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    7320CR Search Results

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    121C-2

    Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
    Text: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4


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    PDF XC4005XL PQFP-160 PLCC-84, HQFP-304, VQFP-100 XC4044XL XC4013XLA 121C-2 XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478

    J-STD-020

    Abstract: JSTD-020 JSTD020 235c J-STD020
    Text: 01/25/2006 RELIABILITY REPORT FOR DS21Q50, Rev C1, 100 LQFP, 14x14x1.4mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


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    PDF DS21Q50, 14x14x1 30C/60% J-STD-020 JSTD-020 JSTD020 235c J-STD020

    JEDEC hast

    Abstract: No abstract text available
    Text: 04/26/05 RELIABILITY REPORT FOR DS80C400, Rev B1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


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    PDF DS80C400, JEDEC hast

    XC95XXXL

    Abstract: XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices
    Text: The Reliability Data Program Expanded Version July 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4


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    PDF XC4005XL PQFP-160 PLCC-84, HQFP-304, VQFP-100 XC4044XL XC4013XLA XC95XXXL XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices

    Ablebond 84-1LMI

    Abstract: 84-1LMI JESD22 0/7C62126/7V
    Text: Cypress Semiconductor Qualification Report QTP# 97506, VERSION 1.0 May, 1998 1 Meg SRAM, R42 Technology, Fab 4 Qualification CY62126/7V 64K x 16 Static RAM, 2.7V - 3.6V Operation Cypress Semiconductor 1 Meg SRAM, R42 Technology, Fab 4 Devices:CY62126/7V Rev. A


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    PDF CY62126/7V 44-pin CY7C1021V33-VC 30C/60 Ablebond 84-1LMI 84-1LMI JESD22 0/7C62126/7V

    C18045

    Abstract: No abstract text available
    Text: 08/23/2004 RELIABILITY REPORT FOR DS80CH11, Rev A4 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


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    PDF DS80CH11, 60C/60% J-STD-020 C18045

    C18045

    Abstract: CDA151 9918 9936
    Text: 05/31/2005 RELIABILITY REPORT FOR DS80C390, Rev C3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


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    PDF DS80C390, Reliab918 30C/60% C18045 CDA151 9918 9936

    A9701

    Abstract: MIL-PRF38535 XC1700D XC7000 XC9500 xc4310 XC3390A vqfp100 package XC95XX XCS40 failure
    Text: The Reliability Data Program Expanded Version Jan. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4


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    PDF PLCC-20, A9701 MIL-PRF38535 XC1700D XC7000 XC9500 xc4310 XC3390A vqfp100 package XC95XX XCS40 failure

    Atmel LOT marking

    Abstract: Atmel 818 atmel part "marking" EIA-556-A atmel package marking ATMEL package qualification 8S02 eftec 64 AT558 Atmel MARKING CODE tqfp
    Text: AT55.8K Qual Pac ATMEL, Colorado Springs, Colorado 55.8 QualPack 1 ATMEL SEMICONDUCTORS Qualpack AT55.8K 1.0 Contents Cover Page………………………………………………………… 1 1.0 Contents……………………………………………………………. 2


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    PDF

    XcxxX

    Abstract: vqfp100 package PQFP160 XILINX mp8000ch4 marking 611 016 soic-8 XCS40 failure Xcs17 xc95144 XC95144 equivalent
    Text: The Reliability Data Program Expanded Version April. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4


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    PDF PLCC-20, XcxxX vqfp100 package PQFP160 XILINX mp8000ch4 marking 611 016 soic-8 XCS40 failure Xcs17 xc95144 XC95144 equivalent

    7320CR

    Abstract: Eftec 64t
    Text: 03/06/2003 RELIABILITY REPORT FOR DS21552, Rev B1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


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    PDF DS21552, JESD78, 7320CR Eftec 64t

    AT56K

    Abstract: atmel 936 Atmel PART marking atmel 731 ATMEL flow soldering atmel TQFP Package 64 lead code date marking kla 431 atmel MSL 1 AT5622 at56700
    Text:  Semiconductors AT56K 1 QualPack AT56K  Semiconductors 1.0 Contents 1.0 Contents . 2 2.0 General Information . 3


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    PDF AT56K AT56K atmel 936 Atmel PART marking atmel 731 ATMEL flow soldering atmel TQFP Package 64 lead code date marking kla 431 atmel MSL 1 AT5622 at56700

    8361J

    Abstract: mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
    Text: February 24, 2005 CN 022405 Customer Notification Assembly Subcontractor Change for QFP and PLCC Packaged Devices Dear Valued Customer: This notification is for the purpose of informing you of a change by Mindspeed Technologies in the packages used for the following devices:


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    PDF CX28392-25 CX28394-25 CX28342-11 CX28343-11 CX28344-11 R6786-24 28XXX-PCN-002-A 8361J mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700

    JEDEC JESD22-B116 free

    Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see attachment for affected part #s). Date Effective: 3/20/2003 Contact: George Snell


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    PDF SR-0212-02 EME-G700 JEDEC JESD22-B116 free SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time

    9936

    Abstract: 9936 b EFTEC 64T Epoxy
    Text: 12/04/2002 RELIABILITY REPORT FOR DS21Q42 & DS21Q44 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


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    PDF DS21Q42 DS21Q44 30C/60% 9936 9936 b EFTEC 64T Epoxy