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    SOT117 Price and Stock

    Nexperia NXS0104GU12X

    Translation - Voltage Levels NXS0104GU12/SOT1174/XQFN12
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI NXS0104GU12X Reel 12,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.267
    		Buy Now

    Nexperia PUSB3FR4Z

    ESD Protection Diodes / TVS Diodes PUSB3FR4/SOT1176/XSON10
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PUSB3FR4Z Reel 5,000 5,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.07
    		Buy Now

    Nexperia NXB0104GU12X

    Translation - Voltage Levels NXB0104GU12/SOT1174/XQFN12
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI NXB0104GU12X Reel 4,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.267
    		Buy Now

    Nexperia IP4283CZ10-TBR,115

    ESD Protection Diodes / TVS Diodes DIODE-ESD SOT1165/XSON10
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI IP4283CZ10-TBR,115 Reel 10,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.102
    		Buy Now

    Nexperia PESD4USB5U-TBSX

    ESD Protection Diodes / TVS Diodes PESD4USB5U-TBS/SOT1176D/DFN251
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PESD4USB5U-TBSX Reel 8,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.113
    		Buy Now
    Find more SOT117 price and stock on Findchips.com

    SOT117 Datasheets (21)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT117-1 Philips Semiconductors Dip28: Plastic Dual In-line Package 28 Leads (600 Mil) Original PDF
    SOT1172-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT1172-2 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT1172-2_118 NXP Semiconductors HTSSOP28; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT1172-3 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT1173-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based Original PDF
    SOT1174-1 NXP Semiconductors Plastic, extremely thin quad flat package; no leads 12 terminals Original PDF
    SOT1174-1 NXP Semiconductors Footprint for reflow soldering SOT1174-1 Original PDF
    SOT1174-1 NXP Semiconductors SOT1174 _T1_ packing info 12NC ending 115 Original PDF
    SOT1174-1_115 NXP Semiconductors Standard product orientation 12NC ending 115 Original PDF
    SOT1175-1 NXP Semiconductors Plastic small outline package; 7 leads; body width 3.9 mm Original PDF
    SOT1176-1 NXP Semiconductors Reflow soldering footprint1176-1 Original PDF
    SOT1176-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals Original PDF
    SOT1177-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals Original PDF
    SOT1178-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 9 terminals Original PDF
    SOT1178-1 NXP Semiconductors Footprint for reflow soldering SOT1178-1 Original PDF
    SOT1179-1 NXP Semiconductors Footprint for reflow soldering SOT1179-1 Original PDF
    SOT1179-1 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 12 terminals Original PDF
    SOT1179-1_135 NXP Semiconductors HVSON12; reel pack; standard product orientation; 12NCending 135 Original PDF
    SOT1179-2 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm Original PDF

    SOT117 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    HVSON12

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-1 Gx D 0.105 P C SPx nSPx SPy Hy Gy SLy nSPy By Ay SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit


    Original     		PDF HVSON12 OT1179-1 sot1179-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of XQFN12 package SOT1174-1 2.25 2 0.45 0.22 CU 11x 0.32 CU (1×) 0.45 (1×) 2.55 1 CU 2.05 2.3 CU 0.4 (7×) 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper


    Original     		PDF XQFN12 OT1174-1 sot1174-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w


    Original     		PDF HTSSOP28: OT1172-2 MO-153 sot1172-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.0 x 1.7 x 0.5 mm SOT1177-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y1 C y L1 k L 10 5 1 Dimensions Unit 1


    Original     		PDF XSON10: OT1177-1 sot1177-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-2 X A B D A E A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L K Eh 12


    Original     		PDF HVSON12: OT1179-2 MO-229 sot1179-2

    Untitled

    Abstract: No abstract text available
    Text: SOT1174-1 Standard product orientation 12NC ending 115 Rev. 01 — 18 Oct 2010 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1174 115 180 x 8


    Original     		PDF OT1174-1 OT1174 OT1174

    Untitled

    Abstract: No abstract text available
    Text: Package outline XQFN12: plastic, extremely thin quad flat package; no leads; 12 terminals; body 1.70 x 2.00 x 0.50 mm SOT1174-1 X B D A terminal 1 index area E A A1 A3 detail X ∅v ∅w b 5 C C A B C y1 C y 7 e1 e 1 11 terminal 1 index area L1 L 1 2 mm scale


