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    BGA360 Search Results

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    BGA360 Price and Stock

    Schneider Electric BGA36020

    MOLDED CASE CIRCUIT BRKR 600Y/34
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    DigiKey BGA36020 Box 1
    • 1 $1418
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    Schneider Electric BGA36040

    MOLDED CASE CIRCUIT BRKR 600Y/34
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA36040 Box 1
    • 1 $1418
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    Schneider Electric BGA36045

    MOLDED CASE CIRCUIT BRKR 600Y/34
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA36045 Box 1
    • 1 $1534.63
    • 10 $1534.63
    • 100 $1534.63
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    Schneider Electric BGA36090

    MOLDED CASE CIRCUIT BRKR 600Y/34
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA36090 Box 1
    • 1 $1595
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    Schneider Electric BGA36015

    MOLDED CASE CIRCUIT BRKR 600Y/34
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA36015 Box 1
    • 1 $1418
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    BGA360 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA360

    Abstract: PPC603 bga255 PPC750
    Text: 1.060" 1.000" 0.984" PPC603 BGA255 PPC750 (BGA360) A1 A1 0.900" 0.984" 0.050" Ø 0.025" pad 0.051" Top View Bottom View Removeable Pins to Aid In Alignment. 3 0.048" 1 1 2 2 Side View 3 0.024"±0.005" Substrate: 0.0480"±0.007" FR4/G10 or equivalent high


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    PDF PPC603 BGA255) PPC750 BGA360) FR4/G10 19x19 DC-BGA/BGA-750-S-B-02 BGA360 PPC603 bga255 PPC750

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA360: plastic ball grid array package; 360 balls; SOT1164-1 B D D1 A ball A1 index area E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e e2 1/2 e 1 3 5 7 9 11 13 15 17 19 21 shape


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    PDF BGA360: OT1164-1 sot1164-1 MS-034

    BGA360

    Abstract: ppc603 PPC750 BGA255
    Text: PPC603 BGA255 PPC750 (BGA360) A1 A1 0.984" Ø 0.025" pad 0.984" Top View Bottom View 0.050" 0.048" 1 1 2 Substrate: 0.0480"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Balls: Eutectic 63/37 SnPb. 2 Side View 0.024"±0.005"


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    PDF PPC603 BGA255) PPC750 BGA360) FR4/G10 19x19 DC-BGA/BGA-750-S-B-01 BGA360 ppc603 PPC750 BGA255

    SF-BGA360B-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA360B C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X Top View reference only 25.4mm [1.000"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 3 1.27mm [0.050"]


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    PDF BGA360B FR4/G10 SF-BGA360B-B-11

    PPC603

    Abstract: BGA360 PPC750 ST BGA
    Text: PPC603 BGA255 PPC750 (BGA360) A1 A1 0.984" Ø 0.025" pad 0.984" Top View 0.050" Bottom View 1 0.161" ±0.005" 1 Substrate: 0.0480"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Substrate: 0.0985"±0.007" FR4/G10 or equivalent high


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    PDF PPC603 BGA255) PPC750 BGA360) FR4/G10 DC-BGA/BGA-750-S-T-01 PPC603 BGA360 PPC750 ST BGA

    SF-BGA360A-B-11

    Abstract: DASF004375
    Text: D Package Code: BGA360A C 22.86mm [0.900"] Ø 0.40mm [Ø 0.0156"] tooling hole X2 optional See BGA pattern code to the right for actual pattern layout Y 22.86mm [0.900"] 1.27mm [0.050"] X 0.66mm [0.026"] typ. Top View (reference only) 2 0.36mm [0.014"] dia.


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    PDF BGA360A SF-BGA360A-B-11 DASF004375

    LA-BGA-750-S-B-01

    Abstract: 180 ohm resistor
    Text: 3.500" 1 Hi_E Lo_C 1.030" 15 Lo_A JTAG A1 19 Hi_A J Hi_C 3.000" 10 Lo_D W Lo_E 1.000" Hi_D 1.555" Side View 0.950" Each Mictor connection contains a 180 ohm resistor to source. LS-BGA360A-02 PROPRIETARY INFORMATION Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD


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    PDF LS-BGA360A-02 FR4/G10 LA-BGA-750-S-B-01 180 ohm resistor

    LA-BGA-750-S-B-03

    Abstract: PB-BGA-750-03 1.27mm 10 pin box header connector
    Text: 88.9mm [3.500"] Top View 40.64mm [1.600"] Hi_E Lo_C Lo_A 26.68mm [1.050"] Note: All signal traces between BGA and mictor connectors have a 180 ohm series resistor. Lo_D Hi_A Hi_C 76.2mm [3.000"] JTAG A1 Lo_E Hi_D 2 LS-BGA360A-01 included 4 6 19.14mm [0.753"]


