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    R1766 Price and Stock

    Bimba Manufacturing Company NR-176.625-RP

    Cylinder, O.L., Non-Rot,1-1/2In Bore; Stroke: 6.625In; Rev Act Rear Pivot Mt | Bimba NR-176.625-RP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS NR-176.625-RP Bulk 5 Weeks 1
    • 1 $197.6
    • 10 $197.6
    • 100 $197.6
    • 1000 $197.6
    • 10000 $197.6
    		Get Quote

    Bimba Manufacturing Company HLSR-176.625-DPKWY

    Cylinder, Hydraulic, O.L., Low Pressure HL; No Magnet; Chrome Plated SS Rod (SR | Bimba HLSR-176.625-DPKWY
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS HLSR-176.625-DPKWY Bulk 5 Weeks 1
    • 1 $129.25
    • 10 $129.25
    • 100 $129.25
    • 1000 $129.25
    • 10000 $129.25
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    Bourns Inc SMCJ58CA

    ESD Protection Diodes / TVS Diodes 58volts 5uA 16 Amps Bi-Dir
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI SMCJ58CA Reel 36,000 3,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.201
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    Vishay Intertechnologies TNPW08053K01BEEA

    Thin Film Resistors - SMD 3.01Kohms .1% 25ppm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI TNPW08053K01BEEA Reel 15,000 5,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.13
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    Molex 0527450897

    FFC & FPC Connectors RA SMT ZIF TOP 8P GOLD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 0527450897 Reel 2,000 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $0.592
    • 10000 $0.592
    		Buy Now
    Find more R1766 price and stock on Findchips.com

    R1766 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    R1766 Samsung Electronics Original PDF
    R1766(T) Samsung Electronics Original PDF

    R1766 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    EMC4000

    Abstract: MEC5004 MEC5004 ECE5018 ECE5018 dell inverter pinout isl6260 pinout dell battery HAL00 nvg72m macallan IV SIO pinout
    Text: A B C D E COMPAL CONFIDENTIAL 1 MODEL NAME : HAL00 PCB NO : LA-2792 COMPAL P/N : 45135731L01 1 Travis DIS Schematics Document 2 2 uFCPGA Mobile Yonah Intel Calistoga + ICH7M 2006-01-20 REV : 1.0 (DELL: A00) 3 3 4 4 DELL CONFIDENTIAL/PROPRIETARY MB PCB Part Number


    Original     		PDF HAL00 LA-2792 45135731L01 DAA0000050L 45135731L01 DAA0000051L item19. LA-2792 EMC4000 MEC5004 MEC5004 ECE5018 ECE5018 dell inverter pinout isl6260 pinout dell battery nvg72m macallan IV SIO pinout

    3331p

    Abstract: cpu la 100u 1p0 LA-3331P R1851 NVIDIA G84 mxm-III Socket AM2 Compal Electronics R1651 c1583
    Text: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 2006-11-10 REV:0.4 4 4 Compal Secret Data Security Classification 2006/04/13 Issued Date 2006/06/30 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


    Original     		PDF LA-3331P 3331p cpu la 100u 1p0 LA-3331P R1851 NVIDIA G84 mxm-III Socket AM2 Compal Electronics R1651 c1583

    R1766

    Abstract: R-1766 gg 42 R-1661 TM650 fr4 94v0
    Text: 多層プリント配線板用材料 ガラスエポキシマルチ （FR-4） コア材 （両面銅張） R-1766 プリプレグ R-1661 ガラス布基材エポキシ樹脂多層プリント配線板用材料 •特長 ●二次積層成形性が良く層間接着力に優れています。


    Original     		PDF R-1766 R-1661 020mm 220mm 012mm 018mm 035mm 070mm R1766 R-1766 gg 42 R-1661 TM650 fr4 94v0

    94v0

    Abstract: m 94v-0 94v-0 GE4F 94-V0 94VTM-0 JIS PP7F R-8700 R1551 94v-0 cem-3
    Text: 材料分類別品種一覧 分類 商品名 狭ピッチ対応ハロゲンフリー半導体パッケージ基板用材料 狭ピッチ対応ハロゲンフリー半導体パッケージ基板用材料 ― ― ― ― 狭ピッチ対応ハロゲンフリー半導体パッケージ基板用材料


