W86L388 Search Results

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Nuvoton Technology Corp W86L388-DG IC FLASH MEM CARD BRIDGE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	W86L388-DG	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Winbond Electronics Corp W86L388D Host I/F to Secure Digital (R)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	W86L388D		740			1 $35.19 10 $35.19 100 $9.09 1000 $7.91 10000 $7.91	Buy Now

W86L388 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
W86L388D		Winbond Electronics	W86L388D Winbond Host Interface SD/MMC Memory Card Bridge		Original	PDF

W86L388 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: W86L388D Data Sheet W86L388D Winbond Host Interface SD/MMC Memory Card Bridge -i- Publication Release Date: May 17, 2005 Revision 1.0 W86L388D Table of Content1. GENERAL DESCRIPTION . 1	Original	PDF	W86L388D W86L388D
W86L388 Abstract: 23GIO 48-PIN NDS352P W86L388D do-15 footprint sd5d14 MMC Electronics America Text: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 08/2001 0.50 First published. 2 3 4 5 6 7 8 9 10 Please note that all data and specifications are subject to change without notice. All the trademarks of	Original	PDF	W86L388D W86L388D W86L388 23GIO 48-PIN NDS352P do-15 footprint sd5d14 MMC Electronics America
Untitled Abstract: No abstract text available Text: W86L388D Data Sheet W86L388D Winbond Host Interface SD/MMC Memory Card Bridge -i- Publication Release Date: May 17, 2005 Revision 1.0 W86L388D Table of Content1. GENERAL DESCRIPTION . 1	Original	PDF	W86L388D W86L388D
Untitled Abstract: No abstract text available Text: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 2 1 08/2001 0.50 First published. 4/26/2005 0.6 Added lead free package W86L388-DG in ordering information 3 4	Original	PDF	W86L388D W86L388-DG applica886-35-770066
MS-6G Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f Text: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :	Original	PDF	Z200-PCN-PA20070101 14X20MM 14X14MM G600F) 48LQFP SB5627 W6694ACD SB5627001 MS-6G ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f