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LSI Corporation APP1001APBGA388-DB
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Bristol Electronics	APP1001APBGA388-DB		76			1 - 10 - 100 - 1000 - 10000 -	Get Quote
ZF Micro Solutions, Inc. ZFX86BGA388-C-NZ
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Bristol Electronics	ZFX86BGA388-C-NZ		24			1 - 10 - 100 - 1000 - 10000 -	Get Quote
LSI Corporation L-APP1001APBGA388
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Bristol Electronics	L-APP1001APBGA388		17			1 - 10 - 100 - 1000 - 10000 -	Get Quote
ZF Micro Solutions, Inc. ZFX86BGA388E100
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Bristol Electronics	ZFX86BGA388E100		6			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Others ZFX86BGA388-I-NZ INSTOCK
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Chip 1 Exchange	ZFX86BGA388-I-NZ		8			1 - 10 - 100 - 1000 - 10000 -	Get Quote

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BGA388 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
BGA388		NXP Semiconductors	Footprint for reflow soldering		Original	PDF

BGA388 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-2 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e AF AD AB Y 1/2 e ∅v ∅w b M M C C A B C y y1 C AE AC AA V e W T P M K H F D B U R e2 N L 1/2 e J G	Original	PDF	BGA388: OT532-2 MS-034
sot582 Abstract: BGA388 Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 2.15 mm SOT582-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA	Original	PDF	BGA388: OT582-1 sot582 BGA388
MS-034 Abstract: SOT532-1 BGA388 Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB AE e AC AA Y	Original	PDF	BGA388: OT532-1 MS-034 MS-034 SOT532-1 BGA388
388 transistor Abstract: No abstract text available Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K	Original	PDF	BGA388: OT532-1 388 transistor
0.4mm pitch BGA Abstract: pitch 0.4mm BGA 27mmx27mm SF-BGA388B-B-11 Text: C Package Code: BGA388B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 1.00mm pitch typ. 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.508 mm [0.020"] dia pads	Original	PDF	BGA388B FR4/G10 26X26 SF-BGA388B-B-11 0.4mm pitch BGA pitch 0.4mm BGA 27mmx27mm
PBGA388 Abstract: No abstract text available Text: P-BGA388-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.	Original	PDF	P-BGA388-3535-1 PBGA388
Untitled Abstract: No abstract text available Text: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AF AD AB Y V T P M K H F D B AE e AC AA W U R e2 N L 1/2 e J G	Original	PDF	BGA388: OT532-1 MS-034
SF-BGA388A-B-11 Abstract: No abstract text available Text: D Package Code: BGA388A C 31.75mm [1.250"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] X 31.75mm [1.250"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]	Original	PDF	BGA388A FR4/G10 SF-BGA388A-B-11
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA388 package SOT532-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	BGA388 OT532-1 OT532-1
sot532 Abstract: BGA388 Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G	Original	PDF	BGA388: OT532-1 sot532 BGA388
Untitled Abstract: No abstract text available Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10	Original	PDF	MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316
amd elan 520 Abstract: smd transistor 857 data transistor SMD p12 EC2500ETT-8 u47 K SMD SOT23 transistor MARK Y2 ISL-8032VT PALCE22V10H-5JC ISL-8032 Text: Élan SC520 Microcontroller Customer Development Platform User’s Manual Order #22450A Élan™SC520 Microcontroller Customer Development Platform User’s Manual Copyright 1999 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. "AMD" products. AMD	Original	PDF	lanTMSC520 2450A lanSC520 amd elan 520 smd transistor 857 data transistor SMD p12 EC2500ETT-8 u47 K SMD SOT23 transistor MARK Y2 ISL-8032VT PALCE22V10H-5JC ISL-8032
LGA 1156 PIN OUT diagram Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)	Original	PDF	DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
BGA676 Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18	Original	PDF	BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

