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Fischer Connectors ICKBGA21X21 Heatsink, BGA,24.3 to 8K/W,21x21x6mm, Conductive Adhesive, Conductive Foil Mount \| Fischer ICKBGA21X21
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	ICKBGA21X21	Bulk			1	1 $1.02 10 $0.97 100 $0.82 1000 $0.82 10000 $0.82	Get Quote
Fritz Kuebler Gmbh 8.5863.121B.GA21.0030 Absolute, Clamp Flange, 10mm shaft, SSI/5V, 3m Cable, 10-bit x 12-bit \| Kuebler 8.5863.121B.GA21.0030
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	8.5863.121B.GA21.0030	Bulk		12 Weeks	1	1 $1091.22 10 $1091.22 100 $1091.22 1000 $1091.22 10000 $1091.22	Get Quote
Fritz Kuebler Gmbh 8.5873.542B.GA21.0020 Absolute; Stator Coupling; 12mm bore; SSI/10-30V; 2m Cable; 10-bit \| Kuebler 8.5873.542B.GA21.0020
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	8.5873.542B.GA21.0020	Bulk		12 Weeks	1	1 $848.37 10 $848.37 100 $848.37 1000 $848.37 10000 $848.37	Get Quote
Fritz Kuebler Gmbh 8.5853.322B.GA21.0020 Absolute; Clamp Flange; 10mm shaft; SSI/10-30V; 2m Cable; 10-bit \| Kuebler 8.5853.322B.GA21.0020
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	8.5853.322B.GA21.0020	Bulk		12 Weeks	1	1 $716.57 10 $716.57 100 $716.57 1000 $716.57 10000 $716.57	Get Quote
Fischer Elektronik GmbH & Co KG ICKBGA21X21 Heatsink: extruded; black; L: 21mm; W: 21mm; H: 6mm; aluminium
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	ICKBGA21X21		277		1	1 $1.06 10 $0.96 100 $0.74 1000 $0.74 10000 $0.74	Buy Now

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BGA21 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
SF-BGA216A-B-11 Abstract: No abstract text available Text: D Package Code: BGA216A C 30.48mm [1.200"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 1.27mm [0.050"] X 30.48mm [1.200"] Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 1.27mm [0.050"] 5.33mm 3.74mm [0.147"]	Original	PDF	BGA216A FR4/G10 25X25 SF-BGA216A-B-11
Untitled Abstract: No abstract text available Text: Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T e R P N M L K e2 J H G F E D C B A shape optional 4x 1 2 3 4 5	Original	PDF	BGA217: OT710-1 MS-034
h7673 Abstract: 360-Pin MPSU 60 transistor tray dimensions BGA21 Text: TRAY CONTAINER UNIT : mm 5 x 12=60 20.15 135° C MAX. 23.90 BGA21 × 21A A' 21.20 23.90 26.05 21.20 NEC 95.6 135.9 MPSU A 262.9 315.0 322.6 SECTION A-A' (4.62) 6.35 7.62 21.20 Applied Package Quantity (pcs) 360-pin Plastic BGA (21×21) (FLIP CHIP TYPE)	Original	PDF	BGA21 360-pin BGA21 SSD-A-H7673 h7673 MPSU 60 transistor tray dimensions
BGA217 Abstract: MS 034 SOT710-1 MS-034 sot710 Text: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T e R P N M L K e2 J H G F	Original	PDF	BGA217: OT710-1 MS-034 BGA217 MS 034 SOT710-1 MS-034 sot710
337 BGA Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015 Text: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)	Original	PDF	BGA21 21ESP 256-pin 272-pin 292-pin 320-pin 337-pin SSD-A-H7071-3 337 BGA tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA217 package SOT710-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	BGA217 OT710-1 OT710-1
BGA217 Abstract: SF-BGA217A-B-11 Text: D Package Code: BGA217A C 20.32mm [0.800"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 20.32mm [0.800"] Top View reference only 2 1.27mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]	Original	PDF	BGA217A FR4/G10 SF-BGA217A-B-11 BGA217
SF-BGA213A-B-11 Abstract: No abstract text available Text: D Package Code: BGA213A C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]	Original	PDF	BGA213A FR4/G10 SF-BGA213A-B-11
SAMSUNG MCP Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)	Original	PDF	KBB0xB400M 16Mx16) 4Mx16) 80-Ball 80x12 SAMSUNG MCP ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Untitled Abstract: No abstract text available Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised	Original	PDF	K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX
Untitled Abstract: No abstract text available Text: AT91SAM ARM-based Embedded MPU SAM9X35 SUMMARY DATASHEET Description The SAM9X35 is a highly-integrated 400 MHz ARM926EJ-S embedded MPU, featuring an extensive peripheral set and high bandwidth architecture for industrial applications that require refined user interfaces and high-speed communication.	Original	PDF	AT91SAM SAM9X35 SAM9X35 ARM926EJ-Sâ 10-bit 10/100Mbps
Untitled Abstract: No abstract text available Text: ARM-based Embedded MPU SAM9G35 DATASHEET Description The SAM9G35 is a member of the Atmel series of 400 MHz ARM926EJ-S embedded MPUs that support high bandwidth communication and advanced user interfaces and are optimized for industrial applications such as building automation,	Original	PDF	SAM9G35 SAM9G35 ARM926EJ-Sâ 10-bit
Untitled Abstract: No abstract text available Text: ARM-based Embedded MPU SAM9N12 SAM9CN11 SAM9CN12 SUMMARY DATASHEET Description Based on the ARM926EJ-S processor, the Atmel SAM9N12/CN11/CN12 devices offer the frequently-requested combination of user interface functionality and high data rate connectivity, with LCD Controller, resistive touch-screen, multiple UARTs, SPI,	Original	PDF	SAM9N12 SAM9CN11 SAM9CN12 ARM926EJ-Sâ SAM9N12/CN11/CN12 32-Kbyte
AT91SAM9260B-CU Abstract: AT91SAM9260B-QU application note SAM9260 Text: Features • 180 MHz ARM926EJ-S ARM Thumb® Processor – 8 KBytes Data Cache, 8 KBytes Instruction Cache, MMU • Memories • • • • – 32-bit External Bus Interface supporting 4-bank SDRAM/LPSDR, Static Memories, CompactFlash, SLC NAND Flash with ECC	Original	PDF	ARM926EJ-STM 32-bit 32-kbyte 10-bit 6221KS 17-May-11 AT91SAM9260B-CU AT91SAM9260B-QU application note SAM9260

