TSOP 54 tray
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL22
S54G5-80-9JF
TSOP 54 tray
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TSOP II 54
Abstract: TSOP II 54 Package 54PIN 54P3G-C
Text: 54P3G-C Plastic 54pin 400mil TSOP II (LOC) EIAJ Package Code TSOP II 54-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 54 E Recommended Mount Pad Symbol 1 A 27 D e L c L1 HE ME l2 28 y b A2 Detail F A A1 A2 b c D E e HE L L1 y A1 ME I2
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54P3G-C
54pin
400mil
54-P-400-0
TSOP II 54
TSOP II 54 Package
54P3G-C
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54-P-400-0
Abstract: No abstract text available
Text: TSOP 2 54-P-400-0.80-K Mirror finish Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.55 TYP. 2/Aug.14,1997
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54-P-400-0
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Untitled
Abstract: No abstract text available
Text: TSOP 2 54-P-400-0.80-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 1/Aug. 14, 1997
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54-P-400-0
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tsop 54 weight
Abstract: 70-PIN
Text: 70P3S-L Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 52 54 36 E Recommended Mount Pad Symbol 17 1 19 35 A c L D L1 HE ME 70 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1
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70P3S-L
70pin
400mil
70/68-P-400-0
tsop 54 weight
70-PIN
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70-pin
Abstract: No abstract text available
Text: 70P3S-M Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 1 17 35 Recommended Mount Pad E Symbol 54 70 52 36 A c L D L1 HE ME 19 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1
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70P3S-M
70pin
400mil
70/68-P-400-0
70-pin
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TSOP II 54
Abstract: TSOP 54 Package tsop-54 54P3G-C 54PIN TSOP 54PIN
Text: E HE 1 54 e EIAJ Package Code TSOP II 54-P-400-0.80 D JEDEC Code – y Weight g b 27 28 F Lead Material Alloy 42 L1 Detail F A2 A c A1 b2 ME I2 b2 A A1 A2 b c D E e HE L L1 y Symbol Mar.’98 Dimension in Millimeters Min Nom Max – – 1.2 0.125 0.2 0.05
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54-P-400-0
54pin
400mil
54P3G-C
TSOP II 54
TSOP 54 Package
tsop-54
54P3G-C
TSOP 54PIN
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tsop 66
Abstract: No abstract text available
Text: Mounting Pad 54 pin TSOP II (500 mil) 54 28 F E 3° +7° –3° detail of lead end 1 27 A D M M L B N G K C I J H S54G7-80-7KF NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition. NEC CODE
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S54G7-80-7KF
tsop 66
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tsop 66
Abstract: No abstract text available
Text: Mounting Pad 54 pin TSOP II (500 mil) 54 28 E 3° +7° –3° F detail of lead end 1 27 A H I K G J N C D B L M M S54G7-80-7JF NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition. NEC CODE
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S54G7-80-7JF
tsop 66
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HM5212805F-75A
Abstract: PC133-SDRAM Hitachi DSA00164 HM5212165F-75A
Text: HM5212165F-75A HM5212805F-75A 128M LVTTL interface SDRAM 133 MHz 2-Mword x 16-bit × 4-bank/4-Mword × 8-bit × 4-bank PC/133 SDRAM ADE-203-1049 Z Preliminary Rev. 0.0 May. 20, 1999 Description The Hitachi HM5212165F is a 128-Mbit SDRAM organized as 2097152-word × 16-bit × 4-bank. The Hitachi HM5212805F is a 128-Mbit SDRAM organized as 4194304-word × 8-bit × 4-bank. All inputs and outputs are referred to the rising edge of the clock input. It is packaged in standard 54-pin plastic TSOP II.
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HM5212165F-75A
HM5212805F-75A
16-bit
PC/133
ADE-203-1049
HM5212165F
128-Mbit
2097152-word
HM5212805F
HM5212805F-75A
PC133-SDRAM
Hitachi DSA00164
HM5212165F-75A
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Hitachi DSA002753
Abstract: No abstract text available
Text: HM5212165F-75/A60/B60 HM5212805F-75/A60/B60 [ 128M LVTTL interface SDRAM 133 MHz/100 MHz 2-Mword x 16-bit × 4-bank/4-Mword × 8-bit × 4-bank PC/133, PC/100 SDRAM ADE-203-1048 Z Preliminary Rev. 0.0 May. 17, 1999 Description The Hitachi HM5212165F is a 128-Mbit SDRAM organized as 2097152-word × 16-bit × 4-bank. The Hitachi HM5212805F is a 128-Mbit SDRAM organized as 4194304-word × 8-bit × 4-bank. All inputs and outputs are referred to the rising edge of the clock input. It is packaged in standard 54-pin plastic TSOP II.
