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    SZZA024

    Abstract: ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5
    Text: Application Report SZZA024 - January 2001 Evaluation of Nickel/Palladium-Finished ICs With Lead-Free Solder Alloys Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT A nickel/palladium Ni/Pd lead finish for integrated circuits (IC) was introduced in 1989. In


    Original     		PDF SZZA024 ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5

    sn-pb-ag solder paste

    Abstract: 62Sn36Pb2Ag IPC-A-610C
    Text: Application Report SZZA035 - October 2002 Board-Mount Evaluation of Tin-Plated Component Leads Douglas W. Romm, Donald C. Abbott, Bernhard Lange, and Muhammad Khan Standard Linear & Logic ABSTRACT The solderability performance of tin Sn -plated integrated circuit (IC) component leads is


    Original     		PDF SZZA035 sn-pb-ag solder paste 62Sn36Pb2Ag IPC-A-610C

    szza026

    Abstract: Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75
    Text: Application Report SZZA026 – July 2001 Evaluation of Nickel/Palladium/Gold-Finished Surface-Mount Integrated Circuits Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT Texas Instruments has introduced a refined version of its nickel/palladium NiPd finish for


    Original     		PDF SZZA026 40-billion szza026 Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75