ST INDO
Abstract: No abstract text available
Text: 10 flfB NOTES 51065 v ' J - a MATE WITH :51065 SERIES 210-' á pitch S f NON-ACCUM. E — MATERIAL OXJ\- : 6 6 ^ 0 ^ U L 9 4 V —0 WAFER : 66NYL0N , UL94V-0 O 0 0 .8 l0-05 i PIN ( t = 1. 6) RECOMMENDED , BOARD sBRASS, GOLD (Au) PLATING 2m ^yom u (REFERENCE)
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66NYL0N
UL94V-0
hi/502603-*
SD-502603-001
EN-02JA1021)
ST INDO
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FJOO-0176-34
Abstract: No abstract text available
Text: C IR C U IT M o -1 T. > A»#G *24 CULIOS?, WL f007i «8C*hJB& * I.O-l.SmnOTA 2. «-*4 s i* v-¡T' - 66-*- -f o ^ CUL94V-03 NOTES; 1. APPLICABLE WIRE SIZE . AUG «24 <UL1OGT,UL10075 INSULATION DIA , T.O-T.SmmOlA 2. MATERIAL . HOUSING - 66NYL0NCUL94V-OJ CONTACT - PRE-TIN PHOS-HROZ
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f007i
UL10075
66NYL0NCUL94V-OJ
FJOO-0176-34
FJOO-0176-34
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27XT
Abstract: No abstract text available
Text: N 0 <D N 7 NOTE. o / \ MATER I AL t HOUSING «GLASS FILLED 66NYL0N CUL 9 4V —OJ BLACK. CONTACT* PHOSPHOR-BRONZE F IN IS H « CONTACT: 0 . 3 ^ " lw Au AT CONTACT AREA, 1 ^ w - T IN LEAD AT T IN E , OVER Ni ^ BOSS FOR P O S IT /O N IN G .P /N - 7 , - 2 , - 3 , - 4
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66NYL0N
04teB
C-176378
27XT
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Xx14
Abstract: LE32
Text: 10 iiie NOTES 1. &£*§£ : 51065 ->u-x MATE WITH : 51065 SERIES 2 # * MATERIAL : 66^M □ v - U L94V -0 WAFER : 66NYL0N , UL94V-0 PIN : BRASS, TIN-LEAD PLATING 5.65 *v? äTI£*rofö!&y' >Rictttaroc i A KINK TO BE APPLIED AS FOLLOWS, 2 CIRCUIT HAS NO KINK.
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66NYL0N
UL94V-0
4-xx12
4-xx14
4-xx19
4-xx13
SD-53254-003
EN-02JAI021)
Xx14
LE32
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SD-5268-NA
Abstract: 5268-02A 01HB Molex 5264
Text: M E .6 C D .75 ;.5 c PITCH |t| NOTE: CIRCUIT NO. |t| I.MATES WITH : 5264 v — ! v ! v / v ! v v SERIES VI' LV-f—9—?-N /WAFER:66NYL0N,GLA REINFORCED,UL94V-0 5 47.5 22- 05-7205 52 68-20A 20 49.9 48.5 45 -7195 -I9A 19 47.4 46 42.5 -7 185 - I8A 18 44.9
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66NYL0N
UL94V-0
268-20A
268-02A
92/0S/3
SD-5268-NA
SD-5268-NA
5268-02A
01HB
Molex 5264
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SD-5267-NA-X
Abstract: 5267-02AX BY96 5267-02 MOLEX 5264 dwg Molex 5264 06-AX 5267-02A-X 5264 05AX
Text: X I < M U 2.5i0J NON-ACCUMULATIVE UD Osi (t^ ?) (PITCH) m OÛ </) ÎTT51 .6 A B .8 ^ 0 0 .9 (PUNCHED) CIRCUIT NO. ftS3 NOTES: (PITCH) I RECOMMENDED P.C.BOARD HOLE DIM. (t=l.G) O x / \ - i e e i - 'i 'a y . | I I HI II II II P u l9 4 v -o W AFER:66NYL0N,GLASS REINFORCED,UL94V-
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66NYL0N
UL94V-
SD-5267-NA-X
-09A-X
-08A-X
-07A-X
-06A-X
-05A-X
-04A-X
-03A-X
SD-5267-NA-X
5267-02AX
BY96
5267-02
MOLEX 5264 dwg
Molex 5264
06-AX
5267-02A-X
5264
05AX
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T1216
