Untitled
Abstract: No abstract text available
Text: Package outline WLCSP12: wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm A E NVT4555UK B A2 ball A1 index area A A1 D detail X e1 e ZE2 C Øv Øw b C A B C y D e C B ZE1 ball A1 index area e2 1/2 e A 1 ZD1 2 3 X ZD2 2 mm scale Dimensions mm are the original dimensions
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WLCSP12:
NVT4555UK
wlcsp12
nvt4555
nvt4555uk
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Untitled
Abstract: No abstract text available
Text: Package outline BGA564: plastic ball grid array package; 564 balls; body 40 x 40 x 1.75 mm SOT947-1 B D D1 A ball A1 index area E1 E A A1 A2 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E
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BGA564:
OT947-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm B D LPC1768UK A ball A1 index area A2 A A1 E detail X e1 1/2 e e Øv Øw b C A B C C y K e J H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 3 mm
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WLCSP100:
LPC1768UK
wlcsp100
lpc1768uk
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e ∅v ∅w b e C C A B C M M y y1 C H G F e E e2 D C 1/2 e B A ball A1 index area 1 2 3 4 5 6 7 8
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TFBGA64:
OT969-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area
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LFBGA208:
OT966-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm B D SOT950-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A e e2 ball A1 index area
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TFBGA208:
OT950-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9
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TFBGA256:
OT999-1
MO-195
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MPBG005A – JANUARY 1997 GFQ S-PBGA-N520 PLASTIC BALL GRID ARRAY PACKAGE 43,00 SQ 40,64 SQ 1,27 A 1 Solder Balls 3,35 0,60 Seating Plane 0,15 4073205-2/B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.
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MPBG005A
S-PBGA-N520)
4073205-2/B
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MPBG007 – NOVEMBER 1995 GFP S-PBGA-N256 PLASTIC BALL GRID ARRAY PACKAGE 30,00 SQ 27,94 SQ 1,27 TYP A 1 2,520 Solder Balls 0,600 4073206/A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.
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MPBG007
S-PBGA-N256)
4073206/A
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MPBG001 – NOVEMBER 1995 GFU S-PBGA-N560 PLASTIC BALL GRID ARRAY PACKAGE 42,50 SQ 39,37 SQ 1,27 A 1 1,17 32 Solder Balls 2,33 Seating Plane 0,60 0,15 4073203 / A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.
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MPBG001
S-PBGA-N560)
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MPBG004 – NOVEMBER 1995 GGC S-PBGA-N388 PLASTIC BALL GRID ARRAY PACKAGE 0,79 Dia Solder Balls 0,73 35,00 SQ 20,30 SQ 1,63 TYP 1,27 TYP A 1 0,80 1,83 0,38 0,65 4073212/A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.
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MPBG004
S-PBGA-N388)
4073212/A
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MPBG002 – NOVEMBER 1995 GFV S-PBGA-N352 PLASTIC BALL GRID ARRAY PACKAGE 35,00 SQ 31,75 SQ 1,27 A 26 1 0,78 Solder Balls 1,38 Seating Plane 0,60 0,15 4073202 / A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.
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MPBG002
S-PBGA-N352)
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489AA
Abstract: No abstract text available
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 10 PIN FLIP−CHIP CASE 489AA−01 ISSUE A DATE 04 MAY 2004 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS.
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489AA-01
489AA
489AA
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA112: plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm D SOT630-1 A B ball A1 index area A A2 E A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C M L K e J H G e2 F E 1/2 e D C B A ball A1 index area
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TFBGA112:
OT630-1
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Untitled
Abstract: No abstract text available
Text: Package outline BGA420: plastic ball grid array package; 420 balls; body 23 x 23 x 1.55 mm D SOT847-2 B A D1 ball A1 index area A2 A 1 A E E1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A M M y y1 C C A B C e e2 1/2 e 1 shape
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BGA420:
OT847-2
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N
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HBGA672:
OT835-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA204: plastic thin fine-pitch ball grid array package; 204 balls; body 11 x 11 x 0.8 mm A B D SOT713-1 ball A1 index area A E A2 A1 detail X C e1 e Y V T P M K H F D B ball A1 index area ∅v ∅w b 1/2 e M M y y1 C C A B C W e U R N L
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TFBGA204:
OT713-1
MO-195
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA141: plastic low profile fine-pitch ball grid array package; 141 balls A B D SOT1079-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11
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LFBGA141:
OT1079-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13
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LFBGA169:
OT1024-1
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Untitled
Abstract: No abstract text available
Text: Package outline BGA288: plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm D SOT869-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional 4x
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BGA288:
OT869-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA256: plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink D SOT850-1 B D1 A ball A1 index area j A E1 E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C T R e P N M L K J H G F E D C B A
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HBGA256:
OT850-1
MS-034
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Untitled
Abstract: No abstract text available
Text: 3.3V CMOS 32-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS AND BUS-HOLD FE A T U R E S : - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 96 balls
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32-BIT
250ps
MIL-STD-883,
200pF,
ALVCH32374:
IDT74ALVCH32374
32-bit
F96-1
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Untitled
Abstract: No abstract text available
Text: 3.3V CMOS 36-BIT UNIVERSAL BUS TRANS CEIVER WITH 3-STATE OUTPUTS AND BUS-HOLD FEATURES: - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 114 balls
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36-BIT
250ps
MIL-STD-883,
200pF,
ALVCH32501:
IDT74ALVCH32501
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313 pin PBGA
Abstract: ami 2470
Text: AMI A M ! S E M IC O N D U C T O R % s PBGA Packaging Capabilities . . Description Surface Mount The Plastic Ball Grid Array PBGA is a high density surface mount package for low stress operating environments. The package includes BT Laminate base, plastic overmolded body and tin-lead solder balls. With the thermal
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