Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    XQ2V300 Search Results

    SF Impression Pixel

    XQ2V300 Price and Stock

    AMD Xilinx XQ2V3000-4BG728N

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components XQ2V3000-4BG728N 1
    • 1 $4139.7977
    • 10 $4139.7977
    • 100 $4139.7977
    • 1000 $4139.7977
    • 10000 $4139.7977
    		Buy Now

    AMD Xilinx XQ2V3000-4CG717M

    FPGA Virtexii 717CCGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Win Source Electronics XQ2V3000-4CG717M 40
    • 1 $5571.4287
    • 10 $5571.4287
    • 100 $5571.4287
    • 1000 $5571.4287
    • 10000 $5571.4287
    		Buy Now

    XQ2V300 Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    XQ2V3000 Xilinx QPro Virtex-II 1.5V Military QML Platform FPGAs Original PDF
    XQ2V3000-4BG728N Xilinx PROM: XQ2V3000 Family: BGA Package Original PDF
    XQ2V3000-4BGG728N Xilinx PROM: XQ2V3000 Family: BGA Package Original PDF
    XQ2V3000-4CGG717M Xilinx FPGA: Developed For High Performance From Low-Density To High-Density Designs That Are Based On IP Cores And Customized Modules Original PDF

    XQ2V300 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    VQFP44 package

    Abstract: XQV300 XQ17V16 VQ44 XQ18V04 XQ2V1000 XQV1000 XQV600 XQ18V04VQ44N
    Text: QPro XQ18V04 Military 4Mbit ISP Configuration Flash PROM R DS125 v1.0 December 16, 2003 5 Advance Product Specification Features Description • Operating Temperature Range: –55° C to +125° C • Low-power advanced CMOS FLASH process memory cells immune to static single event upset


    Original     		PDF XQ18V04 DS125 XQ17V16 XQ18V04VQ44 XQ18V04 44-pin VQFP44 package XQV300 VQ44 XQ2V1000 XQV1000 XQV600 XQ18V04VQ44N

    XQ2V1000-4FG456N

    Abstract: XQ2V1000 Virtex Qpro xq2v1000-4bg575n CG717 CF1144 matrix m21 vhdl code for carry select adder using ROM XQ2V1000-4BG XQ2V3000
    Text: ds122_1_1.fm Page 1 Wednesday, January 7, 2004 9:15 PM QPro Virtex-II 1.5V Military QML Platform FPGAs R DS122 v1.1 January 7, 2004 Product Specification Summary of QPro Virtex™-II Features • • • • • • • • Industry First Military Grade Platform FPGA Solution


    Original     		PDF DS122 MIL-PRF-38535 CF1144 XQ2V1000-4FG456N XQ2V1000 Virtex Qpro xq2v1000-4bg575n CG717 matrix m21 vhdl code for carry select adder using ROM XQ2V1000-4BG XQ2V3000

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    camera-link to hd-SDI converter

    Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400
    Text: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    XQ17V16CC44M

    Abstract: XQ17V16CC44M package XQ17V16 XQV600E DS111 XQ17V16VQ44N XQ17V16CC44 HW-130 VQ44 XQ2V1000
    Text: QPro XQ17V16 Military 16Mbit QML Configuration PROM R DS111 v1.0 December 15, 2003 8 Product Specification Features • Cascadable for storing longer or multiple bitstreams • 16Mbit storage capacity • • Guaranteed operation over full military temperature


    Original     		PDF XQ17V16 16Mbit DS111 16Mbit 44-pin XQ17V16 XQ17V16CC44M XQ17V16CC44M package XQV600E DS111 XQ17V16VQ44N XQ17V16CC44 HW-130 VQ44 XQ2V1000

    XC3S250E TQ144 STARTER KIT BOARD

    Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
    Text: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — 187 QPro Virtex-II 1.5V Platform FPGAs DS122 v3.0 April 7, 2014 Product Specification Summary of QPro Virtex™-II Features • High-performance clock management circuitry • Industry’s first military-grade platform FPGA solution


    Original     		PDF DS122 MIL-PRF-38535

    CB228

    Abstract: CF1144 XQV600E 5962-99572 XC1765D CG717 XQ4010E XC4005 CC44 XQV300
    Text: QPRO Logic Cells RAMbus MULTs DLLs Flip-Flops Max I/Os 64 PG84, CB100 XQR4013XL 3.3 10-30K 1368 18K 393632 – – 1536 192 CB228 60 360 80 PG84 XQR4036XL 3.3 22-65K 3078 42K 832528 – – 3168 288 CB228 60 XC3042* 5962-89713 5 3000 480 – 30784 – –


    Original     		PDF CB100 XQR4013XL 10-30K CB228 XQR4036XL 22-65K XC3042* PG132, CB228 CF1144 XQV600E 5962-99572 XC1765D CG717 XQ4010E XC4005 CC44 XQV300

    XQ2V1000-4FG456

    Abstract: XQ2V1000-4FG456N AF271 transistor xq2v30004cg717m CG717 AE193 matrix m21 XC2V1000-FG456 BG728 XQ2V3000
    Text: R DS122 v2.0 December 21, 2007 QPro Virtex-II 1.5V Platform FPGAs Product Specification Summary of QPro Virtex™-II Features • • Industry’s first military-grade platform FPGA solution • Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)


    Original     		PDF DS122 MIL-PRF-38535 XQ2V1000-4FG456 XQ2V1000-4FG456N AF271 transistor xq2v30004cg717m CG717 AE193 matrix m21 XC2V1000-FG456 BG728 XQ2V3000

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    Untitled

    Abstract: No abstract text available
    Text: QPRO DLLs 10-30K 1368 18K 393632 – – 1536 192 CB228 60 3.3 22-65K 3078 42K 832528 – – 3168 288 CB228 60 XC3042* 5962-89713 5 3000 480 – 30784 – – 480 96 PG84, PG132, CB100 XQR4062XL 3.3 40-130K 5472 74K 1433864 – – 5376 384 CB228 60 XC3064*


    Original     		PDF 10-30K CB228 22-65K XC3042* PG132, CB100 XQR4062XL 40-130K

    XQ2V6000-4CF1144M

    Abstract: XQ2V3000-4CG717M XQ2V1000-4FG456N XQ2V3000-4BG728N XQ2V1000-4BG575N IO-L93N XQ2V300 XQ2V1000 XQ2V3000-4BG
    Text: QPro Virtex-II 1.5V Military QML Platform FPGAs R DS122 v1.2 November 30, 2006 Product Specification Summary of QPro Virtex™-II Features • • • • • • • • • • • • • • • • • Industry’s First Military Grade Platform FPGA Solution


    Original     		PDF DS122 MIL-PRF-38535 UG002, XAPP623, XAPP689, BG575 XQ2V6000-4CF1144M XQ2V3000-4CG717M XQ2V1000-4FG456N XQ2V3000-4BG728N XQ2V1000-4BG575N IO-L93N XQ2V300 XQ2V1000 XQ2V3000-4BG

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    TSMC 0.18 um MOSfet

    Abstract: M38510 10102BCA IDT7204L 5962-8768401MQA 0.18um LDMOS TSMC sl1053 TSMC 0.25Um LDMOS UT63M125BB SMD RTAX250S-CQ208 5962-04221
    Text: DSCC Supplemental Information Sheet for Electronic QML-38535 Specification Details: Date: 9/2/2008 Specification: MIL-PRF-38535 Title: Advanced Microcircuits Federal Supply Class FSC : 5962 Conventional: No Specification contains quality assurance program: Yes


    Original     		PDF QML-38535 MIL-PRF-38535 MIL-STD-790 MIL-STD-690 -581DSCC QML-38535 TSMC 0.18 um MOSfet M38510 10102BCA IDT7204L 5962-8768401MQA 0.18um LDMOS TSMC sl1053 TSMC 0.25Um LDMOS UT63M125BB SMD RTAX250S-CQ208 5962-04221

    5962L0053605VYC

    Abstract: 5962-9069204QXA ATMEL 302 24C16 UT9Q512E-20YCC MOH0268D UT54ACS164245SEIUCCR Z085810 5962-9762101Q2A UT28F256QLET-45UCC 5962R0250401KXA
    Text: NOT MEASUREMENT SENSITIVE MIL-HDBK-103AJ 19 SEPTEMBER 2011 SUPERSEDING MIL-HDBK-103AH 28 MARCH 2011 DEPARTMENT OF DEFENSE HANDBOOK LIST OF STANDARD MICROCIRCUIT DRAWINGS This handbook is for guidance only. Do not cite this document as a requirement. AMSC N/A


    Original     		PDF MIL-HDBK-103AJ MIL-HDBK-103AH MIL-HDBK-103AJ 5962L0053605VYC 5962-9069204QXA ATMEL 302 24C16 UT9Q512E-20YCC MOH0268D UT54ACS164245SEIUCCR Z085810 5962-9762101Q2A UT28F256QLET-45UCC 5962R0250401KXA