Untitled
Abstract: No abstract text available
Text: RFCS - Solder Reflow Assembly Instructions www.vishay.com Vishay Electro-Films RFCS - Solder Reflow Assembly Instructions RECOMMENDED SOLDERING PROFILE Sn 96.5 Ag 3 Cu 0.5 lead (Pb -free solder) 250 Not to scale. For reference only 3 200 Temperature (°C)
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IXAN0059
Abstract: 95Sn semiconductor power devices diode 47c
Text: IXAN0059 Lead Free Solder Reflow for Semiconductor Power Devices The solders used in the Electronic Industry are rapidly converting from Tin/Lead Sn/Pb solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these requirements are controlled by laws and
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IXAN0059
IXAN0059
95Sn
semiconductor power devices
diode 47c
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SZZA024
Abstract: ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5
Text: Application Report SZZA024 - January 2001 Evaluation of Nickel/Palladium-Finished ICs With Lead-Free Solder Alloys Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT A nickel/palladium Ni/Pd lead finish for integrated circuits (IC) was introduced in 1989. In
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SZZA024
ic ZN 415
ic ZN 415 datasheet
CU-106A
IPC-A-610C
91Sn
Cu6Sn5
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250 micro solder ball
Abstract: garrou fujitsu reflow profile SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY heller 1700 39ag
Text: Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability V. Patwardhan, N. Kelkar, and L. Nguyen National Semiconductor Corporation P.O. Box 58090 M/S 19-100 Santa Clara, California 95052 Abstract This paper discusses the reliability testing results of a
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Kester sn62 tinning
Abstract: 6-SN62-575 6-SN62 conveyor sn62
Text: Reflow Soldering of Lead-less LTCC Products AN-40-004 AN-40-004 Rev.: OR M87588 06/30/03 File: AN40004.doc This document and its contents are the property of Mini-Circuits. Page 1 of 4 Table of Contents 1.0 2.0 3.0 Introduction Solders suitable for lead-less LTCC
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AN-40-004
AN-40-004
M87588
AN40004
6-SN62-575
Kester sn62 tinning
6-SN62
conveyor
sn62
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JIS-C-6429
Abstract: MF-R110-2 USMD1210 MF-R110-2-99 MF-MSMD equivalent alternative ENIG PTC 965
Text: Bourns Lead Free ® Multifuse Polymer PTCs Circuit Protection Solutions 1 Table Of Contents Table Of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
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SS-00254
2002/95/EC
e/MF0406
JIS-C-6429
MF-R110-2
USMD1210
MF-R110-2-99
MF-MSMD equivalent
alternative ENIG
PTC 965
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Untitled
Abstract: No abstract text available
Text: 1 20 August, 2013 Agenda Motivation: Environmental and health endangerment of lead. Situation: Lead & the use in Electronics Status on legislation DA5 Structure and Project: 2 Cooperations and partners Requirements, Applications and Approaches for possible solutions
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SN100C
Abstract: Water soluble
Text: WS482 Water Soluble Cored Wire Solder Features: - Halide-Free - High Activity Level - Good Thermal Transfer - Good Wetting Properties - For Standard and High-Temperature Applications - Extended Cleaning Times, Safe Up to 2 to 3 Days Description: WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste
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WS482
WS482
ISO9001
45-micron
SN100C
Water soluble
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Heraeus paste profile
Abstract: PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus
Text: Application Note June 21, 2008 Document No. : AN007-0001, Ver. 1.21 PDF Name: TLynx_Mfgr_Guide.pdf Application Guidelines for Non-Isolated Converters AN07-001: Manufacturing Guidelines for TLynx Series Modules Introduction The TLynxTM series modules are SMT DC/DC nonisolated converters, that feature a pinless interconnect
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AN007-0001,
AN07-001:
Heraeus paste profile
PD922
reflow profile FOR LGA COMPONENTS
J-STD-033
J-STD-033A
hot air bga
IPC-9701
heraeus
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amd (BGA) replacement alloy
Abstract: Sn-58Bi NOKIA CIRCUIT PCB SIEMENS WASHING machine TOSHIBA GLASS MOLD washing machine bosch circuit diagram visteon sony antimony
Text: Lead Pb -Free Packaging Strategy 2000− −2003 . . JUNE 2000 . . . . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same but have different
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SAT-5100
Abstract: c5191
Text: Jan, 2003 Fujitsu Components Limited Relay R&D department FUJITSU COMPONENTS LIMITED Jan, 2003 Schedule Replace current relay solder with lead-free solder by June 2003. Fujitsu’s Third Action Program reference Objective : Fujitsu Objective : Fujitsu Group
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1000cycle
2000cycle
SAT-5100
c5191
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zxczm800
Abstract: SDPB1K10NB-7 zds1002 1N4007 MINI MELF ZXCZA200 SBR40S45CT ZXCZM800QPATR ZLNB153X8TC zxnb4200 zetex BSS138TA
Text: Corporate Address: 15660 N. Dallas Parkway, Suite 850, Dallas, TX 75248 USA Re: End of Vehicle Life Directive EVL 2000/53/EC and Annex II (EVL II) 2000/53/EC Restrictions of Hazardous Substances Directive (ROHS) 2002/95/EC Waste Electrical and Electronic Equipment (WEEE)
