LA-BGA-740-S-B-02
Abstract: LS-BGA255A-02
Text: 2.840" 37 J4-1 38 2 2 38 J1-1 37 37 38 37 2 J5-1 38 J3-1 2 37 38 J2-1 2 1.188" 2.770" Top View 0.748" Side View LS-BGA255A-02 0.827" Plugged 0.233" 0.150" 1 0.236" 2 1.266" 0.725" 0.140" Plugged 3 SF-BGA255A-B-01 1 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material.
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LS-BGA255A-02
SF-BGA255A-B-01
FR4/G10
LA-BGA-740-S-B-02
LS-BGA255A-02
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BGA360
Abstract: PPC603 bga255 PPC750
Text: 1.060" 1.000" 0.984" PPC603 BGA255 PPC750 (BGA360) A1 A1 0.900" 0.984" 0.050" Ø 0.025" pad 0.051" Top View Bottom View Removeable Pins to Aid In Alignment. 3 0.048" 1 1 2 2 Side View 3 0.024"±0.005" Substrate: 0.0480"±0.007" FR4/G10 or equivalent high
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PPC603
BGA255)
PPC750
BGA360)
FR4/G10
19x19
DC-BGA/BGA-750-S-B-02
BGA360
PPC603
bga255
PPC750
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16x16 bga
Abstract: logic analyzer 16X16 LA-BGA-740-Z-B-02 BGA zif socket DASF00504
Text: 38 37 J5-1 2 J2-1 37 2 2 38 J3-1 J4-1 38 37 2 2.840" 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A B C D E F G H J K L M N P R T 2.770" Top View 38 37 2 38 J1-1 37 Side View 0.897" Plugged 0.233" 0.150" 1 0.237" 2 1.266" 0.725" 0.140" Plugged 3 SF-BGA255A-B-01
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SF-BGA255A-B-01
16X16
FR4/G10
LA-BGA-740
-Z-B-02
LA-BGA-740-Z-B-02
16x16 bga
logic analyzer
16X16
BGA zif socket
DASF00504
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180 ohm resistor
Abstract: Tektronix LA-BGA-740-S-B-01
Text: 2.550" 0.845" 8 16 Hi_A A1 1 H 2.525" 15 T JTAG Lo_D Lo_E 0.845" 0.853" Side View LS-BGA255A-02 0.858" Each Mictor connection contains a 180 ohm resistor to source. 0.480" 0.827" Plugged PROPRIETARY INFORMATION Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD
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LS-BGA255A-02
LA-BGA-740
-S-B-01
LA-BGA-740-S-B-01
180 ohm resistor
Tektronix
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SF-BGA255B-B-11
Abstract: BGA255
Text: D Package Code: BGA255B C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA255B
FR4/G10
SF-BGA255B-B-11
BGA255
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BGA zif socket
Abstract: 16x16 bga 16X16 LA-BGA-603E-Z-B-02
Text: 38 37 J5-1 2 J2-1 37 2 2 38 J3-1 J4-1 38 37 2 2.840" 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A B C D E F G H J K L M N P R T 2.770" Top View 38 37 2 38 J1-1 37 Side View 0.897" Plugged 0.233" 0.150" 1 0.236" 2 1.266" 0.725" 0.140" Plugged 3 SF-BGA255A-B-01
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SF-BGA255A-B-01
16X16
FR4/G10
603/603E
LA-BGA-603E-Z-B-02
BGA zif socket
16x16 bga
16X16
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BGA360
Abstract: ppc603 PPC750 BGA255
Text: PPC603 BGA255 PPC750 (BGA360) A1 A1 0.984" Ø 0.025" pad 0.984" Top View Bottom View 0.050" 0.048" 1 1 2 Substrate: 0.0480"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Balls: Eutectic 63/37 SnPb. 2 Side View 0.024"±0.005"
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PPC603
BGA255)
PPC750
BGA360)
FR4/G10
19x19
DC-BGA/BGA-750-S-B-01
BGA360
ppc603
PPC750
BGA255
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SF-BGA255A-B-11
Abstract: No abstract text available
Text: D SF-BGA255A-B-11 C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.64mm [0.025"] X Top View reference only 19.05mm [0.750"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"] [0.210"]
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SF-BGA255A-B-11
FR4/G10
SF-BGA255A-B-11
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PPC603
Abstract: BGA360 PPC750 ST BGA
Text: PPC603 BGA255 PPC750 (BGA360) A1 A1 0.984" Ø 0.025" pad 0.984" Top View 0.050" Bottom View 1 0.161" ±0.005" 1 Substrate: 0.0480"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Substrate: 0.0985"±0.007" FR4/G10 or equivalent high
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PPC603
BGA255)
PPC750
BGA360)
FR4/G10
DC-BGA/BGA-750-S-T-01
PPC603
BGA360
PPC750
ST BGA
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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CR10-100J
Abstract: MCR10-EZHM-J-301 ROHM R25 sanyo c35 L1U10 crystal 2pin 30BF10 MTD20N03HDL SW DIP8 0603YC104JAT2A
Text: # Board Station BOM file PPMC603_ X1 # date : Thursday O ctober 14, 1999; # Variant : No_Stuf f Talos 745/107 PMC CARD 8/24/00 0:00 PPMC745_X1 16:24:55 Modified for support partipular processor updated for the COP changes R30 from 1K to 100 ohms line 33,34
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PPMC603_
PPMC745
rc0805
rnet1632
MPC745
BGA255
MTD20N03HDL
QS3257Q
RC5051M
RM73B1JT102J
CR10-100J
MCR10-EZHM-J-301
ROHM R25
sanyo c35
L1U10
crystal 2pin
30BF10
MTD20N03HDL
SW DIP8
0603YC104JAT2A
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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XC2018,
XC2018
XC3020,
XC3064,
XC3042,
XC3090,
XC3090
FP-X4KPG223-01
reflow profile FOR LGA COMPONENTS
bga96
BGA165
BGA292
SO8A
CA-SO18A-Z-J-T-01
SF-QFE352SA-L-01
BGA480B
CA-PLCC44-D-P-T-01
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