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    33X33 Search Results

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    33X33 Price and Stock

    Laird, A DuPont Business KA150-2AC-33X33

    Thermally Conductive Chip Pad; Thickness:0.16Mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300Mm; External Width:300Mm; Product Range:- |Laird KA150-2AC-33X33
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    Newark KA150-2AC-33X33 Bulk 1
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    SMC Corporation of America ARP30K-03-3-X33US

    TAMPER PROOF PRECISION REGULATOR, ARP SERIES | SMC Corporation ARP30K-03-3-X33US
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS ARP30K-03-3-X33US Bulk 5 Weeks 1
    • 1 $84.85
    • 10 $84.85
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    Fischer Elektronik GmbH & Co KG ICK BGA 33 X 33 X 10

    Heatsink: extruded; black; L: 33mm; W: 33mm; H: 10mm; aluminium
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME ICK BGA 33 X 33 X 10 5 1
    • 1 $1.91
    • 10 $1.72
    • 100 $1.32
    • 1000 $1.32
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    Fischer Elektronik GmbH & Co KG ICK BGA 33 X 33 X 6

    Heatsink: extruded; black; L: 33mm; W: 33mm; H: 6mm; aluminium
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME ICK BGA 33 X 33 X 6 3 1
    • 1 $1.79
    • 10 $1.62
    • 100 $1.24
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    33X33 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    n 332 ab

    Abstract: PRBG0961FA-A
    Text: JEITA Package Code P-HBGA961-33x33-1.00 RENESAS Code PRBG0961FA-A Previous Code 961F7K D A ZD A 1 D1 b S AB e A1 e 3C B MASS[Typ.] 7.5g AL AK AJ AH AG AF AE AD AC AB AA Y W U E1 T R P N M L K J H G F E D ZE E V C B A C 3 y S S Index mark 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31


    Original     		PDF P-HBGA961-33x33-1 PRBG0961FA-A 961F7K n 332 ab PRBG0961FA-A

    CMBA023333

    Abstract: 33X33 Al6063
    Text: MBH33002 Series=CMBA023333 Series MBH33002 = 1373260 Model : CMBA023333 Series For 33x33 Chip set BGA Heat Sink CMBA023333 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 33x33mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm


    Original     		PDF MBH33002 CMBA023333 MBH33002 33x33 33x33mm UL94-V0) 15x15 Al6063

    Untitled

    Abstract: No abstract text available
    Text: IC149 Series SMT QFP/TQFP - 132 Pins (33x33) 0.635mm pitch Part Number (for IC-use) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):


    Original     		PDF IC149 33x33) 635mm 100Veff 700Veff IC149

    33X3

    Abstract: No abstract text available
    Text: IC149 Series SMT QFP/TQFP - 132 Pins (33x33) 0.635mm pitch Part Number (for IC-use) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):


    Original     		PDF IC149 33x33) 635mm 100Veff 700Veff IC149 33X3

    D-32

    Abstract: QFP44-P-910-0 vfd tube
    Text: Dear customers, About the change in the name such as "Oki Electric Industry Co. Ltd." and "OKI" in documents to OKI Semiconductor Co., Ltd. The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI Semiconductor Co., Ltd. on October 1, 2008.


    Original     		PDF

    LC4064ZE

    Abstract: BSDL Files infineon LFXP6C-3FN256I "x-ray machine" K4H560838E LC4064 LC4256ZE LFXP10C-3F256I LFxP3C-3TN144C PCI x1 express PCB dimensions artwork
    Text: LatticeXP Family Handbook HB1001 Version 03.4, September 2010 LatticeXP Family Handbook Table of Contents September 2010 Section I. LatticeXP Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1001 TN1050 TN1049 TN1082 TN1074 LC4064ZE BSDL Files infineon LFXP6C-3FN256I "x-ray machine" K4H560838E LC4064 LC4256ZE LFXP10C-3F256I LFxP3C-3TN144C PCI x1 express PCB dimensions artwork

    PC8640

    Abstract: openpic
    Text: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet - Preliminary Specification Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)


    Original     		PDF PC8640 PC8640D Dual-e600 125Gbaud) 64-bit 0948C openpic

    pci slot pinout

    Abstract: e2v GTX 120 PC8640
    Text: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)


    Original     		PDF PC8640 PC8640D Dual-e600 125Gbaud) 64-bit Chan49 0948E pci slot pinout e2v GTX 120

    led edison rgb datasheet

    Abstract: EP5W-2S00 EPBW-4S00 RGB LED 20w EPAW-2S00 RGB LED 10w EPBB-4S00 VA02 power LED 5W 10w High Power LED
    Text: 5~20W Star RGB Star Ultra High Power LED EdiPower Star Approved By Designer Checker Approval Customer Date：2006/9/1 Version：1.0 Device No. : 3-RD-01-H0005 EDISON OPTO CORPORATION 4F, No. 800, Chung-Cheng Rd, Chung-Ho, Taipei 235, Taiwan Tel: 886-2-8227-6996


