Untitled
Abstract: No abstract text available
Text: SGK0910-60A-R X-Band Internally Matched GaN-HEMT FEATURES High Output Power: P5dB=48.0dBm Typ. High Gain: GL=12.0dB (Typ.) High PAE: add=35% (Typ.) Broad Band: 9.2 to 10.0GHz Impedance Matched Zin/Zout = 50ohm Hermetically Sealed Package
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SGK0910-60A-R
50ohm
SGK0910-60A-R
50ohm
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SGK0910-120A-R
Abstract: No abstract text available
Text: SGK0910-120A-R X-Band Internally Matched GaN-HEMT FEATURES High Output Power: P5dB=51.0dBm Typ. High Gain: GL=11.5dB (Typ.) High PAE: add=35% (Typ.) Broad Band: 9.2 to 10.0GHz Impedance Matched Zin/Zout = 50ohm Hermetically Sealed Package
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SGK0910-120A-R
50ohm
SGK0910-120A-R
50ohm
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Untitled
Abstract: No abstract text available
Text: SGK0910-30A-R X-Band Internally Matched GaN-HEMT FEATURES High Output Power: P5dB=45.0dBm Typ. High Gain: GL=12.0dB (Typ.) High PAE: add=35% (Typ.) Broad Band: 9.2 to 10.0GHz Impedance Matched Zin/Zout = 50ohm Hermetically Sealed Package
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SGK0910-30A-R
50ohm
SGK0910-30A-R
50ohm
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GaN amplifier
Abstract: GaN amplifier 100W GaAs HEMTs X band 25W Amplifier Research NPT25100 NPTB00050 high power fet amplifier schematic an-013 nitronex Amplifier Research rf power amplifier schematic broadband impedance transformation
Text: APPLICATION NOTE AN-013 GaN Essentials AN-013: Broadband Performance of GaN HEMTs NITRONEX CORPORATION 1 MAY 2009 APPLICATION NOTE AN-013 GaN Essentials: Broadband Performance of GaN HEMTs 1. Table of Contents 1. TABLE OF CONTENTS. 2
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AN-013
AN-013:
NPTB00004
12-Watt
NPT25100
MRF6S9125
GaN amplifier
GaN amplifier 100W
GaAs HEMTs X band
25W Amplifier Research
NPTB00050
high power fet amplifier schematic
an-013 nitronex
Amplifier Research rf power amplifier schematic
broadband impedance transformation
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CGH40025P
Abstract: CGH40010P cgh60015 GaN ADS Gan hemt transistor x band cgh40120F cgh40045f CGH60015D CGH60060D CGH60030D cgh60120D
Text: General Purpose Wide Bandgap Transistors Gallium Nitride GaN HEMTs for Broadband Applications Broadband performance - Enables high power, multi-octave bandwidth amplifiers This “general purpose” discrete device series features Cree’s GaN HEMTs. These unmatched packaged transistors
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CGH09120F
Abstract: CGH25120F CDPA21480 CGH27060F ofdm predistortion CGH55030F 440117 CGH21120F CGH21240F CGH27015F
Text: Gallium Nitride GaN HEMT Transistors for BTS Applications Cree’s Doherty CDPA21480, performance. CGH21240F demonstration provides amplifier innovative The amplifier devices with uses digital two CDPA21480 Spectrum at 2.11, 2.14 & 2.17 GHz PAVE = 49 dBm, 2-Carrier WCDMA, PAR = 7.5 dB with CFR
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CDPA21480,
CGH21240F
CDPA21480
CGH09120F
CGH25120F
CGH27060F
ofdm predistortion
CGH55030F
440117
CGH21120F
CGH21240F
CGH27015F
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High Efficiency, High Linearity GaN HEMT Amplifiers for WiMAX Applications
Abstract: ofdm amplifier NEc hemt CGH35015 power amplifier circuit diagram with pcb layout amplifiers circuit diagram CGH35015S GaN amplifier GaN photo diode operational amplifier discrete schematic
