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    1470H Search Results

    1470H Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68491-470HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    79821-470HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail. Visit Amphenol Communications Solutions
    68691-470HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    68021-470HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    87901-470HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail. Visit Amphenol Communications Solutions
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    1470H Price and Stock

    Monolithic Power Systems MP1470HGJ-Z

    IC REG BUCK ADJ 2A TSOT23-6
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    DigiKey MP1470HGJ-Z Reel 3,000
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    Avnet Americas MP1470HGJ-Z Reel 24 Weeks 3,000
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    • 10000 $0.6419
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    Avnet Silica MP1470HGJ-Z 26 Weeks 3,000
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    Monolithic Power Systems MP1470HGJ-P

    IC REG BUCK ADJ 2A TSOT23-6
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    DigiKey MP1470HGJ-P Reel 500
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    • 10000 $0.8414
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    Avnet Americas MP1470HGJ-P Reel 28 Weeks 500
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    • 1000 $0.8384
    • 10000 $0.8
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    Mouser Electronics MP1470HGJ-P 335
    • 1 $3
    • 10 $2.33
    • 100 $2.32
    • 1000 $0.928
    • 10000 $0.8
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    Newark MP1470HGJ-P Cut Tape 499 1
    • 1 $2.93
    • 10 $2.3
    • 100 $2.26
    • 1000 $1.14
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    Amphenol Communications Solutions 68491-470HLF

    BERGSTIK II .100CC DR ST RAIGHT
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    DigiKey 68491-470HLF Bag
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    Amphenol Communications Solutions 68691-470HLF

    BERGSTIK II .100CC DR ST RAIGHT
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    DigiKey 68691-470HLF Bag
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    Amphenol Communications Solutions 87901-470HLF

    CONN HEADER VERT 70POS 2.54MM
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    DigiKey 87901-470HLF Bag
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    Find more 1470H price and stock on Findchips.com

    1470H Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC asu

    Abstract: 13E3h 1442H
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H

    09-D2

    Abstract: RGB565 to rgb888 epson 16F8H T-1228 S2D13719 T-1227 Casio 1026 casio tft T14-22 T1205A
    Text: S2D13719 Mobile Graphics Engine Hardware Functional Specification Document Number: X59A-A-002-01 Status: Revision 1.2 Issue Date: 2008/10/27 SEIKO EPSON CORPORATION 2008. All Rights Reserved. Information in this document is subject to change without notice. You may download and use this document, but only for your own use in


    Original     		PDF S2D13719 X59A-A-002-01 PQFP22-208 X59A-A-002-00 S2D13719 S1D13719 S1D13719 09-D2 RGB565 to rgb888 epson 16F8H T-1228 T-1227 Casio 1026 casio tft T14-22 T1205A

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


    Original     		PDF R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H

    1N44H

    Abstract: 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H
    Text: SONET/SDH Payload Extractor/Aligner SPECTRA-4x155 Production PM5316 SPECTRA 4x155 SONET/SDH Payload Extractor/Aligner 4 x 155 Mbit/s Datasheet Proprietary and Confidential Production Issue 4: March 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its customers’ internal use


    Original     		PDF SPECTRA-4x155) PM5316 4x155 PMC-1990822, 1n31h PMC-1990822 1N44H 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H

    s1d13715

    Abstract: 1066H LCD sharp 320X320 T-1228 T-1227 phone 14 pin vga camera pinout T1128 T1429 1520H RGB565 to rgb888 epson
    Text: S1D13715 Mobile Graphics Engine with Megapixel Support Hardware Functional Specification Document Number: X52A-A-001-07 SEIKO EPSON CORPORATION 2002-2008. All Rights Reserved. Information in this document is subject to change without notice. You may download and use this document, but only for your own use in


    Original     		PDF S1D13715 X52A-A-001-07 X52A-A-001-02 0128h] 012Ah] X52A-A-001-01 1066H LCD sharp 320X320 T-1228 T-1227 phone 14 pin vga camera pinout T1128 T1429 1520H RGB565 to rgb888 epson

    r74 MKp

    Abstract: r749 660 TG transistor code R74 2180-0-R74NI 11500R *45F122 mm9509 7N256 R745N
    Text: Loose R74 MKP Series Taped Fig.1 metallized Polypropylene film capacitor A.C. APPLICATIONS Fig.2 Typical applications: electronic lighting i.e. car headlamp and ballast , pulse applications with high A.C. voltage and high current. PRODUCT CODE: R74 15 ≤ p ≤ 27.5


    Original     		PDF 10x10-4 10kHz r74 MKp r749 660 TG transistor code R74 2180-0-R74NI 11500R *45F122 mm9509 7N256 R745N

