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    BGA85 Price and Stock

    Infineon Technologies AG BGA855N6E6327XTSA1

    IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA855N6E6327XTSA1 Reel 12,000
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    Mouser Electronics BGA855N6E6327XTSA1
    • 1 $0.63
    • 10 $0.398
    • 100 $0.323
    • 1000 $0.297
    • 10000 $0.273
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    Verical BGA855N6E6327XTSA1 41,210 24
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    • 100 $0.2529
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    BGA855N6E6327XTSA1 12,000 12,000
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    BGA855N6E6327XTSA1 10,719 136
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    BGA855N6E6327XTSA1 7,600 138
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    BGA855N6E6327XTSA1 1,470 1,289
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    Arrow Electronics BGA855N6E6327XTSA1 Cut Strips 41,210 20 Weeks 1
    • 1 $0.3056
    • 10 $0.2711
    • 100 $0.2531
    • 1000 $0.253
    • 10000 $0.253
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    BGA855N6E6327XTSA1 12,000 20 Weeks 12,000
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    Newark BGA855N6E6327XTSA1 Cut Tape 951 1
    • 1 $0.799
    • 10 $0.56
    • 100 $0.436
    • 1000 $0.372
    • 10000 $0.372
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    Quest Components BGA855N6E6327XTSA1 2,000
    • 1 $0.6
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    • 1000 $0.25
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    BGA855N6E6327XTSA1 2,000
    • 1 $0.6
    • 10 $0.6
    • 100 $0.6
    • 1000 $0.25
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    Rochester Electronics BGA855N6E6327XTSA1 1,470 1
    • 1 $0.2739
    • 10 $0.2739
    • 100 $0.2575
    • 1000 $0.2328
    • 10000 $0.2328
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    Chip1Stop BGA855N6E6327XTSA1 Cut Tape 10,719
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    • 10 $0.184
    • 100 $0.184
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    BGA855N6E6327XTSA1 Cut Tape 7,600
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    EBV Elektronik BGA855N6E6327XTSA1 21 Weeks 12,000
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    Win Source Electronics BGA855N6E6327XTSA1 73,540
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    • 1000 $0.2859
    • 10000 $0.2563
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    Rochester Electronics LLC BGA855N6E6327XTSA1

    BGA855N6 - RF AMPLIFIER 1.164GHZ
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA855N6E6327XTSA1 Bulk 1,054
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    • 10000 $0.28
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    Infineon Technologies AG BGA 855N6 E6327

    RF Amp Single LNA 1.3GHz 3.3V 6-Pin TSNP T/R
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Verical BGA 855N6 E6327 12,000 133
    • 1 -
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    • 1000 $0.551
    • 10000 $0.5076
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    Quest Components BGA 855N6 E6327 9,600
    • 1 $1.645
    • 10 $1.645
    • 100 $1.645
    • 1000 $1.645
    • 10000 $0.4935
    		Buy Now
    CoreStaff Co Ltd BGA 855N6 E6327 12,000
    • 1 $0.908
    • 10 $0.908
    • 100 $0.377
    • 1000 $0.329
    • 10000 $0.329
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    BGA85 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA855N6E6327XTSA1 Infineon Technologies RF MMIC Original PDF

    BGA85 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50214-1E 3Stacked MCP Multi-Chip Package FLASH & FCRAM & SRAM CMOS 64M (x16) FLASH MEMORY & 16M (×16) Mobile FCRAM & 4M (×16) STATIC RAM MB84VR5E3J1A1-85 • FEATURES • Power Supply Voltage of 2.7 to 3.1V • High Performance


    Original     		PDF DS05-50214-1E MB84VR5E3J1A1-85 85-ball F0110

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    phison

    Abstract: No abstract text available
    Text: PS3006 2F, RiteKom Bldg No.669, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 310, R.O.C. Tel： 886-3‐5833899‐3001 or 1001 or 1005 Fax： 886‐3‐5833666 Phison PS3006 Controller Version 1.2 1 11/14/2007 PS3006


    Original     		PDF PS3006 PS3006 85pin TQFP100 BGA85 phison

    NAND FLASH BGA

    Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
    Text: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction


    Original     		PDF FBGA69) IR250 NAND FLASH BGA BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71

    K6G5

    Abstract: FCRAM MBM29DL640E abs18
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50215-1E 3Stacked MCP Multi-Chip Package FLASH & FCRAM & FCRAM CMOS 64M (x16) FLASH MEMORY & 32M (×16) Mobile FCRAMTM & 32M (×16) Mobile FCRAMTM MB84VR5E4J4J1-85 • FEATURES • Power Supply Voltage of 2.7 to 3.1 V


    Original     		PDF DS05-50215-1E MB84VR5E4J4J1-85 85-ball K6G5 FCRAM MBM29DL640E abs18

    Untitled

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50214-1E 3Stacked MCP Multi-Chip Package FLASH & FCRAM & SRAM CMOS 64M (x16) FLASH MEMORY & 16M (×16) Mobile FCRAM & 4M (×16) STATIC RAM MB84VR5E3J1A1-85 • FEATURES • Power Supply Voltage of 2.7 to 3.1V • High Performance


    Original     		PDF DS05-50214-1E MB84VR5E3J1A1-85 85-ball F0110

    MN864779

    Abstract: MN88472 AN12947a MN6627553 MIP3E3SMY AN22004A mip2E2dmy MIP2F2* replacement MIP2E7DMY MIP3E50MY
    Text: 2013 Semiconductor Selection Guide How to Read This Document Structure of this document This document consists of the part number list, application block diagrams, and recommended types by classification. Types are classified according to the ECALS glossary.


    Original     		PDF A000021E MN864779 MN88472 AN12947a MN6627553 MIP3E3SMY AN22004A mip2E2dmy MIP2F2* replacement MIP2E7DMY MIP3E50MY

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    Yamaichi ic354

    Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
    Text: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3


    Original     		PDF LGA-80P-M02 IC280-080-252 LGA-80P-M04 LGA-144P-M02 IC280-144-249 LGA-176P-M01 IC280-176-254 F0606 Yamaichi ic354 IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P