Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
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657-10ABP
Abstract: 667-10ABPP TO220 HEATSINK 637-15ABPE 651b deltabond 152 XX1371 XX1703 657-25ABPNE 657-15ABPE
Text: 797-2012.qxp:QuarkCatalogTempNew 9/5/12 7:08 AM Page 797 7 Extrusions, Heat Sinks and Accessories XX1024 XX1371 ᭤ Aluminum Mfr.’s Type Extrusion Type Dimensions WxH×T Inches Nat. Conv. Qsa (°C/W) (1.312) (312) (1.335) (.090) (.190) (.375) (1.000)
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XX1024
XX1025
XX1371
XX1703
XX2016
XX5045
XX1024
XX1371
XX2016
152-1B
657-10ABP
667-10ABPP
TO220 HEATSINK
637-15ABPE
651b
deltabond 152
657-25ABPNE
657-15ABPE
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Wakefield 120-320
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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173-7-220P
173-7-230P
173-7-240P
173-7-1212P
73-7-240A
173-9-210P
173-9-230P
173-9-240P
173-9-1212P
174-9-310P
Wakefield 120-320
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deltabond
Abstract: Wakefield 120-320 152-1B thermal conductivity 175-6-220-P
Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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WTS001
p50-68
173-7-220P
173-7-230P
173-7-240P
173-7-1212P
73-7-240A
173-9-210P
173-9-230P
173-9-240P
deltabond
Wakefield 120-320
152-1B
thermal conductivity
175-6-220-P
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T405R
Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Text: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide
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0486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
669-33AB
669-40AB
T405R
Chomerics* T405
BERGQUIST softface
T410R
intel 82495
Bergquist BP-108
intel 80486sx
Intel 82495 Cache Controller
651b
thermal printer 2 inch
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Wakefield Thermal Solutions TYPE 120
Abstract: Thermagon deltabond 152 ABLESTIK 84-1LMIT deltabond intel 8052 84-1LMIT EL75XX EL7556C EL7560C
Text: Application Note EL75XX Thermal Design Considerations Thermal Design Considerations EL75XX by Vijay Soman 1 0 Introduction The typical power applications requirement for microprocessors is either a VRM Voltage Regulator Module or a direct mother board solution
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EL75XX
EL75XX
28-pin
28ccessfully
Wakefield Thermal Solutions TYPE 120
Thermagon
deltabond 152
ABLESTIK 84-1LMIT
deltabond
intel 8052
84-1LMIT
EL7556C
EL7560C
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Untitled
Abstract: No abstract text available
Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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WTS001
p50-68
175-6-210P
173-9-210P
173-7-220P
175-6-220P
173-7-230P
173-9-230P
175-6-230P
173-7-240P
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MIL-C-47113
Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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O-220
MIL-C-47113
t405 6000
e595
Chomerics* T-405
deltabond
ARCLAD 8223
T-412 chomerics
KS21343 thermal grease
Chomerics T710
174-9-250P
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T405R
Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink
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WTS001
p1-25
220486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
T405R
Bergquist BP-108
T410R
Chomerics* T405
658-35AB
T405
T410
T411
T412
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Wakefield Thermal Solutions TYPE 120
Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION
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ebonol
Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION
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FR10300N0200J
Abstract: UT-085 BLF645 2861002402 deltabond 152 UT-085C-15 transistor C103 c103 TRANSISTOR AN10953 C5750X7S2A106M
Text: AN10953 BLF645 10 MHz to 600 MHz 120 W amplifier Rev. 1 — 3 March 2011 Application note Document information Info Content Keywords BLF645, broadband Abstract The BLF645 is a 100 W, 32 V LDMOS RF power push-pull transistor for broadcast transmitter and industrial applications from HF to 1.4 GHz. This
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AN10953
BLF645
BLF645,
FR10300N0200J
UT-085
2861002402
deltabond 152
UT-085C-15
transistor C103
c103 TRANSISTOR
AN10953
C5750X7S2A106M
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deltabond 152
Abstract: ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2
Text: Thermal Design Considerations—EL75XX Application Note March 20, 1998 AN1096 Author: Vijay Soman Typical Applications Power Requirement Elantec's EL7560/EL7561/EL7556 series of voltage regulators are highly integrated, simple to use and the most effective switching mode designs to power microprocessors
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Considerations--EL75XX
AN1096
EL7560/EL7561/EL7556
EL7560/EL7561
EL7556
Solutions--1994
deltabond 152
ABLESTIK 84-1LMIT
deltabond
Wakefield Thermal Solutions TYPE 120
84-1LMIT
heatsink catalogue
intel 8052
laptop mother board
Pentium "Voltage Regulator Module"
POWERSOP2
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l 7251
Abstract: deltabond 152
Text: VED oc ZU 2003 DOCUMENT CONTRO' REVISIONS DESCRIPTION LETTER NO NOTES: 1. CAPACITANCE: 7 3 .8 - 9 0 .2 nF. 2 . DISSIPATION FACTOR: .0 0 5 MAX O 2 5 ’ C, 1 kHZ. DIELECITRIC WITHSTANDING VOLTAGE: 3. 7 .0 kV RATED 10.5 kV BU R N -IN FOR 2 HRS @ 100* C 14.0 kV PROOF FOR 5 SECONDS
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823A702A000
7W970
7000WVDC
251------REYNOLDS
l 7251
deltabond 152
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Reynolds
Abstract: t20nf
Text: 1 R E G t. » V E D APR 2 4 1995 DCKW * NOTES: DISSIPATION FACTOR: .0 0 5 MAX @ 25* C, 1 kHZ. t. 2 . CAPACITANCE: 18 n F - 2 2 nF. 3. DIELECTRIC WITHSTANDING VOLTAGE: 1.5 kV RATED, 2 .2 5 kV PROCESS FOR 2 HOURS @ 100* C AND 3 kV PROOF FOR 5 SECS. 4. GRIT BLAST FINISH,
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7W970
QQW343)
7W970
Reynolds
t20nf
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