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP

    800-208 100

    Abstract: r74 mkp
    Text: Loose R74 MKP Series Taped Fig.1 metallized Polypropylene film capacitor A.C. APPLICATIONS Fig.2 Typical applications: electronic lighting i.e. car headlamp and ballast , pulse applications with high A.C. voltage and high current. PRODUCT CODE: R74 15 ≤ p ≤ 27.5


    Original     		PDF 10x10-4 10kHz 800-208 100 r74 mkp

    eel 19 2005 transformer

    Abstract: ARCOTRONICS R46 KI 3220 Kemet CAPACITOR DATE CODE MARKING ON PACKING R46 ARCOTRONICS R46s arcotronics F43 arcotronics mkp 1.44 1.40.00 mkt x2 polypropylene capacitors KP ARCOTRONICS MKP 1.44 7.5 iec60384-14 250V 310VAC X2
    Text: F3301 - GENERAL INFORMATION DC Film Capacitors Please refer to our Internet address http://www.kemet.com for updated information on A products, services and news. Contents Pitch mm Rated Voltage Vdc range Capacitance range Page General Information. . 2 to 18


    Original     		PDF F3301 25xVR 10x10-4 10kHz 01kHz 230Vac 250Vac eel 19 2005 transformer ARCOTRONICS R46 KI 3220 Kemet CAPACITOR DATE CODE MARKING ON PACKING R46 ARCOTRONICS R46s arcotronics F43 arcotronics mkp 1.44 1.40.00 mkt x2 polypropylene capacitors KP ARCOTRONICS MKP 1.44 7.5 iec60384-14 250V 310VAC X2

    1C65H

    Abstract: 1a5ah
    Text: :5 6: 55 AM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 05 12 PM5316 es da y, 13 De ce SPECTRA 4x155 Data Sheet Released Issue No. 6: November 2005 Do wn lo ad ed by Co nt e nt Te a m of P ar tm in er In co n Tu SONET/SDH Payload Extractor/Aligner


    Original     		PDF 4x155 PM5316 4x155 PMC-1990822, 1C65H 1a5ah

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H

    1680-0-R74NI

    Abstract: 0820-3-R747I R74 MKP 015 400
    Text: Loose R74 MKP Series Taped Fig.1 metallized Polypropylene film capacitor A.C. APPLICATIONS Fig.2 Typical applications: electronic lighting i.e. car headlamp and ballast , pulse applications with high A.C. voltage and high current. PRODUCT CODE: R74 15 ≤ p ≤ 27.5


    Original     		PDF 1x105 1680-0-R74NI 0820-3-R747I R74 MKP 015 400

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


    Original     		PDF R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H

    r74 mkp

    Abstract: No abstract text available
    Text: R74 Loose MKP Series Taped Fig.1 METALLIZED POLYPROPYLENE FILM CAPACITOR A.C. APPLICATIONS Fig.2 Typical applications: electronic lighting i.e. car headlamp and ballast , pulse applications with high A.C. voltage and high current. PRODUCT CODE: R74 15 ≤ p ≤ 27.5


    Original     		PDF 1x105 r74 mkp

    Untitled

    Abstract: No abstract text available
    Text: 2: 03 PM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 02 02 :4 PM5316 da y, 03 De ce SPECTRA 4x155 Data Sheet Released Issue No. 5: September 2002 Do wn lo ad ed by Pa rtM i ne rI nc of Pa rtm in er In co n Tu es SONET/SDH Payload Extractor/Aligner


    Original     		PDF 4x155 PM5316 4x155 PMC-1990822,

    Untitled

    Abstract: No abstract text available
    Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF REJ09B0251-0110 R8C/22 R8C/23

    PD77240

    Abstract: SICK AG D7 ID10 ID12 ID31 JJPD77240 PD77230 1470h D77240
    Text: NEC JJPD77240 3 2 -Bit Floating-Point Digital Signal Processor NEC Electronics inc. Description The /j PD77240 Digital Signal Processor DSP has been developed for applications that demand high speed, high precision, and a large data address area Opera­


    OCR Scan     		PDF uPD77240 32-Bit PD77240 24-bit SICK AG D7 ID10 ID12 ID31 JJPD77240 PD77230 1470h D77240

    IFC12

    Abstract: D77240
    Text: /JPD77240 32-Bit Floating-Point Digital Signal Processor 1^1 NEC Electronics Inc. Description Thef/PD77240 Digital Signal Processor DSP has been developed for applications that dem and high speed, high precision, and a large data address a rea Opera­ tions on 32-bit floating-point data (8-bit exponent,


    OCR Scan     		PDF uPD77240 32-bit 24-bit 3e-20 IFC12 D77240