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Catalog Datasheet	MFG & Type	PDF	Document Tags
LBGA196 Abstract: AN-1205 CM12 Signal Path Designer Text: National Semiconductor Application Note 1205 August 2001 Introduction conductors. Both DC and AC Inductance can be provided for packages. To determine which inductance is appropriate for your application, please see the section ’Frequency limitations of R-L-C parameters’.	Original	PDF
NAND FLASH BGA Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71 Text: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction	Original	PDF	FBGA69) IR250 NAND FLASH BGA BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
AN-1205 Abstract: CM12 Signal Path Designer Text: National Semiconductor Application Note 1205 August 2001 INTRODUCTION This note is a snapshot of electrical performance of National’s IC packages. It is provided to help designers get an idea about electrical parasitics associated with the package, and help them compare the electrical performance of different	Original	PDF	AN-1205 AN-1205 CM12 Signal Path Designer
IC 4435 Abstract: 4435 power ic GL-16000 4435 ic assisted-gps assisted-gps gsm time frequency mobile gps chips GPS chip GPS BASEBAND PROCESSOR FBGA81 Text: GL-16000 GPS Baseband Processor RF chip GL-16000 Indoor GPSTM circuitry existing circuitry Device CPU optional aiding data Location Enabled Device ▲ Features • More than 16,000 hardware correlators enable PN code convolutions to be completed in real time	Original	PDF	GL-16000 GL-16000 -158dBm TC-FS-20917-3/2002 IC 4435 4435 power ic 4435 ic assisted-gps assisted-gps gsm time frequency mobile gps chips GPS chip GPS BASEBAND PROCESSOR FBGA81
LGA 1156 PIN OUT diagram Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and	Original	PDF
FPS200 Abstract: MB86S02A Veridicom MB86C00 gps cell wireless GL-16000 AUTOMATIC STREET LIGHT CONTROLLER using simple sensor for 12th class optical fingerprint sensor multi tune car reverse horn MBF200 Text: S p r i n g 2 0 0 2 Fujitsufocus The News on the Latest Semiconductor Technologies and Products from Fujitsu Microelectronics America, Inc. Rare Dual Wins at Engineering Competition Fujitsu Microelectronics won two awards in the prestigious 12th annual EDN	Original	PDF	MBF300 CORP-NL-20908-05/2002 FPS200 MB86S02A Veridicom MB86C00 gps cell wireless GL-16000 AUTOMATIC STREET LIGHT CONTROLLER using simple sensor for 12th class optical fingerprint sensor multi tune car reverse horn MBF200