Abstract: No abstract text available
Text: a. V NATURAL m BLA CK i~ f- MATERIAL M X '^4 PIN : BRASS, Sn OVER COPPER A 1. «ft J\ 0 V V ? : 66 + 4 □ 's O l^ X W APPLY FOR CIRCUIT/2)=EVEN ? PLATED RED ) . U L 9 4 V —0 HOUSING : 66NYL0N (G.F.), UL94V-0 ¡501646 V ' i - X MATE WITH : 501646 SERIES
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UL94V
66NYLON
UL94V-0
SD-501645-001
EN-02JA1021)
T1216
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Untitled
Abstract: No abstract text available
Text: 10 +FS5 NOTES 1. 5I0 6 5 v ' J - a MATE WITH : 5 I065 SERIES 2. MATERIAL O X J \- : 6 6 ^ 0 ^ U L 9 4 V —0 WAFER : 66NYL0N , UL94V-0 PIN : BRASS, GOLEKAu PLATING 2 m ^ y o m u KINK TO BE APPLIED AS FOLLOWS, 2 CIRCUIT HAS NO KINK. CKT - ^ C g n i o . 6« L t MORE THAN 6CKT
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66NYL0N
UL94V-0
-I470
-I370
-I070
SD-502603-001
EN-02JA1021)
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Untitled
Abstract: No abstract text available
Text: ai N I « O îfese* 1. CIRCUIT Mo.I I * aw g # 2 8 -2 6 CULI O G K U L l0 0 7 : 2 . * * 1 ’ 0 - 1 . SmmOIA - 66-*- -r o ^ CUL94V-0) i' h 'y NOTES, 1 . APPLICABLE WIRE S IZ E « AWG * 2 8 -2 6 CUL10 6 1 , UL10073 INSULATION OIA , 1 . 0 - 1 .SmmDIA 2 . MATERIAL * HOUSING - 66NYL0NCUL94V-0J
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CUL94V-0)
CUL10
UL10073
66NYL0NCUL94V-0J
00-017S-94
C-179414
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Untitled
Abstract: No abstract text available
Text: 10 ;X§5 NOTES L YrWffiX I 5 065 IT 'J-X ! MATE WITH : 5 I065 SERIES S fS i o o 2. ATM MATERIAL OX/\ - : 6 6 W 4 D 3 A U L 9 4 V - 0 WAFER : 66NYL0N , UL94V-0 c XX PIN WYTTWiS A ^y -y a T E 0 M S L M M J-m t\U iW z y „ 2 S Q Y 4 X A IU KINK TO BE APPLIED AS FOLLOWS,
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66NYL0N
UL94V-0
10DDsBX
SD-53253-001
EN-02
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Untitled
Abstract: No abstract text available
Text: N <D 0 N C IR C U IT N o . 1 N 1. I a O A r— 'S/S ill $ < o i/ •f f rh I1 I1 1 | 1 = 7 h . 108-5385 « 114-5174 16U* S» Tt ! i NOTES, 1. APPLICABLE WIRE SIZE « AWG #22 CUL2651) INSULATION DIA , 1.0-1.5mm« 2. MATERIAL » HOUSING - 66NYL0NCUL94V-0) CONTACT - PRE-TIN PH0S-8R0Z
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UL2651)
CUL94V-0)
CUL2651)
66NYL0NCUL94V-0)
108-S385
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Untitled
Abstract: No abstract text available
Text: 10 ;i§3 NOTES L G O : 5 065 i / U - a MATE WITH : 5 I065 SERIES 2. MATERIAL O l/ \ - : 6 6 t ' f D ^ U L 9 4 V - 0 WAFER : 66NYL0N , LJL94V-0 G t^y a±0.3 RECOMMENDED P.C. BOARD HOLE DIM. REFERENCE ^ A 0.6 Z Y 6 ff iliL t MORE THAN G CKT — / J ra i «
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53254SERIE5
53253SERIE
-x/53254
SERIES/53254
-X-/53253
SERIES/53253
51065/532530R51065/53254
SD-53253-001
EN-02JA
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5045-02A
Abstract: BL 05A