Text: From June 2007 High Frequency Electronics Copyright 2007 Summit Technical Media, LLC High Frequency Design WiMAX AMPLIFIERS High Efficiency, High Linearity GaN HEMT Amplifiers for WiMAX Applications U. H. Andre, R. S. Pengelly, A. R. Prejs and S. M. Wood, Cree Inc., and
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI7785-120L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 51.0dBm at Pin= 44.0dBm ・HIGH GAIN GL= 11.0dB at Pin= 20.0dBm ・LOW INTERMODULATION DISTORTION IM3 Min. = 25dBc at Po=44.0dBm Single Carrier Level
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TGI7785-120L
25dBc
20dBm
No1215
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI7785-120L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 51.0dBm at Pin= 44.0dBm ・HIGH GAIN GL= 11.0dB at Pin= 20.0dBm ・LOW INTERMODULATION DISTORTION IM3 Min. = 25dBc at Po=44.0dBm Single Carrier Level
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TGI7785-120L
25dBc
20dBm
No1225
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Untitled
Abstract: No abstract text available
Text: RFSW2100D 75W GaN-onSiC Reflective SPDT RF Switch RFSW2100D Proposed 75W GaN-ON-SiC REFLECTIVE SPDT RF SWITCH Features Broadband Operation 30MHz to 6000MHz Advanced GaN HEMT Technology 2GHz Typical Performance Insertion Loss ~ 0.25dB Isolation ~ 40dB
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RFSW2100D
30MHz
6000MHz
DS120620
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"RF Switch"
Abstract: rf switch RFMD HEMT GaN SiC SiC BJT RFSW2100D GaN BJT
Text: RFSW2100D 75W GaN-onSiC Reflective SPDT RF Switch RFSW2100D Proposed 75W GaN-ON-SiC REFLECTIVE SPDT RF SWITCH Features Broadband Operation 30MHz to 6000MHz Advanced GaN HEMT Technology 2GHz Typical Performance Insertion Loss ~ 0.25dB Isolation ~ 40dB
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RFSW2100D
RFSW2100D
30MHz
6000MHz
DS120620
"RF Switch"
rf switch
RFMD HEMT GaN SiC
SiC BJT
GaN BJT
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Abstract: No abstract text available
Text: RFSW2100 45W GaN-onSiC Reflective SPDT RF Switch RFSW2100 Proposed 45W GaN-ON-SiC REFLECTIVE SPDT RF SWITCH Package: QFN, 12-Pin, 3mm x 3mm Features Broadband Operation 30MHz to 6GHz Advanced GaN HEMT Technology 2GHz Typical Performance Insertion Loss <0.4dB
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RFSW2100
12-Pin,
30MHz
DS120614
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI1314-25L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 44.0dBm at Pin= 39.0dBm ・HIGH GAIN GL= 8.0dB at 13.75GHz to 14.5GHz ・LOW INTERMODULATION DISTORTION IM3 Min. = 25dBc at Po=37.0dBm Single Carrier Level
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TGI1314-25L
75GHz
25dBc
20dBm
No1210
7-AA07A)
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transistor C1096
Abstract: transistor C2271 c2271 transistor TRANSISTOR C1555 GaN ADS Gan hemt transistor x band c1096 CGH40010F CuMoCu GaAs HEMTs X band
Text: WMC: Challenges in Model-Based HPA Design Application of Non-Linear Models in a range of challenging GaN HEMT Power Amplifier Designs Ray Pengelly, Brad Millon, Don Farrell, Bill Pribble and Simon Wood Cree Inc., Research Triangle Park, NC 27709 Outline • Attributes of GaN HEMTs
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MGF4937
Abstract: MGFG5H1503 MGF4937AM GD-32 MGFG5H1502 MGF0904 mgfc39v5964 MGF2430 MGF0909A BA012J1
Text: HIGH FREQUENCY DEVICES High Frequency Devices The Best Solution for Realizing the Information Era. Communication networks, such as high speed Internet, video-on-demand and high-speed data communcation, are developing rapidly. We are ready to offer the best solution to the systems for realizing the information era by providing a variety of GaAs/GaN products designed
