Untitled

    Abstract: No abstract text available
    Text: Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1


    Original     		PDF SDIP64: OT274-1 MS-021

    Untitled

    Abstract: No abstract text available
    Text: Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT273A D A F D1 U1 B q C H1 w2 M C M b1 2 c 4 6 E1 H E U2 1 A 3 5 w1 M A M B M p Q w3 M b e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT


    Original     		PDF OT273A

    Untitled

    Abstract: No abstract text available
    Text: Package outline seating plane SDIP42: plastic shrink dual in-line package; 42 leads 600 mil SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1


    Original     		PDF SDIP42: OT270-1 MS-020

    Untitled

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane SDIP42: plastic shrink dual in-line package; 42 leads 600 mil SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF SDIP42: OT270-1 OT270-1

    MS-020

    Abstract: SDIP42
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane SDIP42: plastic shrink dual in-line package; 42 leads 600 mil SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF SDIP42: OT270-1 MS-020 MS-020 SDIP42

    sot273a

    Abstract: u21a
    Text: PDF: 1999 Oct 07 Philips Semiconductors Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT273A D A F D1 U1 B q C H1 w2 M C M b1 2 c 4 6 E1 H E U2 1 A 3 5 w1 M A M B M p Q w3 M b e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions


    Original     		PDF OT273A sot273a u21a

    SDIP64

    Abstract: No abstract text available
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF SDIP64: OT274-1 MS-021 SDIP64

    Untitled

    Abstract: No abstract text available
    Text: SOT279A CDFM4; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 16 November 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning


    Original     		PDF OT279A msc071 OT279A

    Untitled

    Abstract: No abstract text available
    Text: Package outline SDIP64: plastic shrink dual in-line package; 64 leads 750 mil ; face down SOT274-2 seating plane D ME A2 A L A1 e Z w b1 M c (e1) MH b 1 32 pin 1 index E 64 33 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 min A2


    Original     		PDF SDIP64: OT274-2 MS-021

    Untitled

    Abstract: No abstract text available
    Text: Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1


    Original     		PDF DIP14: OT27-1 050G04 MO-001 SC-501-14

    SDIP64

    Abstract: 750-mil
    Text: Philips Semiconductors Package outlines SDIP64: plastic shrink dual in-line package; 64 leads 750 mil 1995 Feb 04 5-9 SOT274-1


    Original     		PDF SDIP64: OT274-1 SDIP64 750-mil

    FERROXCUBE 4330

    Abstract: FERROXCUBE 4330-030 MSM88 uhf amplifier BGY114D BGY114E HB 100B
    Text: Product specification Philips Semiconductors UHF amplifier modules BGY114D; BGY114E FEATU RES PINNING - SOT278A • 12.5 V nominal supply voltage PIN DESCRIPTION • 6 W output power 1 RF input • Easy control of output power by DC voltage. 2 Vsi 3 Vc 4 Vs2


    OCR Scan     		PDF BGY114D; BGY114E BGY114D BGY114E OT278A OT278A MSA488 MBD357 FERROXCUBE 4330 FERROXCUBE 4330-030 MSM88 uhf amplifier HB 100B

    HEF4069UBP

    Abstract: HEF4069UBT HEF4069 7Z84371 BAW62 HEF4069UB HEF4069UBD HEF4069UBPN
    Text: HEF4069UB gates HEX INVERTER The HEF4069UB is a general purpose hex inverter. Each o f the six inverters is a single stage. Vdd I b D ii 06 I5 °5 U o4 HEF4069UB 0i I2 O2 I3 O3 Vss 7Z73695 _ Fig. 2 Pinning diagram. HEF4069UBP N : 14-lead DIL; plastic (SOT27-1)


    OCR Scan     		PDF HEF4069UB HEF4069UB HEF4069UBP 14-lead OT27-1) HEF4069UBD HEF4069UBT HEF4069 7Z84371 BAW62 HEF4069UBPN

    PHILIPS OQ 0501

    Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
    Text: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body


    OCR Scan     		PDF DIP14 DIP16 DIP18 DIP20 DIP24 DIP28 DIP40 LQFP32 PHILIPS OQ 0501 philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips