DSAZSAA00019618.pdf by NXP Semiconductors

Partial File Text Package outline HLQFP208: plastic thermal enhanced low profile quad flat package: 208 leads; body 28 x 28 x 1.4 mm; exposed die pad SOT1313-1 c y exposed die pad X A Dh 156 15
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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