    Original     		PDF XQFN12: OT1174-1 MO-288 sot1174-1

    DIP28

    Abstract: dip-28 DIP28- 600 sot117 600MIL
    Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil 1995 Jan 14 1 SOT117-1


    Original     		PDF DIP28: OT117-1 DIP28 dip-28 DIP28- 600 sot117 600MIL

    sot117

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)


    Original     		PDF DIP28: OT117-2 OT117-2 MS-011AB sot117

    MS-011

    Abstract: DIP28
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)


    Original     		PDF DIP28: OT117-2 051G06 MS-011 SC-510-28 MS-011 DIP28

    DIP28 package

    Abstract: SC-510-28 DIP28
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane handbook, full pagewidthdual in-line package; 28 leads 600 mil DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP28: OT117-1 051G05 MO-015 SC-510-28 DIP28 package SC-510-28 DIP28

    sot1178

    Abstract: No abstract text available
    Text: Package outline Footprint information for reflow soldering of XSON9 package SOT1178-1 Hx C Hy Ay By 0.025 D P 0.025 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF OT1178-1 sot1178-1 sot1178

    sot1176

    Abstract: 02K1
    Text: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1 x 2.5 x 0.5 mm SOT1176-1 X B D A E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 5 C C A B C y1 C y L1 k L 10 6 1 Dimensions Unit 1


    Original     		PDF XSON10: OT1176-1 OT1176-1 sot1176-1 sot1176 02K1

    051G05

    Abstract: DIP28
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP28: OT117-1 051G05 MO-015 SC-510-28 051G05 DIP28

    HTSSOP28

    Abstract: No abstract text available
    Text: SOT1172-2 HTSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 12 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


    Original     		PDF OT1172-2 HTSSOP28; 001aak603 OT1172 HTSSOP28

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-1 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w


    Original     		PDF HTSSOP28: OT1172-1 MO-153 sot1172-1

    stencil

    Abstract: XSON10
    Text: Reflow soldering footprint Footprint information for reflow soldering of XSON10 package SOT1176-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF XSON10 OT1176-1 sot1176-1 stencil

    DIP28

    Abstract: DIP28- 600
    Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil ; long body 1995 Mar 11 5-6 SOT117-2


    Original     		PDF DIP28: OT117-2 DIP28 DIP28- 600

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-1 X A B D E A A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L Eh 12 7


    Original     		PDF HVSON12: OT1179-1 MO-229 sot1179-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-3 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 e bp 14


    Original     		PDF HTSSOP28: OT1172-3 MO-153 sot1172-3

    Untitled

    Abstract: No abstract text available
    Text: Package outline SO7: plastic small outline package; 7 leads; body width 3.9 mm SOT1175-1 D A E X c HE y v A Z 7 5 Q A2 A A1 A3 θ pin 1 index Lp L 1 4 e detail X w bp 2.5 5 mm scale Dimensions Unit mm A A1 A2 A3 bp c max 1.75 0.250 1.45 0.49 0.25 nom 0.175 1.35 0.25 0.40 0.20


    Original     		PDF OT1175-1 sot1175-1

    sot1178

    Abstract: No abstract text available
    Text: Package outline XSON9: plastic extremely thin small outline package; no leads 9 terminals; body 1 x 2.1 x 0.5 mm SOT1178-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 3 5 C C A B C v w b y1 C y L k 9 6 0.5 Dimensions Unit 1


    Original     		PDF OT1178-1 OT1178-1 sot1178-1 sot1178

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-2 Gx D 0.105 P C nSPx SPx nSPy Hy Gy SLy SPy By Ay SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By


    Original     		PDF HVSON12 OT1179-2 sot1179-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN64R: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 0.8 mm A B D SOT1173-1 terminal 1 index area E A detail X e1 e L1 L 1/2 e 17 32 C C A B C v w b y y1 C 33 16 e e2 Eh 1/2 e 1 terminal 1


    Original     		PDF HVQFN64R: OT1173-1 sot1173-1