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H-CX587-R
KI-1311
MGF4937
MGFG5H1503
MGF4937AM
GD-32
MGFG5H1502
MGF0904
mgfc39v5964
MGF2430
MGF0909A
BA012J1
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Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI0910-50 FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 47.0dBm at Pin= 41.0dBm ・HIGH GAIN GL= 9.0dB at 9.5GHz to 10.5GHz ・HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Ta= 25C
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TGI0910-50
20dBm
7-AA04A)
No1217
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TGI8596-50
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI8596-50 FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 47.0dBm at Pin= 41.0dBm ・HIGH GAIN GL= 9.0dB at 8.5GHz to 9.6GHz ・HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Ta= 25C
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TGI8596-50
20dBm
7-AA04A)
No1216
TGI8596-50
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GaAs HEMTs X band
Abstract: X-band Gan Hemt 0.18um AlGaN/GaN HEMTs x-band mmic lna alcon X-band diode gp 421 LNA x-band
Text: High Linearity, Robust, AlGaN-GaN HEMTs for LNA & Receiver ICs P. Parikh, Y. Wu, M. Moore, P. Chavarkar, U. Mishra, Cree Lighting Company, 340 Storke Road, Goleta, CA 93117. R. Neidhard, L. Kehias, T. Jenkins, Air Force Research Laboratory, Sensors Directorate, WPAFB, OH 45433.
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Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI7785-50L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 47.0dBm at Pin= 40.0dBm ・HIGH GAIN GL= 11.0dB at 7.7GHz to 8.5GHz ・LOW INTERMODULATION DISTORTION IM3 Min. = 40dBc at Po=32.0dBm Single Carrier Level
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TGI7785-50L
40dBc
7-AA04A)
No1209
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI7785-25L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 44.5dBm at Pin= 35.0dBm ・HIGH GAIN GL= 12.0dB at 7.7GHz to 8.5GHz ・LOW INTERMODULATION DISTORTION IM3 Min. = 40dBc at Po=29.0dBm Single Carrier Level
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TGI7785-25L
40dBc
7-AA04A)
No1214
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI5867-25L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 44.5dBm at Pin= 35.0dBm ・HIGH GAIN GL= 13.5dB at 5.85GHz to 6.75GHz ・LOW INTERMODULATION DISTORTION IM3 Min. = -40dBc at Po=29.0dBm Single Carrier Level
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TGI5867-25L
85GHz
75GHz
-40dBc
20dBm
7-AA04A)
No1226
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI5867-50L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 47.0dBm at Pin= 39.0dBm ・HIGH GAIN GL= 13.5dB at 5.85GHz to 6.75GHz ・LOW INTERMODULATION DISTORTION IM3 Min. = -40dBc at Po=32.0dBm Single Carrier Level
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TGI5867-50L
85GHz
75GHz
-40dBc
20dBm
7-AA04A)
No1227
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI7785-25L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 44.5dBm at Pin= 35.0dBm ・HIGH GAIN GL= 12.0dB at 7.7GHz to 8.5GHz ・LOW INTERMODULATION DISTORTION IM3 Min. = 40dBc at Po=29.0dBm Single Carrier Level
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TGI7785-25L
40dBc
7-AA04A)
No1223
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaN HEMT TGI5964-120L FEATURES ・BROAD BAND INTERNALLY MATCHED HEMT ・HIGH POWER Pout= 51.0dBm at Pin= 43.0dBm ・HIGH GAIN GL= 13.0dB at Pin= 20.0dBm ・LOW INTERMODULATION DISTORTION IM3 Min. = 25dBc at Po=44.0dBm Single Carrier Level
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TGI5964-120L
25dBc
43dBm
7-AA06A)
No1220
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