Text: 2 E -rXIM 2£0 3l0-N 3 o » NOTES I (SI < io . l/l I MATERIAL WAFE R : 66NYL0N, UL94V-0 PIN : 00.635 BRASS, TIN OVER COPPER PLATING & TO BE APPLIED FOR 6CKT. AND MO RE THAN 6CKT. & NO SLIT IS PROVIDED FOR 5CKT. AND LESS THAN 5CKT. 4. LEGEND 5045-NA-* DYED COLOR CODE -BL
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66NYL0N,
UL94V-0
5045-NA-*
045-20A-YE
-09A-YE
-08A-YE
-07A-YE
-06A-YE
-05A-YE
-04A-YE
5045-02A
BL 05A
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ck 66 ul94v-0
Abstract: No abstract text available
Text: 10 iiie NOTES 1. &£*§£ : 51065 ->u-x MATE WITH : 51065 SERIES 2 #* MATERIAL : 66^M □v -UL94V-0 WAFER : 66NYL0N , UL94V-0 PIN : BRASS, TIN-LEAD PLATING A *v? äTI£*rofö!& y' >R ictttaroc i KINK TO BE APPLIED AS FOLLOWS, 2 CIRCUIT HAS NO KINK. CKT • ^ “
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-UL94V-0
66NYL0N
UL94V-0
53253-xx12
53253-xx14
53253-xx19
53253-xx13
SD-53253-004
EN-02JAI021)
ck 66 ul94v-0
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Untitled
Abstract: No abstract text available
Text: THIS DRAWING Q 15 U N P U B L I S H E D . COPYRIGHT 19 RELEASED FOR PUBLICATION BY AMP ,19 J INCORPORATED.ALL RIGHTS RESERVED. cnrr REVISIONS •5Ä T T ECN DESCRIPTION LTR R E D R AW N W / C H A N G E FJ00-5116-96 ±0.3 ± 0 . 3 0.5. CIRCUIT No. w TYPE ? "i
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FJ00-5116-96
ECO-10-000444
66NYL0N
CUL94V-0)
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B1115
Abstract: JIS B1122
Text: THIS DRAWING IS UNPUBLISH ED. COPYRIGHT R E l E a S H TÔR P u B l i ì a Tìò n - BY TYCO ELECTRONICS CORPORATION. LOC D IST J AU" RIGHTS R ESER V E D - REVISIONS LTR E1 D ESCRIPTION REVISED ECR— 0 6 — 0 0 3 2 5 7 t- 'j D DATE DWN
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10FEB06
B1115
B1122
66NYL0N
31MAR2000
JIS B1122
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Untitled
Abstract: No abstract text available
Text: 10 3.7 a ts : NOTES: A c k t . no. EVEN NUMBER SOLDER A C K T c NO c 1 m i&SgCQVJL^-^-JL TAIL. g O T V J L y - x - J U ODD NUMBER SOLDER TAIL. l J L J l J l J l J l J 11 » m MATERIAL: 5 - ^ J L : U V f c f lS TERMINAL : PHOSPHOR 0.1 MICROMETER J4±. PLATING CONTACT AREA * Au PLATING 0.1 MICROMETER MIN.
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66NYL0N
UL94V-0
SD-52030-019
EN-02JA1021)
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Untitled
Abstract: No abstract text available
Text: 6 7 8 2 B A±0.1 2±0.l NON-ACCUM., PIT C H ! 3.9 O j 1TB i=T ft T Jh Jh r r T T T ; T ft ft M T T ft . t! T 51 M M M T T i_ 1 T lM 0O.85±O.O5 l T ij in = li:" CIRCUIT NO. I ( t = 1 . 6)
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66NYL0N,
UL94V-0
SD-52693-*
11TH0UT
01IIS52693
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Untitled
Abstract: No abstract text available
Text: 10 NOTES. 1. 1SLT- L t : 50 1334-x*xx C 43+0.5 1.0 APPLICABLE TERMINAL : 5 0 1 3 3 2 -* (PITCH) 2 . a/ATlT : 50 133 MATE WITH : 5 0 1 33 1 -* ,CKT N0.1 X A 4 - 2 ~ 5 f i l i - S D - 5 0 1 3 3 0 - 0 0 1 4#S?.T3 <•' • REFER TO 5D-501330-001 ABOUT 2-5CKT.
