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SIGC158T170R3 Price and Stock

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Infineon Technologies AG SIGC158T170R3X1SA2 IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC158T170R3X1SA2)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	SIGC158T170R3X1SA2	Waffle Pack			20	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Infineon Technologies AG SIGC158T170R3EX1SA3 IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC158T170R3EX1SA)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	SIGC158T170R3EX1SA3	Waffle Pack		20 Weeks	1,431	1 - 10 - 100 - 1000 - 10000 $21.65362	Buy Now

SIGC158T170R3 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SIGC158T170R3		Infineon Technologies	IGBT Chip		Original	PDF
SIGC158T170R3		Infineon Technologies	For drive application, Trench-and Fieldstop technology		Original	PDF

SIGC158T170R3 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: SIGC158T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling Chip Type SIGC158T170R3E VCE IC 1700V 125A This chip is used for:  power modules	Original	PDF	SIGC158T170R3E L7801M, L7801T, L7801E,
SIGC158T170R3 Abstract: No abstract text available Text: SIGC158T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC158T170R3 VCE ICn 1700V 125A This chip is used for: • power module	Original	PDF	SIGC158T170R3 Q67050A4227-A101 SIGC158T170R3
Untitled Abstract: No abstract text available Text: SIGC158T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC158T170R3E VCE IC 1700V 125A This chip is used for: • power modules	Original	PDF	SIGC158T170R3E L7801T,
Untitled Abstract: No abstract text available Text: SIGC158T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC158T170R3 VCE ICn 1700V 125A This chip is used for: • power module	Original	PDF	SIGC158T170R3 Q67050A4227-A101
SIGC158T170R3 Abstract: No abstract text available Text: Preliminary SIGC158T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC158T170R3 VCE ICn 1700V 125A This chip is used for:	Original	PDF	SIGC158T170R3 Q67050A4227-A101 SIGC158T170R3