    Original     		PDF Date2006/9/1 3-RD-01-H0005 220VAC 12VDC 24VDC led edison rgb datasheet EP5W-2S00 EPBW-4S00 RGB LED 20w EPAW-2S00 RGB LED 10w EPBB-4S00 VA02 power LED 5W 10w High Power LED

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MPC8568EEC Rev. 1, 10/2010 MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications Due to feature similarities, this document covers both the MPC8568E and MPC8567E features. For simplicity,


    Original     		PDF MPC8568EEC MPC8568E/MPC8567E MPC8568E MPC8567E MPC8568

    38S02

    Abstract: ipad data sheet MSM38S0000 MSM98S MSM98S000
    Text: DATA SHEET O K I A S I C P R O D U C T S 0.8µm Mixed 3-V/5-V MSM38S0000 Sea of Gates and MSM98S000 Customer Structured Arrays February 1995 TRADEMARKS AIX, DOS, PC, and Windows are trademarks, and IBM is a registered trademark of IBM Corporation Apollo, Domain, and DomainOS are trademarks of Apollo Computer, a subsidiary of Hewlett-Packard


    Original     		PDF MSM38S0000 MSM98S000 1-800-OKI-6388 38S02 ipad data sheet MSM98S

    L12xW3

    Abstract: 33XXXXXX 28x28 BLO-28X1D0-02 BLO-33D0X1B1-02 L169 28x28mm
    Text: SINCE 1981 Absolute Maximum Ratings Chip Package Material/ Emitted Color Peak Wave Length p nm GaP/ GaP/ Hi-Eff Green 568 GaAlAs/ DH Red 660 Part No. 28x28mm Multi- BLO-28X1D0-02 Color Lens Appearance Pd If Vr (nm) (mw) (mA) Water Clear (V) Electro-optical


    Original     		PDF 28x28mm BLO-28X1D0-02 FullBLO-28D0G6B1-01 L12xW3 33XXXXXX 28x28 BLO-28X1D0-02 BLO-33D0X1B1-02 L169 28x28mm

    Untitled

    Abstract: No abstract text available
    Text: LatticeECP/EC Family Handbook HB1000 Version 03.7, September 2012 LatticeECP/EC Family Handbook Table of Contents September 2012 Section I. LatticeECP/EC Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1000 TN1008 TN1010 TN1018 TN1071 TN1074 TN1078

    APU FCM

    Abstract: "ESP" RGMII SGMII 8572E
    Text: Freescale Semiconductor MPC8572EEC Rev. 1, 08/2008 MPC8572E PowerQUICC III Integrated Processor Hardware Specifications 1 Overview This section provides a high-level overview of the features of the MPC8572E processor. Figure 1 shows the major functional units within the MPC8572E.


    Original     		PDF MPC8572EEC MPC8572E APU FCM "ESP" RGMII SGMII 8572E

    RGMII SGMII

    Abstract: PWB 826 service manual CRC-32 MPC8548 MPC8572E SHA-256 SHA-384 SHA-512 marking code AVN QorIQ dhrystone
    Text: Freescale Semiconductor Technical Data Document Number: MPC8572EEC Rev. 4, 06/2010 MPC8572E PowerQUICC III Integrated Processor Hardware Specifications 1 Overview This section provides a high-level overview of the features of the MPC8572E processor. Figure 1 shows the major


    Original     		PDF MPC8572EEC MPC8572E MPC8572E. MPC8572E 32-bit MPC8548 32-Kbyte RGMII SGMII PWB 826 service manual CRC-32 SHA-256 SHA-384 SHA-512 marking code AVN QorIQ dhrystone

    Untitled

    Abstract: No abstract text available
    Text: BLUE POWER DIE BXCD 33 mil x 33 mil PRODUCT DATA SHEET DS-C17 The Bridgelux family of blue power die enables high performance and cost effective solutions to serve solid state lighting market. This next generation chip technology delivers improved efficiency and performance to enable increased light output for a variety of lighting, signaling


    Original     		PDF DS-C17 33x33

    LEXAN 121r - 21051

    Abstract: lexan 121r 21051 u574 Dell 90w-AC adapter B568 B552 ffc B591 12505hs14 BA42-00141A BA41-00497A
    Text: 10. Electrical Partlist Option SEC Code Location Name Spec. Unit , PC -,-,0to+95C,560mA,-, HYS64T64020HDL,PC , DT,KR,CP3,IEC320 C5,250/250V,7/3A,BLK,1830mm,-,H05VV-F


