N12106
Abstract: b1393 106 M1 PA-PGA121-02 44H11 78E-12 H-344 91c12
Text: PA-PGA121-02 Map Rev B, 8/8/03 PGA Base A1 18 A2 16 A3 15 A4 37 A5 35 A6 54 A7 56 A8 59 A9 72 A10 74 A11 90 PGA Base A12 108 A13 92 B1 19 B2 17 B3 34 B4 38 B5 36 B6 53 B7 57 B8 61 B9 71 PGA Base B10 75 B11 89 B12 109 B13 93 C1 20 C2 2 C3 1 C4 39 C5 41 C6 55
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PA-PGA121-02
N12106
b1393
106 M1
44H11
78E-12
H-344
91c12
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PGA-121C-A02
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 121 PIN CERAMIC PGA-121C-A02 121-pin ceramic PGA Lead pitch 100mil Pin matrix 13 Sealing method Metal seal PGA-121C-A02 121-pin ceramic PGA (PGA-121C-A02) 0.46 +– 0.05 0.08 DIA (.018 +– .002 .003 ) 2.54 ± 0.25 (.100 ± .010) 27.00 (1.063)
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PGA-121C-A02
100mil
121-pin
PGA-121C-A02)
R121002SC-1-2
PGA-121C-A02
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PGA-121C-A01
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 121 PIN CERAMIC To Top / Package Lineup / Package Index PGA-121C-A01 EIAJ code : PGA121-C-S13D-1 121-pin ceramic PGA Lead pitch 100 mil Pin matrix 13 Sealing method Metal seal PGA-121C-A01 121-pin ceramic PGA
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PGA-121C-A01
HPGA121-C-S13D-1
121-pin
PGA-121C-A01)
R121001SC-4-3
PGA-121C-A01
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SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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LCC-26P-M09
LCC-28P-M04
LCC-28P-M05
LCC-28P-M06
LCC-28P-M07
LCC-28C-A04
LCC-32P-M03
LCC-40P-M01
LCC-42P-M01
SMD MARKING CODE 071 A01
smd code 38P
LGA 1155 PIN diagram
MARKING CODE SMD IC A08
L QUAD Aluminum nitride
smd marking m05
LGA 1155 Socket PIN diagram
pitch 0.4 QFP 256p
marking code smd fujitsu
Texas Instruments epoxy Sumitomo
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PGA-121C-A01
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 121 PIN CERAMIC PGA-121C-A01 EIAJ code : PGA121-C-S13D-1 121-pin ceramic PGA Lead pitch 100 mil Pin matrix 13 Sealing method Metal seal PGA-121C-A01 121-pin ceramic PGA (PGA-121C-A01) 2.54 ± 0.25
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PGA-121C-A01
HPGA121-C-S13D-1
121-pin
PGA-121C-A01)
R121001SC-4-3
not100
PGA-121C-A01
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PGA-121C-A02
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 121 PIN CERAMIC To Top / Package Lineup / Package Index PGA-121C-A02 121-pin ceramic PGA Lead pitch 100 mil Pin matrix 13 Sealing method Metal seal PGA-121C-A02 121-pin ceramic PGA (PGA-121C-A02) 2.54 ± 0.25
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PGA-121C-A02
121-pin
PGA-121C-A02)
R121002SC-1-2
PGA-121C-A02
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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PGA-121C-A02
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 121 PIN CERAMIC PGA-121C-A02 121-pin ceramic PGA Lead pitch 100 mil Pin matrix 13 Sealing method Metal seal PGA-121C-A02 121-pin ceramic PGA (PGA-121C-A02) 2.54 ± 0.25 (.100 ± .010) 27.00 (1.063)
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PGA-121C-A02
121-pin
PGA-121C-A02)
R121002SC-1-2
PGA-121C-A02
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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PGA-121C-A01
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 121 PIN CERAMIC PGA-121C-A01 EIAJ code : PGA121-C-S13D-1 Lead pitch 100mil Pin matrix 13 Sealing method Metal seal 121-pin ceramic PGA PGA-121C-A01 121-pin ceramic PGA (PGA-121C-A01) 2.54 ± 0.25 (.100 ± .010) 27.00 (1.063) DIA 0.46 ± 0.05