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    PDF LS-BGA360A-01 PB-BGA-750-03 SF-BGA360A-B-02 FR4/G10 LA-BGA-750-S-B-03 PB-BGA-750-03 1.27mm 10 pin box header connector

    hirel

    Abstract: tkf 912
    Text: PC7410 PowerPC 7410 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • • • 22.8 SPECint95 estimated , 17SPECfp95 at 500 MHz (estimated) 917MIPS at 500 MHz Selectable Bus Clock (14 CPU Bus Dividers Up To 9x)


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    PDF PC7410 SPECint95 17SPECfp95 917MIPS 64-bit 32-bit F-91572 0832G hirel tkf 912

    TSOP32 pad

    Abstract: bs62lv1027 R0201-BS62LV1027
    Text: Very Low Power CMOS SRAM 128K X 8 bit BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns


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    PDF BS62LV1027 BS62LVontinued) R0201-BS62LV1027 TSOP32 pad bs62lv1027 R0201-BS62LV1027

    PC7400

    Abstract: 2103A BGA360 ABB CONVERTER E4 PCX7400 tag l9 420 400 TMS10
    Text: Features • • • • • • • • • • • • • • • • 18SPECint95, 16SPECfp95 @ 266 MHz with 1-MB L2 @ 200 MHz 3.2 GFLOPS @ 400 MHz Peak Performance Selectable Bus Clock (14 CPU Bus Dividers Up To 9x) Seven Selectable Core-to-L2 Frequency Divisors


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    PDF 18SPECint95, 16SPECfp95 64-bit 32-bit 32-KB PC7400 2103A BGA360 ABB CONVERTER E4 PCX7400 tag l9 420 400 TMS10

    sk 8050 rf

    Abstract: smd diode 815b C8050 schottky C475 DIODE 2C101 m15 fah 001 8 24VDc R5C592 LTN154X1-L02 W83L950 BGA144F
    Text: SERVICE MANUAL FOR 8050 BY: Grass.Ren Repair Technology Research Department /EDVD Feb.2004 8050 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………. 1.1 Introduce ……………………………………………………………………………………………….


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    PDF 855GME VT6307L IEEE1394 sk 8050 rf smd diode 815b C8050 schottky C475 DIODE 2C101 m15 fah 001 8 24VDc R5C592 LTN154X1-L02 W83L950 BGA144F

    HAMR5603

    Abstract: M9-CSP64 UTC1117 KX15-50KLD SEAGATE ST340810A PMOSSOT23 ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL 180w subwoofer circuit diagram R101A w31 smd
    Text: SERVICE MANUAL FOR E - 8188 BY: Rain Li TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Apr . 2003 LCD PC E-8188 MAINTENANCE Contents 1. Hardware Engineering Specification - 3


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    PDF E-8188 845PE CB710 ICS950805 HAMR5603 M9-CSP64 UTC1117 KX15-50KLD SEAGATE ST340810A PMOSSOT23 ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL 180w subwoofer circuit diagram R101A w31 smd

    Prestigio nobile 150

    Abstract: diagram HANNSTAR j mv 4 Prestigio lad1 12vdc msi MOTHERBOARD SERVICE MANUAL LYNX SM 30 diagram HANNSTAR k mv diagram HANNSTAR k mv 4 IC25N040ATMR Insyde bios manual
    Text: PRESTIGIO NOBILE 150 TECHNICAL SERVICE MANUAL Contents 1. Hardware Engineering Specification ………………………………………………………………………. 4 1.1 Introduction ………………………………………………………………………………………………………………… 4


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    PDF PC536 MAXIM1907) 82801DBM W83L950D PLL207-151 VT6105LOM 8089P Prestigio nobile 150 diagram HANNSTAR j mv 4 Prestigio lad1 12vdc msi MOTHERBOARD SERVICE MANUAL LYNX SM 30 diagram HANNSTAR k mv diagram HANNSTAR k mv 4 IC25N040ATMR Insyde bios manual

    tip 8050d

    Abstract: U710D u714a ZV12 C942 apc730 AK-102 amplifier subwoofer 8050d 331 u709
    Text: 5 4 3 2 1 REVISION 8050F R02 PROJECT CODE- G120 PRODUCT CODE- 6834 CHAGND TP42 TP43 TP44 TOUCHPAD_METAL10 TOUCHPAD_METAL10 TOUCHPAD_METAL10 TOUCHPAD_METAL10 TP46 CARDBUS / CARDREADER PCI_INTB# / PCI_INTC# IEEE1394 PCI_INTG# PCI_REQ1# / PCI_GNT1# AD21 MINIPCI