SAMSUNG MCP Abstract: samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5 Text: Preliminary MCP MEMORY K5A3x40YT B B Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History 0.0 Initial Draft Draft Date Remark February 22, 2002 Preliminary	Original	PDF	K5A3x40YT 4Mx8/2Mx16) 512Kx8/256Kx16) 512tRDR 69-Ball 08MAX SAMSUNG MCP samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5
Untitled Abstract: No abstract text available Text: Features • Core • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,	Original	PDF	ARM926EJ-Sâ 64-Kbyte 32-Kbyte 32-bit 24-bit 1032Aâ 27-Jul-11
Untitled Abstract: No abstract text available Text: Features • Core • • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,	Original	PDF	ARM926EJ-Sâ 64-Kbyte 32-Kbyte 32-bit 24-bit 11052Câ 21-Nov-11
6242E Abstract: 4583 dual schmitt trigger 6242b la 4508 ic pin diagram R1100D121C AT91Bootstrap CS 5609 ARM926EJ-S ISO7816 5609 dec Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer	Original	PDF	ARM926EJ-STM 16-bits 6242E 11-Sep09 4583 dual schmitt trigger 6242b la 4508 ic pin diagram R1100D121C AT91Bootstrap CS 5609 ARM926EJ-S ISO7816 5609 dec
BATM Advanced Communications Abstract: ARM926EJ-S ISO7816 0x0792603F Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer	Original	PDF	ARM926EJ-STM 16-bits 6242BS 14-Sep-07 BATM Advanced Communications ARM926EJ-S ISO7816 0x0792603F
at91sam9g10 Abstract: AT91SAM9G10-CU 16-KB ARM926EJ-S ISO7816 Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer	Original	PDF	ARM926EJ-STM 16-bits 6462AS 03-Jun-09 at91sam9g10 AT91SAM9G10-CU 16-KB ARM926EJ-S ISO7816
Untitled Abstract: No abstract text available Text: Features • Core • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,	Original	PDF	ARM926EJ-Sâ 64-Kbyte 32-Kbyte 32-bit 24-bit 11053Bâ 22-Sep-11
AT91SAM9260B-CU Abstract: AT91SAM9260 Electrical Characteristics AT91SAM9260B AT91SAM9260 pwm AT91SAM9260-CU AT91SAM9260B-QU 217-LFBGA d1159 AT91SAM9260 AT91SAM9260-QU ethernet controller Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 8-KByte Data Cache, 8-KByte Instruction Cache, Write Buffer	Original	PDF	ARM926EJ-STM 432-byte 6221IS 12-Aug-08 AT91SAM9260B-CU AT91SAM9260 Electrical Characteristics AT91SAM9260B AT91SAM9260 pwm AT91SAM9260-CU AT91SAM9260B-QU 217-LFBGA d1159 AT91SAM9260 AT91SAM9260-QU ethernet controller
37 PIN TFT MOBILE DISPLAY 8K Abstract: ARM926 ISO7816 ARM926EJ-S 0X004 Universal Transceivers VIA ARM926 LCDD0-LCDD23 Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer	Original	PDF	ARM926EJ-STM 16-bits 6242DS 06-Jan-09 37 PIN TFT MOBILE DISPLAY 8K ARM926 ISO7816 ARM926EJ-S 0X004 Universal Transceivers VIA ARM926 LCDD0-LCDD23
Untitled Abstract: No abstract text available Text: P-BGA216-2323-1.00A3K Uniti nn Jul.2003	OCR Scan	PDF	P-BGA216-2323-1 00A3K

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BGA21 Search Results

BGA21 Price and Stock

Fischer Connectors ICKBGA21X21

Fritz Kuebler Gmbh 8.5863.121B.GA21.0030

Fritz Kuebler Gmbh 8.5873.542B.GA21.0020

Fritz Kuebler Gmbh 8.5853.322B.GA21.0020

Fischer Elektronik GmbH & Co KG ICKBGA21X21

BGA21 Datasheets Context Search

SF-BGA216A-B-11

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h7673

BGA217

337 BGA

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BGA217

SF-BGA213A-B-11

SAMSUNG MCP

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AT91SAM9260B-CU

SAMSUNG MCP

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6242E

BATM Advanced Communications

at91sam9g10

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AT91SAM9260B-CU

37 PIN TFT MOBILE DISPLAY 8K

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