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PGA-121C-A01
HPGA121-C-S13D-1
100mil
121-pin
PGA-121C-A01)
R121001SC-4-3
21001SC-4-3
PGA-121C-A01
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PGA-065-10
Abstract: PGA-114 PGA-076-11
Text: PGA1 ASSMANN sockets - Electronic C om ponents PGA-Flachfassungen mit 6-Lamellenkontaktfeder fur Pin Grid Array PGA-Sockets with 6-beam contact-spring for Pin Grid Array 1 2 ,5 6 ' H ZL 3 G /Z W 1 6 ,8 ; I » * o 8 ’ I W YW W W 2 G/ZW und 3 G/ZW auf Antrags
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MIL-STD-202
PGA-065-10
PGA-114
PGA-076-11
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80387
Abstract: WEITEK 3167 pinout 80387 programmers reference manual 50/weitek pcs
Text: WTL 3167 FLOATING-POINT COPROCESSOR PRELIMINARY DATA June 1988 Features SINGLE-CHIP FLOATING-POINT COPROCESSOR IEEE FORM AT Designed for use with the Intel 80386 Conforms to the IEEE standard format for floating point arithmetic in both single- and double-precision
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121-pin
80387
WEITEK 3167 pinout
80387 programmers reference manual
50/weitek pcs
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ncl 071
Abstract: PGA121 4kx16 ram "saturation flag" INSTRUCTION SET motorola 6800 intel 68000 INSTRUCTION SET motorola 1031 PLCC52 24CCR 6800 intel microprocessor pin diagram
Text: SGS-THOMSON ¿ 5 7 IL itg T T ^ O R O D Ê S ST18930/31 DIGITAL SIGNAL PROCESSOR 80 ns INSTRUCTION CYCLE TIME ‘ 1.2 |i CMOS technology PARALLEL HARVARD ARCHITECTURE SEPARATED PROGRAM AND DATA BUSES THREE DATA BUSES STRUCTURE DUAL EXTERNAL BUSES ONE CYCLE 16-BIT R/W OPERATION ON EX
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ST18930/31
16-BIT
32-BIT
ST18930
ST18931
ncl 071
PGA121
4kx16 ram
"saturation flag"
INSTRUCTION SET motorola 6800
intel 68000 INSTRUCTION SET
motorola 1031
PLCC52
24CCR
6800 intel microprocessor pin diagram
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HD68HCOOOY12
Abstract: HD64400 ad 7137 CY7C9101 8207 siemens MOTOROLA 68012
Text: SOCKETS S E M I-C O N D U C T O R CRO SS REFERENCE AMD Device P/N AM29030 AM29117 AM29325 AM29331 AM 29334 3500 SERIES AM80186 AM80286 A9850 AM95C60 AM 29000 AM29050 RN P/N PGA-146CH3-S PGA-068CH3-S PGA-145AH3-5 PGA-120BH3-S PGA-120BH3-S PGA-169BH3-S PGA-068CH3-S
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AM29030
AM29117
AM29325
AM29331
AM80186
AM80286
A9850
AM95C60
AM29050
PGA-146CH3-S
HD68HCOOOY12
HD64400
ad 7137
CY7C9101
8207 siemens
MOTOROLA 68012
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ttl buffer circuit design
Abstract: PFI0
Text: FEB 8 cP 1981 December 1990 Edition 1.0 •z = PRODUCT PROFILE ET2600VH ECL Gate Array with Mixed ECUTTL I/O DESCRIPTION Fujitsu’s ET2600VH array is manufactured using ultra-high speed LSI circuit design and mass-production techniques developed for use in Fujitsu’s ultra-large and supercomputers.
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ET2600VH
ET2600VH
ET2600VH:
PGA-121
QFP-124
ttl buffer circuit design
PFI0
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PGA-076-11
Abstract: 84 pin PGA socket PQA-133-14 PGA-145
Text: ASSMANN P G A -S o c k e ts Electronic Com ponents PGA-Sockets with 6-beam contact-spring for Pin Grid Array 2 G.'ZW and 3 G/ZW on request PGA are also often needed with irregular numbers of poles or a component part We offer any variant on request as If you cannot find a suitable socket-body to meet your
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MIL-STD-202
PGA-076-11
84 pin PGA socket
PQA-133-14
PGA-145
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