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    TSSOP14 PACKAGE Search Results

    TSSOP14 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    TSSOP14 PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TSSOP 14 Package Unknown Scan PDF

    TSSOP14 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    M24C128

    Abstract: 16KX8 M24128 M24C64 QREE0031 TSSOP14 STMicroelectronics lot number m24c64
    Text: QREE0031 QUALIFICATION REPORT TSSOP8 / TSSOP14 High Density Lead Frame ANAM THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify High Density Lead Frame HDLF used on TSSOP8 (Thin Shrink Small Outline Package) and TSSOP14 by our


    Original     		PDF QREE0031 TSSOP14 TSSOP14 M24C128 16KX8 M24128 M24C64 QREE0031 STMicroelectronics lot number m24c64

    hf2c

    Abstract: TS934 m1 sot23 TS931 TS932 TS93X TSSOP14 transistor st 932
    Text: Q093XC1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 093X PRODUCT NAME : TS93X LINE DESCRIPTION : MICROPOWER OPERATIONAL AMPLIFIER WAFER CODE : 093XAAH PACKAGES : TS931 : SO8 / SOT23-5 TS932 : SO8 / DIP8 TS934 : SO14 / DIP14 / TSSOP14


    Original     		PDF Q093XC1 TS93X 093XAAH TS931 OT23-5 TS932 TS934 DIP14 TSSOP14 E917093XA hf2c TS934 m1 sot23 TS931 TS932 TS93X TSSOP14 transistor st 932

    PVAPOX

    Abstract: C0942 HFMS510 P100 TS944 TS94X DSA008446 OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIER SOT23 wafer code ST MICROELECTRONICS SO14
    Text: Q094XS1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 094X PRODUCT NAME : TS94X LINE DESCRIPTION : OUTPUT RAIL TO RAIL BiCMOS µPOWER OPAMP WAFER CODE : C0941AAH/C0942AAZ/C0944AAH PACKAGES : SOT23/SO8/SO14/TSSOP14/DIP8/DIP14


    Original     		PDF Q094XS1 TS94X C0941AAH/C0942AAZ/C0944AAH OT23/SO8/SO14/TSSOP14/DIP8/DIP14 E917093XA TS942) TSSOP14, OT23-5, DIP14) PVAPOX C0942 HFMS510 P100 TS944 TS94X DSA008446 OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIER SOT23 wafer code ST MICROELECTRONICS SO14

    OF TL084 OPAMP

    Abstract: audio Amp. mosfet 1000 watt 3000 Watt BTL Audio Amplifier AUDIO AMPLIFIER 140 WATT MOSFET 24v 5 amp smps TDA2320A replacement DC MOTOR DRIVE WITH LM324 NE555 IGBT DRIVER TSM1001 lm336 sot23
    Text: Standard linear portfolio From innovative devices to application specific products Package Flip chip DFN8 Mini SO8 SO8 S014/16 SO20 SO24 batwing SOT23-3/5 TO92 TQFP44/48 TSSOP8 TSSOP14/16 TSSOP28 Tape width mm Qty/reel (min.order qty) Lead-free available


    Original     		PDF S014/16 OT23-3/5 TQFP44/48 TSSOP14/16 TSSOP28 Jan-04 SGSTDLINPO/1003 OF TL084 OPAMP audio Amp. mosfet 1000 watt 3000 Watt BTL Audio Amplifier AUDIO AMPLIFIER 140 WATT MOSFET 24v 5 amp smps TDA2320A replacement DC MOTOR DRIVE WITH LM324 NE555 IGBT DRIVER TSM1001 lm336 sot23

    TSSOP14

    Abstract: RH 012C Siliconix TSSOP14 package M2003
    Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSSOP14 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS HAST 165 16500 130 °C, 85 % RH FAIL PERCENTAGE 0.00 Pressure Pot 165 16500 121 °, 15 PSIG 0.00 Solderability 45


    Original     		PDF TSSOP14 M2003 11-Jan-08 TSSOP14 RH 012C Siliconix TSSOP14 package M2003

    CMOS NE555

    Abstract: lm393 equivalent DC MOTOR DRIVE WITH LM324 PWM generator TL084 NE556 PWM tsm103 application LM358 replacement UA741 DIP14 TL071 IC equivalent ic MC33079
    Text: Packages Thin Shrink Small Outline Packages Tiny Package OUT 1 SOT23-3 TSSOP8 SO8 DIP8 SOT23-5 TSSOP14 SO14 DIP14 TSSOP16 SO16 DIP16 SO20 DIP20 OPERATIONAL AMPLIFIERS COMPARATORS TIMERS VOLTAGE REFERENCES MIXED ANALOG 5 V+ V- 2 IN+ 3 Dual in Line Packages


    Original     		PDF OT23-3 OT23-5 TSSOP14 DIP14 TSSOP16 DIP16 DIP20 OT23-5 SO14/16 TSSOP14/16 CMOS NE555 lm393 equivalent DC MOTOR DRIVE WITH LM324 PWM generator TL084 NE556 PWM tsm103 application LM358 replacement UA741 DIP14 TL071 IC equivalent ic MC33079

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of TSSOP14 package SOT402-1 Hx Gx P2 0.125 (0.125) Hy By Gy Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area


    Original     		PDF TSSOP14 OT402-1 sot402-1

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LVX32FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LVX32FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LVX04FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LVX04FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LCX00FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LVX74FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LVX74FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCT74AFT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHCT74AFT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCV17FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHCV17FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC11FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC11FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VCX32FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VCX32FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX125FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LCX125FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VCX125FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VCX125FT TSSOP14

    TSSOP14

    Abstract: No abstract text available
    Text: PACKAGE OUTLINE DRAWING TSSOP14 MF-PO-D-0025 revision 0.0 TM Monolithic Power Systems TM 0.004 0.090 0.0256(0.650) TYP 0.010(0.250) GATE PLANE 0.004(0.090) 0o-8o 0.169(4.300) 0.177(4.500) Pin 1 IDENT. 0.244(6.200) 0.260(6.600) 0.018(0.450) 0.030(0.750) DETAIL "A"


    Original     		PDF TSSOP14 MF-PO-D-0025 TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LVX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LVX00FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC05FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC05FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VCX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VCX00FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC00FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX126FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LCX126FT TSSOP14

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX04FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LCX04FT TSSOP14