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    CBGA Search Results

    CBGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DAC5670MGEM/EM Texas Instruments 14-Bit, 2.4-GSPS, 1x-2x Interpolating Digital-to-Analog Converter (DAC) - QML-V Qualified 192-CBGA 25 Only Visit Texas Instruments Buy
    5962-0724701VXA Texas Instruments 14-Bit, 2.4-GSPS, 1x-2x Interpolating Digital-to-Analog Converter (DAC) - QML-V Qualified 192-CBGA -55 to 125 Visit Texas Instruments Buy
    R7S721010VCBG#AC0 Renesas Electronics Corporation RTOS MPU with 5MB of On-chip RAM Visit Renesas Electronics Corporation
    R7S910016CBG#AC0 Renesas Electronics Corporation Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip Visit Renesas Electronics Corporation
    R7S721001VCBG#AC0 Renesas Electronics Corporation RTOS MPU with 10MB of On-chip RAM Visit Renesas Electronics Corporation
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    CBGA Price and Stock

    Alpine Electronics (Asia) Ltd SKHCBGA010

    SWITCH TACTILE SPST-NO 0.05A 12V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SKHCBGA010 Bulk 3,492 1
    • 1 $1.02
    • 10 $0.985
    • 100 $0.7992
    • 1000 $0.62494
    • 10000 $0.53025
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    Newark SKHCBGA010 Bulk 7,593 1
    • 1 $1.06
    • 10 $0.958
    • 100 $0.682
    • 1000 $0.682
    • 10000 $0.682
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    Avnet Abacus SKHCBGA010 59,000 19 Weeks 1,000
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    Avnet Asia SKHCBGA010 10 Weeks 1,000
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    CoreStaff Co Ltd SKHCBGA010 756
    • 1 $0.499
    • 10 $0.425
    • 100 $0.414
    • 1000 $0.406
    • 10000 $0.406
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    SKHCBGA010 142
    • 1 $0.499
    • 10 $0.425
    • 100 $0.414
    • 1000 $0.406
    • 10000 $0.406
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    Renesas Electronics Corporation R7S721011VCBG-AC0

    IC MPU RZ/A1M 400MHZ 324FBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey R7S721011VCBG-AC0 Tray 941 1
    • 1 $24.21
    • 10 $19.574
    • 100 $24.21
    • 1000 $24.21
    • 10000 $24.21
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    Renesas Electronics Corporation R7FA6M3AF2CBG-AC0

    IC MCU 32BIT 1MB FLASH 176LFBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey R7FA6M3AF2CBG-AC0 Tray 302 1
    • 1 $15.41
    • 10 $11.021
    • 100 $15.41
    • 1000 $7.69325
    • 10000 $7.6125
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    Renesas Electronics Corporation R7FA6M5AH2CBG-AC0

    IC MCU 32BIT 2MB FLASH 176LFBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey R7FA6M5AH2CBG-AC0 Tray 285 1
    • 1 $12.82
    • 10 $9.06
    • 100 $7.0089
    • 1000 $6.01251
    • 10000 $6.01251
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    Renesas Electronics Corporation R7S721010VCBG-AC0

    IC MPU RZ/A1M 400MHZ 256LFBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey R7S721010VCBG-AC0 Tray 201 1
    • 1 $22.51
    • 10 $18.158
    • 100 $22.51
    • 1000 $22.51
    • 10000 $22.51
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    CBGA Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CBGA Amkor Technology From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production. Original PDF

    CBGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    61995AB124D1

    Abstract: No abstract text available
    Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 304 C4QFP, 255 CBGA 609 SERIES Standard P/N 609-50AB 609-100AB 40mm C4QFP 21mm CBGA Base Dimensions in. (mm


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    PDF 609-50AB 609-100AB 609-50AB) 609-100AB) 61995AB124D1

    N429

    Abstract: S-CBGA-N429
    Text: MECHANICAL DATA MCBG004 – SEPTEMBER 1998 GLP S-CBGA-N429 CERAMIC BALL GRID ARRAY 27,20 SQ 26,80 25,40 TYP 1,27 1,27 AA Y W V U T R P N M L K J H G F E D C B A 1 3 2 1,22 1,00 5 4 9 7 6 8 10 11 13 15 17 19 21 12 14 16 18 20 3,30 MAX Seating Plane 0,90 0,60


