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    S 0319

    Abstract: CRM1525D
    Text: 12/17/2003 RELIABILITY REPORT FOR DS3146, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS3146, 30C/60% S 0319 CRM1525D

    nitto GE

    Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark


    Original     		PDF A1008-07 TEBGA-580 facilitSD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 SXVX-110BHG SXVX-200BHG SXVX-210BHG nitto GE GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS

    J-STD-020

    Abstract: HC100-XJ JSTD-020 NITTO HC-100-XJAA-M 94V-0 0303
    Text: 05/21/03 RELIABILITY REPORT FOR DS4000, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS4000, JESD78, J-STD-020 HC100-XJ JSTD-020 NITTO HC-100-XJAA-M 94V-0 0303

    NITTO HC-100-XJAA-M

    Abstract: CRM1525D HC-100XJAA-M
    Text: 12/17/2003 RELIABILITY REPORT FOR DS3148, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS3148, 30C/60% NITTO HC-100-XJAA-M CRM1525D HC-100XJAA-M

    PCN0415

    Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking
    Text: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.


    Original     		PDF PCN0415 HC100-XJ HC100-XJAA PCN0415 Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking

    NITTO HC-100-XJAA-M

    Abstract: CRM1525D HC100-XJ HC100 HC-100-XJAA-M HC100-XJAA JEDEC JESD22-B117
    Text: 12/17/2003 RELIABILITY REPORT FOR DS31412, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS31412, 30C/60% NITTO HC-100-XJAA-M CRM1525D HC100-XJ HC100 HC-100-XJAA-M HC100-XJAA JEDEC JESD22-B117

    ABLEBOND

    Abstract: M28945-13 HC100 HC100XJAA M28945 Nitto mold compound 28237-12 M28950-13 Amkor mold compound
    Text: August 7, 2009 CN 080709 Customer Notification Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the parts listed below. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and


    Original     		PDF HC100XJAA CX28398-27 M28947-13 M28945-13 M28950-13 M28946-13 ABLEBOND M28945-13 HC100 M28945 Nitto mold compound 28237-12 M28950-13 Amkor mold compound

    R7181-38

    Abstract: ablebond HC100 HC100XJAA mold compound Compound HC100-XJAA
    Text: August 12, 2009 CN 081209 Customer Notification R7181-38 Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the R7181-38. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and


    Original     		PDF R7181-38 R7181-38. HC100XJAA R7181-39. ablebond HC100 mold compound Compound HC100-XJAA