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    PDF 8050F 8050D AMS1117 25MHZ RTL8100CL ALC655 PH163112 W83L950D IEEE1394 tip 8050d U710D u714a ZV12 C942 apc730 AK-102 amplifier subwoofer 8050d 331 u709

    8081 motherboard

    Abstract: R141 237 000 Intel 8081 MDC56S1 R5C475 288-1141 SBW-242 F3437 puma inverter p5 series puma inverter p5 series manual
    Text: SERVICE MANUAL FOR 8081 BY: Sissel Diao Repair Technology Research Department /EDVD Jul. 2003 8081 N/B Maintenance Contents 1. Hardware Engineering Specification ………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………… 4


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    PDF 82855GM 82801DBM 8081 motherboard R141 237 000 Intel 8081 MDC56S1 R5C475 288-1141 SBW-242 F3437 puma inverter p5 series puma inverter p5 series manual

    Untitled

    Abstract: No abstract text available
    Text: Features • • • • • • • • • • • • • • • • • 22.8 SPECint95 estimated , 17SPECfp95 @ 500 MHz (estimated) 917MIPS @ 500 MHz Selectable Bus Clock (14 CPU Bus Dividers Up To 9x) Seven Selectable Core-to-L2 Frequency Divisors Selectable 603 Interface Voltage Below 3.3V (1.8V, 2.5V)


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    PDF SPECint95 17SPECfp95 917MIPS 64-bit 32-bit 32-KB

    BS62LV2006

    Abstract: BS62LV2006DC BS62LV2006SC BS62LV2006STC BS62LV2006TC TSOP32 pad
    Text: Very Low Power CMOS SRAM 256K X 8 bit BS62LV2006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 23mA Max. 2mA (Max.)


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    PDF BS62LV2006 BS62LV2006 R0201-BS62LV2006 BS62LV2006DC BS62LV2006SC BS62LV2006STC BS62LV2006TC TSOP32 pad

    375E-1

    Abstract: BS62LV4006 BS62LV4006EC BS62LV4006PC BS62LV4006SC BS62LV4006STC BS62LV4006S stsop32
    Text: Very Low Power CMOS SRAM 512K X 8 bit BS62LV4006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 30mA Max. at 55ns


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    PDF BS62LV4006 R0201-BS62LV4006 375E-1 BS62LV4006 BS62LV4006EC BS62LV4006PC BS62LV4006SC BS62LV4006STC BS62LV4006S stsop32

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


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    PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    Untitled

    Abstract: No abstract text available
    Text: Very Low Power CMOS SRAM 512K X 8 bit BS62LV4006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 30mA Max. at 55ns


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    PDF BS62LV4006 volta62LV4006 R0201-BS62LV4006

    MCP 67 MV- A2

    Abstract: abb dc motor ABB sensor absolute pressure cga motorola 2141B Hall Effect Current Sensors ABB IEC C14 pcb mount connector PC7400 u9 atmel ABB pressure
    Text: Features • • • • • • • • • • • • • • • • • 22.8 SPECint95 estimated , 17SPECfp95 at 500 MHz (estimated) 917MIPS at 500 MHz Selectable Bus Clock (14 CPU Bus Dividers Up To 9x) Seven Selectable Core-to-L2 Frequency Divisors


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    PDF SPECint95 17SPECfp95 917MIPS 64-bit 32-bit 2141B MCP 67 MV- A2 abb dc motor ABB sensor absolute pressure cga motorola Hall Effect Current Sensors ABB IEC C14 pcb mount connector PC7400 u9 atmel ABB pressure

    100PF

    Abstract: BS62LV2007 BS62LV2007HC BS62LV2007HI BS62LV
    Text: BSI Very Low Power/Voltage CMOS SRAM 256K X 8 bit BS62LV2007 „ FEATURES „ DESCRIPTION • Wide Vcc operation voltage : 2.4V ~ 5.5V • Very low power consumption : Vcc = 3.0V C-grade : 20mA Max. operating current I- grade : 25mA (Max.) operating current


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    PDF BS62LV2007 100ns BS62LV2007 R0201-BS62LV2007 100ns -40oC 100PF BS62LV2007HC BS62LV2007HI BS62LV

    100PF

    Abstract: BS62LV2007 BS62LV2007HC BS62LV2007HI mini bga 6x8
    Text: BSI Very Low Power/Voltage CMOS SRAM 256K X 8 bit BS62LV2007 „ DESCRIPTION „ FEATURES • Wide Vcc operation voltage : 2.4V ~ 5.5V • Very low power consumption : Vcc = 3.0V C-grade : 20mA Max. operating current I- grade : 25mA (Max.) operating current


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    PDF BS62LV2007 100ns R0201-BS62LV2007 100PF BS62LV2007 BS62LV2007HC BS62LV2007HI mini bga 6x8