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    PDF MCBG004 S-CBGA-N429) 4164732/A MO-156 N429 S-CBGA-N429

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCBG005 – NOVEMBER 1998 GLK S-CBGA-N567 CERAMIC BALL GRID ARRAY 31,20 SQ 30,80 29,21 TYP 1,27 0,635 0,635 1,27 AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 1 3 2 7 5 4 6 9 8 10 11 13 15 17 19 21 23 12 14 16 18 20 22 24 3,30 MAX Seating Plane


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    PDF MCBG005 S-CBGA-N567) 4164730/A MO-156

    reliability data

    Abstract: MOS13 XPC7410 XPC7410RX
    Text: M XPC7410RX RELIABILITY DATA SUMMARY XPC7410 Fab: Mask: Process: Package: Assy: - Nitro - Information MOS13, Austin, TX K65D HiP6L 25 x 25 mm CBGA, 360 Pin BAT-1, Austin, Tx XPC7410 - Nitro - TECHNOLOGY: MOS13 on the 0.15µm Nominal HiP6L process DYNAMIC LIFETEST (2.35V, 90°C)


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    PDF XPC7410RX XPC7410 MOS13, XPC7410 MOS13 reliability data

    120C

    Abstract: 140C 210C
    Text: Note Number AN-C1-RW-A Development Tools And Methods APPLICATION NOTE CLEARONE REWORK PROCEDURE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


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    PDF N130MZ327 N163MZ163 N169MZ365 N161MZ612 N169MZ641 120C 140C 210C

    16M Flash Memory

    Abstract: AT49BV163D
    Text: Features • 16-Mbit Flash and 8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.6V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •


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    PDF 16-Mbit 66-ball 3618B 16M Flash Memory AT49BV163D

    3466A

    Abstract: AT52BC3221A AT52BC3221AT SA70
    Text: Features • 32-Mbit Flash and 4-Mbit/8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • • • • • • • • • • • • • • 32-megabit (2M x 16) 2.7V to 3.3V Read/Write Access Time – 70 ns


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    PDF 32-Mbit 66-ball 32-megabit 3466A AT52BC3221A AT52BC3221AT SA70

    Untitled

    Abstract: No abstract text available
    Text: data sheet CERAMIC / HERMETIC CMCM Ceramic Multi-Chip Module Package CMCM The MCM/CBGA and MCM/PBGA by Amkor Technology incorporates the latest technology in high-density Ceramic and Plastic IC packaging. The high-speed performance and thermal advantages of the CBGA and PBGA package


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    PDF DS804

    DH11

    Abstract: DH21 DH23 b09 n03 DH19 dh17 A09 N03 Dh14 dh28 Dh29
    Text: OFFICIAL - 9/17/97 CBGA Footprints Rev. F 603 Family CBGA C16 E04 D13 F02 D14 G01 D15 E02 D16 D04 E13 G02 E15 H01 E16 H02 F13 J01 F14 J02 F15 H03 F16 F04 G13 K01 G15 K02 H16 M01 J15 P01 L02 K04 C01 B04 B03 B02 A04 B07 J04 A10 L01 B06 E01 D08 A06 D07 B01 B05


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    PDF 604ev 603ev. 604ev. 604ev DH11 DH21 DH23 b09 n03 DH19 dh17 A09 N03 Dh14 dh28 Dh29

    12-Bit Parallel-IN Serial-OUT Shift Register

    Abstract: cypress IM103 adaptive cruise control cruise control CYIA2SC0300AA-BQE Glass Seal Cmos imager sensor
    Text: CYIA2SC0300AA-BQE 1/3” VGA-Format CMOS Image Sensor Features • • • • • • 1 VGA Resolution 1/3” Optical Format Automotive Grade device 120 db Dynamic Range 60 PIN CBGA Low power dissipation Functional Description Cypress IM103 is Automotive grade CMOS Image Sensor with


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    PDF CYIA2SC0300AA-BQE IM103 12-Bit Parallel-IN Serial-OUT Shift Register cypress IM103 adaptive cruise control cruise control CYIA2SC0300AA-BQE Glass Seal Cmos imager sensor

    intercom phone system block diagram

    Abstract: audio howling INTERCOM FULL-duplex Automatic Gain Control AGC Algorithm Users mic preamp with echo adaptive filter micro electret echo mic preamp c code for microphone noise canceller
    Text: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet Zarlink has introduced a new generation family of AEC ZL38002 and ZL38004 . Zarlink recommends these products for new designs. May 2007 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack


