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    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS SRAM 28X32V3 DESCRIPTION: The 28X32V3 "VERSA-STACK" module is a r e v o lu tio n a r y ne w m e m o ry subsystem u sin g Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic


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    DPS128X32V3 DPS128X32V3 3QA044-20 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 4 Megabit CMOS SRAM M IG R O S Y S T E M S 28X32V3 D ESCRIPTIO N : The 28X32V3 "VERSA-STACK" module is a re v o lu tio n a ry new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic


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    DPS128X32V3 28X32V3 California92841-1428 oa044-20 PDF