    Original     		PDF R-1515H R-1515B R-1515S R-1410S R-5715E R-5775 R-5670 R-5725 R-5620 R-2125 94v0 m 94v-0 94v-0 GE4F 94-V0 94VTM-0 JIS PP7F R-8700 R1551 94v-0 cem-3

    JIS-C-6481

    Abstract: JISC6481 R1766 R1766T R-1766 C648 TM650 94v0 080
    Text: 多層プリント配線板用材料 高耐熱ガラスエポキシマルチ （FR-4） コア材 （両面銅張） R-1766（T） プリプレグ R-1661（T） ガラス布基材エポキシ樹脂多層プリント配線板用材料 •特長 ■用途


    Original     		PDF R-1766 R-1661 FR-41 020mm 012mm 018mm 035mm 070mm R-1766 JIS-C-6481 JISC6481 R1766 R1766T C648 TM650 94v0 080

    AR8112

    Abstract: ICS9LPRS387BKLF SLG8SP556V KB926Qf atheros AR8121 LS-4493P PFAF250E128 4835b kb926 FBMA-L11-322513-201LMA40T
    Text: A B C D E 1 1 Compal Confidential 2 2 KAL90/KALH0 M/B Schematics Document Intel Penryn Processor with Cantiga + DDRII + ICH9M 2008-12-17 3 3 REV:1.0 4 4 2008/11/10 Issued Date Compal Electronics, Inc. Compal Secret Data Security Classification 2008/11/17 Deciphered Date


    Original     		PDF KAL90/KALH0 kAL90KALH0 AR8112 ICS9LPRS387BKLF SLG8SP556V KB926Qf atheros AR8121 LS-4493P PFAF250E128 4835b kb926 FBMA-L11-322513-201LMA40T

    HP Keyboard KB 0316

    Abstract: kbc 1070 nu kbc 1070 HP Keyboard KB 0316 connector la-3261p G548A2 MAX8776 isl6260 820UE FCBGA-1299
    Text: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 IBT00 LA-3261P UMA 2007-03-28 REV:1A MV2 4 4 Compal Secret Data Security Classification 2006/02/13 Issued Date 2006/03/10 Deciphered Date


    Original     		PDF IBT00 LA-3261P LA3261P HP Keyboard KB 0316 kbc 1070 nu kbc 1070 HP Keyboard KB 0316 connector G548A2 MAX8776 isl6260 820UE FCBGA-1299

    c1583

    Abstract: cpu la 100u 1p0 LA-3331P SST25LF080A_SO8-200mil bq24703 R1851 MTX-A1 isl6260 R5C853 compal la-3331p
    Text: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 2007-01-16 REV:0.5 4 4 Compal Secret Data Security Classification 2006/04/13 Issued Date 2006/06/30 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


    Original     		PDF LA-3331P c1583 cpu la 100u 1p0 LA-3331P SST25LF080A_SO8-200mil bq24703 R1851 MTX-A1 isl6260 R5C853 compal la-3331p

    LA-4491P

    Abstract: A4491 AR8112 C2078 C2052 SLG8SP556V kal90 la-4491p C2096 JAL90 AMD dual gpu schematics
    Text: A B C D E 1 1 Compal Confidential 2 2 KAL90 M/B Schematics Document Intel Penryn Processor with Cantiga + DDRII + ICH9M 2008-10-30 3 3 REV:1.0 4 4 2008/03/28 Issued Date Compal Electronics, Inc. Compal Secret Data Security Classification 2008/09/20 Deciphered Date


    Original     		PDF KAL90 A4491 A4491 LA-4491P AR8112 C2078 C2052 SLG8SP556V kal90 la-4491p C2096 JAL90 AMD dual gpu schematics

    R1766

    Abstract: No abstract text available
    Text: Data Sheet NE5550979A R09DS0031EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power LDMOS FET FEATURES • • • • • High Output Power : Pout = 39.5 dBm TYP. VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm High power added efficiency : ηadd = 66% TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm)


    Original     		PDF NE5550979A R09DS0031EJ0300 IEC61000-4-2, NE5550979A NE5550979A-A R1766

    r1566

    Abstract: R-1566 R1766 R-1551 R1551 TM650 24C24
    Text: ハロゲン系難燃剤を 使用していません。 （当社現行商品 R-1766比） ガラス布基材エポキシ樹脂多層プリント配線板用材料 •特長 ■用途 ●ハロゲン化合物アンチモンを使用せず94Ｖ-0達成 しています。