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    PDF ZL38003 ZL38002 ZL38004) ZL38003GMG ZL38003GMG2 intercom phone system block diagram audio howling INTERCOM FULL-duplex Automatic Gain Control AGC Algorithm Users mic preamp with echo adaptive filter micro electret echo mic preamp c code for microphone noise canceller

    AT52BR1672T

    Abstract: AT52BR1674T
    Text: Features • 16-Mbit Flash and 2-Mbit/4-Mbit SRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • •


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    PDF 16-Mbit 66-ball 10/01/0M AT52BR1672T AT52BR1674T

    BGA reflow guide

    Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
    Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


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    PDF N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


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    PDF 25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles

    LC2D

    Abstract: SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L ADSP-21060 socket am3 mounting
    Text: a AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned


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    PDF AD14160/ AD14160L AD14160/AD14160L AD14060 ADSP-21060 AD14x60 C3255 LC2D SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L socket am3 mounting

    SA8 357

    Abstract: AT52BR3244 AT52BR3244T SA10 SA11 SA70
    Text: Features • 32-Mbit Flash and 4-Mbit SRAM • Single 66-ball 8 mm x 11 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • • • • • •


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    PDF 32-Mbit 66-ball 07/01/xM SA8 357 AT52BR3244 AT52BR3244T SA10 SA11 SA70

    PC755BM8

    Abstract: MCP 67 MV PC745 PC755M8 PCX755B
    Text: Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz


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    PDF PC755BM8 PC755BM8 2164C MCP 67 MV PC745 PC755M8 PCX755B

    3618A

    Abstract: No abstract text available
    Text: Features • 16-Mbit Flash and 8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.6V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •


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    PDF 16-Mbit 66-ball 3618A

    66c4

    Abstract: No abstract text available
    Text: Features • 32-Mbit Flash and 4-Mbit/8-Mbit SRAM • Single 66-ball 8 mm x 11 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85, 90, 110 ns • Sector Erase Architecture • • • • • • •


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    PDF 32-Mbit 66-ball 2471D 66c4

    AT52BC6402DT-70CU

    Abstract: 3619a AT49BV640D AT52BC6402D AT52BC6402DT 66C7
    Text: Features • 64-Mbit Flash and 16-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.1V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •


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    PDF 64-Mbit 16-Mbit 66-ball AT52BC6402DT-70CU 3619a AT49BV640D AT52BC6402D AT52BC6402DT 66C7

    FXBI04

    Abstract: CY7C965 Signal Path Designer CY7C96
    Text: ADVANCED INFORMATION CY7C965 Raceway Crossbar Features 160 Mbyte per second per path Block Transfer Rates 6 bidirectional ports Non-blocking architecture 361-pin CBGA package Fault tolerant systems may require the implementation of mul­ tiple redundant paths between nodes in the fabric. Time-critical elements in the fabric may require interrupt support, low


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    PDF CY7C965 361-pin FXBI04 CY7C965 Signal Path Designer CY7C96

    CBGA

    Abstract: No abstract text available
    Text: 1.5 Pin Assignments Motorola and IBM both offer a ceramic ball grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top


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    PDF PID9q-604e CBGA

    FCS 1861

    Abstract: wakefield compound 2333B b09 n03 SIGNAL PATH DESIGNER
    Text: 1.6 Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Pin Number Signal Name Active I/O A [0-31 C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, G 0 2 , E15, H01, E16, H02, F13, J01, F14, J02, F15, H03,


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    PDF T02otorola PID9q-604e FCS 1861 wakefield compound 2333B b09 n03 SIGNAL PATH DESIGNER

    Untitled

    Abstract: No abstract text available
    Text: CYPRESS ADVANCED INFORMATION Raceway Crossbar Features 160 Mbyte per second per path Block Transfer Rates 6 bidirectional ports Non-blocking architecture 361-pin CBGA package Building Block for Scaleable Networks Preemptable prioritized transactions Adaptive Routing support


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    PDF 361-pin CY7C965