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2000/53/EC
2000/53/EC
2002/95/EC
SJ/T11363-2006
zxczm800
SDPB1K10NB-7
zds1002
1N4007 MINI MELF
ZXCZA200
SBR40S45CT
ZXCZM800QPATR
ZLNB153X8TC
zxnb4200
zetex BSS138TA
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AMD reflow soldering profile BGA
Abstract: visteon ford visteon eutectic 157 SMALL ELECTRONICS PROJECTS AMD reflow BGA ROHS nortel meridian Delco SIEMENS WASHING machine TOSHIBA GLASS MOLD
Text: Lead Pb -Free Packaging Strategy 2000− −2003 . . . . . JUNE 2000 (DECEMBER 2001 Update) . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that the words “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same, although they have
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MICRON 63
Abstract: SOLDERING REFLOW smt
Text: TN-00-15: Recommended Soldering Parameters Introduction Technical Note Recommended Soldering Parameters Introduction This technical note defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. Using these techniques and parameters will prevent
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TN-00-15:
09005aef809140c7/Source:
09005aef80914088
MICRON 63
SOLDERING REFLOW smt
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Senju oz
Abstract: senju solder alloys Howard H. Manko Senju
Text: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Page-1 Walsin Technology Corporation Background Pb free solder material was started in 1995. A composition of Sn-4Bi-2Ag-0.5Cu-0.1Ge was announced in July
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SnBiAg
Abstract: senju solder paste WALSIN philips mlcc Senju flux Senju oz
Text: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Version 03 Page-1 Walsin Technology Corporation Background Sn/Pb Phase Diagram Engineering version Pb free solder material was started in 1995. A
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OZ-7085-340F-32-12)
2Ag-20In
SnBiAg
senju solder paste
WALSIN
philips mlcc
Senju flux
Senju oz
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JEDEC J-STD-020d.1
Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
Text: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined
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J-STD-020D
APPNOTE-007
JEDEC J-STD-020d.1
sac305
SAC305 reflow profile
SAC305 solder paste
sac305 kester
SAC305 reflow
Kester
sn-pb-ag solder preform
SAC-305
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X-RAY INSPECTION
Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as
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AN2265/D
26mm-0
X-RAY INSPECTION
LGA Application Notes motorola
12x12mm BGA package thermal resistance
LGA Application Notes
pitch 0.4mm BGA
solder wire 0.3 mm
lga components
s3527
LGA PACKAGE thermal resistance
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ST-03-Z-06E
Abstract: SHARP IC sharp lead free identification Z06E LH28F800BJE-PTTLZ1 QFN leadframe ST03Z
Text: Product Change Notification Type of Notification: Standalone IC products will incorporate Lead Pb -Free terminals ISSUE DATE LAST BUY DATE NOTIFICATION NO. LAST SHIP DATE January 23, 2004 — ST-03-Z-06E — This is to advise you that the following product(s) are being changed.
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ST-03-Z-06E
ST-03-Z-06E
SHARP IC
sharp lead free identification
Z06E
LH28F800BJE-PTTLZ1
QFN leadframe
ST03Z
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mg 5473
Abstract: No abstract text available
Text: Package Details SOT-223C Case Mechanical Drawing Lead Code: Part Marking: Full Part Number Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm R2 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SOT-223C Case
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OT-223C
EIA-481-1-A
mg 5473
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bt 1690
Abstract: FBG900
Text: 100% Material Declaration Data Sheet for 7 Series FBG900 PK546 v1.1 November 2, 2012 Average Weight: 3.7865g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis
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FBG900
PK546
7865g
7440-31-5ease.
bt 1690
FBG900
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FBG676
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for 7 Series FBG676 PK552 v1.1 November 16, 2012 Average Weight: 2.9376g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis
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FBG676
PK552
9376g
7440-5ease.
FBG676
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FFG1761
Abstract: AI203 PB SN SOLDER Solder Paste, Indium, Type 3
Text: 100% Material Declaration Data Sheet for 7 Series FFG1761 PK554 v1.1 October 26, 2012 Average Weight: 20.7610 g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis
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FFG1761
PK554
FFG1761
AI203
PB SN SOLDER
Solder Paste, Indium, Type 3
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FFG900
Abstract: bt 1690 Indium tin oxide
Text: 100% Material Declaration Data Sheet for 7 Series FFG900 PK524 v1.2 October 12, 2012 Average Weight: 11.5795g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis
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FFG900
PK524
5795g
FFG900
bt 1690
Indium tin oxide
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