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HM5212165F-75/A60/B60
HM5212805F-75/A60/B60
Hz/100
16-bit
PC/133,
PC/100
ADE-203-1048
HM5212165F
128-Mbit
2097152-word
Hitachi DSA002753
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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L24002
Abstract: NAND "read disturb" 1GB Toshiba 512 NAND MLC FLASH BGA PC133 registered reference design CMOS 0.8mm process cross Lithium battery CR2025 sony M2V28S30AVP M5M51008CFP
Text: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 MITSUBISHI ELECTRIC L-11002-01 CONTENTS General Business Operation Network and Production Facilities
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L-11002-01
64MDRAM
64MSDRAM
128MSDRAM
256MSDRAM
144MRDRAM
L24002
NAND "read disturb" 1GB
Toshiba 512 NAND MLC FLASH BGA
PC133 registered reference design
CMOS 0.8mm process cross
Lithium battery CR2025 sony
M2V28S30AVP
M5M51008CFP
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sandisk micro sd card pin
Abstract: MCP 1Gb nand 512mb dram 130 256K x 16 DRAM FPM cross reference Toshiba NAND MLC FLASH BGA TSOP 48 Package nand memory toshiba MCP 1Gb 512Mb 130 PC133 registered reference design L7103 02bjxx ulsi
Text: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 L-11002-01 MITSUBISHI ELECTRIC CONTENTS 1. General 1 2. DRAM 9 3. Low Power SRAM
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L-11002-01
L-11003-0I
sandisk micro sd card pin
MCP 1Gb nand 512mb dram 130
256K x 16 DRAM FPM cross reference
Toshiba NAND MLC FLASH BGA
TSOP 48 Package nand memory toshiba
MCP 1Gb 512Mb 130
PC133 registered reference design
L7103
02bjxx
ulsi
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MD300-10A
Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
MD300-10A
QFN tray
tray datasheet bga
SIP 400B
TSOP TRAY 40 PIN
BGA package tray 64
NEC A39A 240
TSOP package tray
6-tsop
TRAY DIMENSIONS 132 PGA
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nec 44 pin LQFP
Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
nec 44 pin LQFP
BGA and QFP Package
256-pin BGA drawing
14 pin ic
28-pin QFP
nec 44-pin qfp
44-Pin QFN
65A1
nec 44-pin LQFP
ic packages
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21x21
Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。
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P22C100300A1
P8C-100-300B
P8CT-100-300B2-1
P8C-100-300A-1
P-DIP8-0300-2
MD300-2A
MD300-1A
MD300-09A
21x21
MM554
tray bga
45x45 bga
X13769XJ2V0CD00
CPGA132
LA010
P14DH-100-300A2-1
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MD300-10A
Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case
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P22C-100-300A-1
P8C-100-300B
P-DIP8-0300-2
MD300-2A
P8CT-100-300B2-1
MD300-1A
P8C-100-300A-1
X13769XJ2V0CD00
MD300-10A
P32C-100-600A
p20d100
C-PGA176-S15U-2
CDIP28
LA-0543A
tray bga
P-TQFP100-14X20-0
0x20010
P14DH-100-300A2-1
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W364M72V-XSBX
Abstract: No abstract text available
Text: White Electronic Designs W364M72V-XSBX ADVANCED* 64Mx72 Synchronous DRAM FEATURES BENEFITS High Frequency = 100, 125MHz Package: • 219 Plastic Ball Grid Array PBGA , 32 x 25mm 3.3V ±0.3V power supply for core and I/Os Fully Synchronous; all signals registered on positive
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W364M72V-XSBX
64Mx72
125MHz
W364M72V-XSBX
W364M72V-ESSB
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W364M72V-XSBX PRELIMINARY* 64Mx72 Synchronous DRAM FEATURES BENEFITS High Frequency = 100, 125, 133MHz Package: • 219 Plastic Ball Grid Array PBGA , 32 x 25mm 3.3V ±0.3V power supply for core and I/Os Fully Synchronous; all signals registered on positive
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64Mx72
133MHz
W364M72V-XSBX
W364M72V-XSBX
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Untitled
Abstract: No abstract text available
Text: W364M72V-XSBX 64Mx72 Synchronous DRAM FEATURES BENEFITS High Frequency = 100, 125, 133MHz 66% SPACE SAVINGS Package: Reduced part count from 9 to 1 • 219 Plastic Ball Grid Array PBGA , 32 x 25mm Reduced I/O count 3.3V ±0.3V power supply for core and I/Os
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W364M72V-XSBX
64Mx72
133MHz
W364M72V-XSBX
133MHz
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W364M72V-XSBX
Abstract: No abstract text available
Text: White Electronic Designs W364M72V-XSBX 64Mx72 Synchronous DRAM FEATURES BENEFITS High Frequency = 100, 125, 133MHz Package: • 219 Plastic Ball Grid Array PBGA , 32 x 25mm 3.3V ±0.3V power supply for core and I/Os Fully Synchronous; all signals registered on positive
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W364M72V-XSBX
64Mx72
133MHz
W364M72V-XSBX
133MHz
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PAL 007 pioneer
Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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