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Catalog Datasheet	MFG & Type	PDF	Document Tags
hydrofluoric acid Abstract: HPND0001 HPND-0001 HPND-0002 thermocompression Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression	Original	PDF	HPND-0001 HPND-0002 HPND-000X hydrofluoric acid HPND0001 HPND-0001 HPND-0002 thermocompression
hydrofluoric acid Abstract: thermocompression HPND0001 HPND-0001 HPND-0002 Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression	Original	PDF	HPND-0001 HPND-0002 HPND-000X 5965-9143E hydrofluoric acid thermocompression HPND0001 HPND-0001 HPND-0002
hp 3080 diode Abstract: No abstract text available Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression	Original	PDF	HPND-0001 HPND-0002 HPND-000X 5965-9143E hp 3080 diode
Untitled Abstract: No abstract text available Text: • 4 M M 7 5 Ô 4 G D O T b ñ ? OTO ■ H P A HEWLETT-PACKARD/ CMPNTS blE D m HEW LETT PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 Features • Thermocompression/ Thermosonically Bondable	OCR Scan	PDF	HPND-0001 HPND-0002 HPND-0003 HPND000X
Untitled Abstract: No abstract text available Text: W ß%H EW L E T T 1“KM PA CK A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ ThermosonicaUy Bondable These PIN/NIP diode chips are specifically designed for hybrid	OCR Scan	PDF	HPND-0001 HPND-0002 HPND-000X
HPND0003 Abstract: HPND-0003 Text: W fipi H E W LE T T mL'HM P A C K A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 F eatures • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization	OCR Scan	PDF	HPND-0001 HPND-0002 HPND-0003 HPND000X HPND0003 HPND-0003
HRMA-0470B Abstract: Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61 Text: Whal HEWLETT \HrJk PACKARD Communications Components Designer’s Catalog, GaAs and Silicon Products A Brief Sketch Hewlett-Packard is one of the world’s leading designers and manufacturers of RF and microwave semiconductors, optoelectronic, and fiber optic	OCR Scan	PDF	E-28230 S-164 CH-8902 HRMA-0470B Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61
Untitled Abstract: No abstract text available Text: What H E W L E T T * mLliM PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features D escription • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization	OCR Scan	PDF	HPND-0001 HPND-0002 HPND-000X