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    IPC-7525

    Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
    Text: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in


    Original     		PDF AN-5067 IPC-7525 jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220

    FDMA3023PZ

    Abstract: Bi-Directional P-Channel
    Text: FDMA3023PZ tm Dual P-Channel PowerTrench MOSFET -30 V, -2.9 A, 90 mΩ Features General Description This device is designed specifically as a single package solution for the battery charge switch in cellular handset and other ultra-portable applications. It features two independent


    Original     		PDF FDMA3023PZ FDMA3023PZ Bi-Directional P-Channel

    Untitled

    Abstract: No abstract text available
    Text: FDMA3023PZ Dual P-Channel PowerTrench MOSFET -30 V, -2.9 A, 90 mΩ Features tm General Description This device is designed specifically as a single package solution for the battery charge switch in cellular handset and other ultra-portable applications. It features two independent


    Original     		PDF FDMA3023PZ FDMA3023PZ