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    PCN0407

    Abstract: FR4 substrate Substrate FR4 epoxy EPC16UC88 EPC16UC88AA
    Text: PROCESS CHANGE NOTIFICATION PCN0407 UFBGA 88 PACKAGE SUBSTRATE CHANGE Change Description: The substrate for the 88 Lead Ultra FineLine BGA package assembled by Sharp will change from polyimide tape to glass epoxy FR4. This change does not affect form, fit, or function.


    Original     		PDF PCN0407 EPC16UC88 EPC16UC88AA. PCN0407 FR4 substrate Substrate FR4 epoxy EPC16UC88AA