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1334-x
5D-501330-001
66NYL0N
UL92V-0
6-15CKT.
00A/07/30
SD-501330-002
EN-02JA
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Untitled
Abstract: No abstract text available
Text: 10 HEADER HOUSING ASSEMBLY HEADER HOUSING ASSEMBLY 53254SERIES TERMINAL 50212/50346 SERIES TERMINAL 50212/50346 SERIES 51065 SERIES 51065 SERIES 51065 -> U -x /5 3 2 5 4 -> ' I - x 51065 SERIES/53254 SERIES MATED DRAWING REF. 51065 -> U -x /5 3 2 5 3 -> 'J- x ffi-j%t£tg|%l
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53254SERIES
SERIES/53254
SERIES/53253
QOVE06
SD-53253-001
EN-02JAI021)
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Untitled
Abstract: No abstract text available
Text: T H IS DRAWING GO CO PYRIG HT IS UNPUBL [S H E D . 19 | R E LEA SE D FOR P U B L IC A T IO N - .1 9 BIST R E V IS IO N S B Y AMP IN C O R PO R AT ED .ALL R IG H T S R E SE R V ED . D - ^_ S ^ j g f c R E D R A W N E]SS CCIRCUT N O . ) ^ *r • v b r - y - - !' —
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UULE55
UL94V-Q3
UL94V-0)
66NYL0N
AMP1470-19
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Untitled
Abstract: No abstract text available
Text: in < z i <r in » Q W A FER O^ *0.4a 5 A TYP.I2 NOTES PIN I. M A T ERIA L if t - — m — -^5 W AFER 0.05 it- PITCH) (NON ACCUM ULATIVE) e sc, RECOMMENDED P.C. BOARD HOLE DIM. 2.5 BSC. A TO B E A P P L IE D A NO S L IT IS OVER C O PPER PLA T IN G FOR 6CKT. AND MORE THAN 6CKT.
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66NYL0N
UL94V-0
J00976)
J0O686)
SD-5045-NA5
MOLES02198
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j 13009
Abstract: J 13009 - 2 e 13009 f mj 13009 E 13009 L p 13009 D 13009 K 13009R
Text: ± 0 N m ü re ID Is- ; / l \ t * *4 CUL a. O * id OQ z -D z ^ Í7-* ; : * ' ^ <? 94V -0) ^ & 7 b * 'J ^ V ' S> 3 C IR C U IT *7 6 6 -^- - f a -fe . J» . : . ^ ^ IT : » H l . N O .1) A * * ^ ^7 ^ ^ e in . 3 /aml¿X _L<iO — 'V =*c t ^ » Ä i S I 5 0 . 3 pm ü i,_ b < ^ .^ r> ^ =V , 8*P*|$1 p.miiX J^ co * ¥ - æ ^
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J-12583
30-JAN
j 13009
J 13009 - 2
e 13009 f
mj 13009
E 13009 L
p 13009
D 13009 K
13009R
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Untitled
Abstract: No abstract text available
Text: 4 3 1 2 *0.5 Ä.ı0. 1 18.1 in r\i rsi MOUNTING DIMENSIONS FOR P.C.B. 3.4 ,TOLERANCES ±0.1 4.6 20-01 C23.3) a o CD Z D Z 1 A o a H LU 7^. A EG * 0 2mm<50lHai-t:"?«'JS 1 7 20 47 , 1 7 2 8 5 0 2. •ttt'â'-t- ^ *§ ^ 3. i a Æ S Ü A A U t S - N O . 108-5124
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50lHai-t:
FJOO0513-00
66NYL0N
C-1722B7
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