    Original     		PDF R-1566 R-1551 R-1766 020mm 220mm 012mm 018mm 035mm 070mm r1566 R-1566 R1766 R-1551 R1551 TM650 24C24

    SN0806081

    Abstract: LS-4495P C1900 PCB SN0806081RHBR LS-4493P AR8121-AL1E LS-4921P kb926 SLG8SP556V AR8131-AL1E
    Text: A B C D E 1 1 Compal Confidential 2 2 KALH0 /KAL90+ /KALG0 M/B Schematics Document Intel Penryn Processor with Cantiga + DDRIII + ICH9M 2009-3-4 3 3 REV:1.0 4 4 2008/11/24 Issued Date 2009/12/31 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


    Original     		PDF /KAL90+ KAL90 SN0806081 LS-4495P C1900 PCB SN0806081RHBR LS-4493P AR8121-AL1E LS-4921P kb926 SLG8SP556V AR8131-AL1E

    F3J inverter board

    Abstract: D9302 it8511te F3J inverter IT8511 a2051 asus c5121 00 F3J INVERTER CABLE Intel t9300
    Text: 5 Block Diagram 61 02 System Setting 62 C * 63 * 04_CPU-Merom HOST 64 ISA ROM 05 05_CPU-Merom(PWR) 65 SPI ROM * 66 B A GDDR2 32Mx16 x4 07_CRESTLINE(HOST) 67 * 08 08_CRESTLINE(DMI & CFG) 68 DC & BAT IN 09 09_CRESTLINE(GRAPHIC) 69 * 10 10_CRESTLINE(DDR2) 70


    Original     		PDF M7X/66-M GEN-ICS9LPR363AGLF-T 05G001405010 GPIO12 C2940 R1761 F3J inverter board D9302 it8511te F3J inverter IT8511 a2051 asus c5121 00 F3J INVERTER CABLE Intel t9300

    74n7

    Abstract: R1766T
    Text: Data Sheet NE5550234 R09DS0039EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power MOS FET FEATURES • • • • • High Output Power : Pout = 33.0 dBm TYP. VDS = 7.5 V, IDset = 40 mA, f = 460 MHz, Pin = 15 dBm High power added efficiency : ηadd = 68% TYP. (VDS = 7.5 V, IDset = 40 mA, f = 460 MHz, Pin = 15 dBm)


    Original     		PDF NE5550234 R09DS0039EJ0300 NE5550234 NE5550234-AZ 74n7 R1766T

    kbc 1070 nu

    Abstract: SMSC KBC 1021 HP Keyboard KB 0316 la-3261p kbc 1070 compal HP multibay R1782 R1453 isl6260
    Text: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 IBT00 LA-3261P UMA 2006-11-16 REV:0.6 SI-2 4 4 Compal Secret Data Security Classification 2006/02/13 Issued Date 2006/03/10 Deciphered Date


    Original     		PDF IBT00 LA-3261P LA3261P kbc 1070 nu SMSC KBC 1021 HP Keyboard KB 0316 kbc 1070 compal HP multibay R1782 R1453 isl6260

    RS1046

    Abstract: Inventec Motherboard ls 36 a02 intel g31 motherboard max1987 42a22 DIMM DDR4 connector Inventec schematic L4004 L1029
    Text: DIAMuunpubis MV B- BUILD FINAL 2008/08/21 Engineer INVENTEC David Du Drawn by David Du R&D CHK Size TITLE A3 DIAMOND DOC CTRL CHK MFG ENGR CHK Changed by EE2 Date Changed Thursday, August 21, 2003 Time Changed 11:19:38 am QA CHK VER A02 Model Number PC8803


    Original     		PDF PC8803 28DDR-SDRAM-4 49MULTIBAY 29ATI-M10-P-1 50USB V/5V/12V) 30ATI-M10-P-2 ATI-M10-P-3 ATI-M10-P-4 11ITCH RS1046 Inventec Motherboard ls 36 a02 intel g31 motherboard max1987 42a22 DIMM DDR4 connector Inventec schematic L4004 L1029

    Panasonic R1766

    Abstract: No abstract text available
    Text: A Business Partner of Renesas Electronics Corporation. Data Sheet NE5550234 R09DS0039EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power MOS FET FEATURES • • • • • High Output Power : Pout = 33.0 dBm TYP. VDS = 7.5 V, IDset = 40 mA, f = 460 MHz, Pin = 15 dBm