IC354 Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4 Text: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8	Original	PDF	300mil 400mil 600mil 750mil IC37F-0803-G4HT IC37NRB-1403-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC354 IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4
au1550-500mbd Abstract: au1100-400mbd AU1100-333MBC AGXD466EEXD0BD au1550 AGXD533AAXF0CD ElanSC520-133AD AU1100-333MBD AU1100-333MBF AM79C973BVD Text: Marketing Information Date: Q404 Update Products: All PCSG Products Originator: PCSG Business Operations Type: Product Update PCSG Lead-Free Pb-Free Product Status & RoHS AMD is aware that the European Union Directive entitled “Restriction on the use of certain Hazardous	Original	PDF	2002/95/EC, OGF453 ANXL1250FYC3S ANXL1250FYC3M ANXL1500FGC3S ANXL1500FGC3M ANXS1750FXC3S ANXS1750FXC3M au1550-500mbd au1100-400mbd AU1100-333MBC AGXD466EEXD0BD au1550 AGXD533AAXF0CD ElanSC520-133AD AU1100-333MBD AU1100-333MBF AM79C973BVD
pnx7100 Abstract: PR3940 karaoke video ac3 dts encoder audio encoder mpeg bt.656 to CVBS small size karaoke mixer circuit diagram MIPS16 philips home audio systems audio encoder mpeg 1 Text: INTEGRATED CIRCUITS DATA SHEET PNX7100 MPEG AVG CODEC Objective specification File under Integrated Circuits, IC02 2002 Feb 28 Philips Semiconductors Objective specification MPEG AVG CODEC PNX7100 FEATURES Interfaces • 32-bit 133 MHz SDRAM interface supports up to two	Original	PDF	PNX7100 32-bit 16-bit SCA74 753504/01/pp12 pnx7100 PR3940 karaoke video ac3 dts encoder audio encoder mpeg bt.656 to CVBS small size karaoke mixer circuit diagram MIPS16 philips home audio systems audio encoder mpeg 1
GE4F Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00 Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written	Original	PDF	C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
SOT411 Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050 Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which	Original	PDF
ARM926EJ-STM Abstract: IF VIDEO DEMODULATOR i2c 256QAM ARM926EJ-S LC74188BG video scaler MPEG2 pal 256-MBIT STB tuner half-nim Text: CATV数字电视机用内置DVB-C解调的单片解码 LC74188BG 采用中国第一个* 无卡CA系统（长城CA）! 高性价比STB成为现实 ! * 2008年3月拥有50余年历史的三洋半导体公司，致力于电视机IC的开发已超过25年。	Original	PDF	LC74188BG 50IC25 ICICDVB-C90nm LC74188BG2007STB LC74188BG 112X98 B-308, 12Xiang 256QAM ARM926EJ-STM IF VIDEO DEMODULATOR i2c 256QAM ARM926EJ-S video scaler MPEG2 pal 256-MBIT STB tuner half-nim
handbook philips ic26 packaging Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3	Original	PDF	AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Transistor morocco 9740 Abstract: Ablebond 8360 con hdr hrs ablebond 8086 interfacing with 8254 peripheral Date Code Formats diodes St Microelectronics formatter board Canon interfacing of 8237 with 8086 ST tOP MaRKinGS 388BGA Text: RELIABILITY REPORT Q98001 SICL BUSINESS UNIT REPORT NUMBER : Q98001 QUALIFICATION TYPE : NEW DEVICE - NEW PACKAGE DEVICE : STPC Client SIP101 SALES TYPES : STPCD0166BTC3 - STPCD0175BTC3 TECHNICAL CODE : MDBT*CHDT1BR PROCESS : HCMOS6 - CROLLES FAB LOCATION	Original	PDF	Q98001 SIP101) STPCD0166BTC3 STPCD0175BTC3 388BGA Transistor morocco 9740 Ablebond 8360 con hdr hrs ablebond 8086 interfacing with 8254 peripheral Date Code Formats diodes St Microelectronics formatter board Canon interfacing of 8237 with 8086 ST tOP MaRKinGS
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	PDF	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
M9627 Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in	Original	PDF	C10535EJ8V0IF00 M9627 uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire

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BGA388 Search Results

BGA388 Price and Stock

LSI Corporation APP1001APBGA388-DB

ZF Micro Solutions, Inc. ZFX86BGA388-C-NZ

LSI Corporation L-APP1001APBGA388

ZF Micro Solutions, Inc. ZFX86BGA388E100

Others ZFX86BGA388-I-NZ

BGA388 Datasheets (1)

BGA388 Datasheets Context Search

Untitled

sot582

MS-034

388 transistor

0.4mm pitch BGA

PBGA388

Untitled

SF-BGA388A-B-11

Untitled

sot532

Untitled

amd elan 520

LGA 1156 PIN OUT diagram

BGA676

IC354

au1550-500mbd

pnx7100

GE4F

SOT411

ARM926EJ-STM

handbook philips ic26 packaging

Transistor morocco 9740

JEDEC TRAY DIMENSIONS

M9627