    Original     		PDF BA31-00024A BA39-00474A BA39-00493A S/80GB WLAN-802 L50000 L35mm L228mm LEXAN 121r - 21051 lexan 121r 21051 u574 Dell 90w-AC adapter B568 B552 ffc B591 12505hs14 BA42-00141A BA41-00497A

    diode E1110

    Abstract: lN4002 LN4003 ANA 618 20010 TDB 0123 km b3170 E1110 Diode UB8560D MAA723 moc 2030
    Text: elektronik-bauelem ente I WT VD AVL 1 /8 7 Bl. 2 E r l ä u t e r u n g e n z u m I n h a l t und zu d e n A n g a b e n d e r B a u e l e m e n t e - V e r g l e i c h s l i s t e D ie B a u e l e m e n t e - V e r g l e i c h s l i s t e e n t h ä l t a l l e in d e r B i l a n z v e r a n t w o r t u n g d e s V E B K o m b i n a t


    OCR Scan     		PDF

    mikroelektronik ddr

    Abstract: Halbleiterbauelemente DDR VEB mikroelektronik vqb 71 A910D VQB71 "halbleiterwerk frankfurt" diode sy-170 VQB 37 u112d
    Text: Halbleiter-Bauelemente Semiconductors Die vorliegende Übersicht enthält in gedrängter Form die wichtigsten Grenz- und Kenn­ daten der in der DDR gefertigten Halbleiterbauelem ente. Dem Anwender soll durch diese Übersicht die Auswahl der jeweils in Frage kommenden


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: O K I Semiconductor MSM38S0000/MSM98S000 0.8|im Mixed 3-V/5-V Sea of Gates and Customer Structured Arrays DESCRIPTION OKI's 0.8 tm ASIC products, specially designed for mixed 3-V /5-V applications, are now available in both Sea Of Gates (SOG and Customer Structured Array (CSA) architectures. Both the SOG-based MSM38S


    OCR Scan     		PDF MSM38S0000/MSM98S000 MSM38S MSM98S 16-Mbit 38S/98S 44x44 35x35 28x28 33x33 38x38

    "84 pin qfp"

    Abstract: S002B advantages for ic 7473 Lucent 2623
    Text: Data Sheet November 1995 microelectronics group Lucent Technologies Bell Labs Innovations ATT2M01 100VG-AnyLAN Media Access Controller MAC Features and Benefits Description • Supports the proposed IEEE' 802.12 100VGAnyLAN specification (as ot January 1994).


    OCR Scan     		PDF ATT2M01 100VG-AnyLAN 100VGAnyLAN ATT2X01 ATT2MD01, ATT2MD11, ATT2R01. 0D50D2b DG23112 "84 pin qfp" S002B advantages for ic 7473 Lucent 2623

    TSTI01

    Abstract: No abstract text available
    Text: Data Sheet October 1993 microelectronics group Lucent Technologies Bell Labs Innovations ATT2X01 Twisted-Pair Transceiver Chip Flying Dutchman Features Applications • 100 Mblts/s ■ High-speed local area networks ■ Single +5 V supply ■ The ATT2X01 can be used in all 100Base-VG net­


    OCR Scan     		PDF ATT2X01 44-pin 100Base-VG 0D50D2b DG23112 TSTI01

    ATT2MD12

    Abstract: att2x02
    Text: Data Sheet August 1996 m ic ro e le c tro n ic s group Lucent Technologies Bell Labs Innovations ATT2X02 100VG-AnyLAN Twisted-Pair Transceiver Chip Features Description and Applications • Supports the IEEE" 802.12 100VG-AnyLAN speci­ fication. The ATT2X02 is a CMOS Integrated Circuit imple­


    OCR Scan     		PDF ATT2X02 100VG-AnyLAN 10Base-T ATT2MD12 ATT2R02 0D50D2b DG23112

    relay lad1

    Abstract: lad1 relay CNT17 OVF20 2451B LA01 sia to sms ATT1S04 LS259 54-057
    Text: Data Sheet September 1995 m ic r o e le c t r o n ic s group Lucent Technologies Bell Labs Innovations Features • A highly integrated four-repeater architecture will sim­ plify the design of a wide range of N-port by M-segment circuit-switched hubs. The ATT1RX04


    OCR Scan     		PDF ATT1RX04 ATT1RX04 05002b. relay lad1 lad1 relay CNT17 OVF20 2451B LA01 sia to sms ATT1S04 LS259 54-057