    Original     		PDF NE5550234 R09DS0039EJ0300 NE5550234-AZ HS350 R09DS0039EJ0300 NE5550234 Panasonic R1766

    R-4737

    Abstract: R-1755S JISK7113 R1766 R-1755 R4737 R1755S JISK6911 R1755C R1786
    Text: 特性一覧表 《参考値》 【板厚：1.6mm】 （R-1515H, R-1515B, R-1515Sは0.8mm。また貫層耐電圧は全て0.2mmです。） 試験項目 比重 比熱 熱伝導率 ポアソン比 試験方法 JISK6911 DSC法 レーザーフラッシュ法


    Original     		PDF 6mmR-1515H, R-1515B, R-1515S0 JISK6911 JISK7113 R-1515H R-1515B R-1515S R-5715E R-5775 R-4737 R-1755S JISK7113 R1766 R-1755 R4737 R1755S JISK6911 R1755C R1786

    LA-3331P

    Abstract: 3331p compal la-3331p la 3331p nvidia mxm g92 cpu la 100u 1p0 C1278 compal U/25/20/TN26/15/850/compal la-3331p R1734
    Text: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 2007-05-15 REV:1.0 4 4 Compal Secret Data Security Classification 2006/04/13 Issued Date 2006/06/30 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


    Original     		PDF LA-3331P LA-3331P 3331p compal la-3331p la 3331p nvidia mxm g92 cpu la 100u 1p0 C1278 compal U/25/20/TN26/15/850/compal la-3331p R1734

    UL796

    Abstract: fr4 94v0 UL746E FR4105 UL746A R1561 UL746B r1566 GE4F E81336
    Text: •UL規格 材料 部品・中間製品 最終製品 UL （Underwriters Laboratories.lnc） は 積層板 プリント配線板 テレビ・ラジオ 米国の火災保険業者によって、1894年に UL746E UL94 UL796 UL94 UL1492 設立された非営利の試験機関で、火災、盗


    Original     		PDF UL746E UL796 UL1492 UL746A UL746B UL60950 UL796 fr4 94v0 UL746E FR4105 UL746A R1561 UL746B r1566 GE4F E81336

    r1566

    Abstract: R1766 R-1566 175m 0.3mm
    Text: 多層プリント配線板用材料 厚銅箔 プレマルチ •材質 プリント配線板加工において銅箔の熱膨張の影響を受けやす いため低熱膨張である材料を推奨しています。 参考値 材料 熱膨張係数（ppm）厚さ方向（α1 ）


    Original     		PDF R-1566 R-1766 18105m 105175m r1566 R1766 R-1566 175m 0.3mm

    ne5550

    Abstract: No abstract text available
    Text: A Business Partner of Renesas Electronics Corporation. Data Sheet NE5550779A R09DS0040EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power LDMOS FET FEATURES • • • • • High Output Power : Pout = 38.5 dBm TYP. VDS = 7.5 V, IDset = 140 mA, f = 460 MHz, Pin = 25 dBm


    Original     		PDF NE5550779A R09DS0040EJ0300 NE555077 NE5550779A ne5550

    Panasonic R1766

    Abstract: No abstract text available
    Text: A Business Partner of Renesas Electronics Corporation. Data Sheet NE5550979A R09DS0031EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power LDMOS FET FEATURES • • • • • High Output Power : Pout = 39.5 dBm TYP. VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm


    Original     		PDF NE5550979A R09DS0031EJ0300 IEC61000-4-2, Panasonic R1766

    MCL-E-679 hitachi

    Abstract: DS 7408 Doosan MCL-E-679 R1766 doosan 7409 Isola FR406 MCL-E-67 hitachi DS 7408 toshiba TLC LCD toshiba tlc
    Text: Multi Layer Board Multi Layer Board • INTRODUCTION Multi Layer Board MLB technology evolves at a faster pace every day. Multiprocessor scaling and differential impedance requirements, coupled with the need for faster high-performance materials, is driving circuit density and layer counts upward.


    Original     		PDF 135/DSC 130/TMA 150/DSC 145/TMA /100sec C-96/20/65 C-96/20/6 MCL-E-679 hitachi DS 7408 Doosan MCL-E-679 R1766 doosan 7409 Isola FR406 MCL-E-67 hitachi DS 7408 toshiba TLC LCD toshiba tlc