TSOP 54 Package
Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)
|
Original
|
PDF
|
FPT-54P-M01
500mil
54-pin
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 PIN
TSOP II 54 Package
|
54-PIN
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02) 54-pin plastic TSOP (II) (FPT-54P-M02)
|
Original
|
PDF
|
FPT-54P-M02
54-pin
FPT-54P-M02)
F54003S-1C-1
|
TSOP 54 tray
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
|
Original
|
PDF
|
400MIL22
S54G5-80-9JF
TSOP 54 tray
|
MT48LC16M8A2BB
Abstract: No abstract text available
Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free
|
Original
|
PDF
|
128Mb:
MT48LC32M4A2
MT48LC16M8A2
MT48LC8M16A2
54-pin
60-ball
54-ball
MT48LC16M8A2BB
|
MT48LC16M8A2BB
Abstract: No abstract text available
Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free
|
Original
|
PDF
|
128Mb:
MT48LC32M4A2
MT48LC16M8A2
MT48LC8M16A2
PC100-
PC133-compliant
4096-cycle
09005aef8091e66d
x4x8x16
MT48LC16M8A2BB
|
TSOP 54 Package
Abstract: TSOP 54 Package used in where TSOP 54 PIN TSOP II 54 Package TSOP 54 II 54-PIN
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01)
|
Original
|
PDF
|
FPT-54P-M01
54-pin
FPT-54-M01)
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 Package used in where
TSOP 54 PIN
TSOP II 54 Package
TSOP 54 II
|
TSOP II 54
Abstract: TSOP II 54 Package 54PIN 54P3G-C
Text: 54P3G-C Plastic 54pin 400mil TSOP II (LOC) EIAJ Package Code TSOP II 54-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 54 E Recommended Mount Pad Symbol 1 A 27 D e L c L1 HE ME l2 28 y b A2 Detail F A A1 A2 b c D E e HE L L1 y A1 ME I2
|
Original
|
PDF
|
54P3G-C
54pin
400mil
54-P-400-0
TSOP II 54
TSOP II 54 Package
54P3G-C
|
TSOP 54 Package
Abstract: TSOP 54 Package used in where 54-PIN TSOP 54 PIN
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02)
|
Original
|
PDF
|
FPT-54P-M02
54-pin
FPT-54P-M02)
F54003S-1C-1
TSOP 54 Package
TSOP 54 Package used in where
TSOP 54 PIN
|
TSOP 86 Package
Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
Text: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)
|
Original
|
PDF
|
400MIL22
54-pin
66-pin
86-pin
SSD-A-H6023-4
TSOP 86 Package
TSOP 54 tray
TSOP package tray
TSOP 54 Package
TSOP 54 PIN
TSOP 66 Package
JEDEC tray standard tsop
TSOP II 54 Package
tsop 66
tsop package
|
TSOP 86 Package
Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
Text: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)
|
Original
|
PDF
|
400MIL22
54-pin
400mil)
66-pin
86-pin
TSOP 86 Package
TSOP 54 tray
TSOP 54 Package
TSOP 66 Package
TSOP II 54 Package
TSOP 62 Package
JEDEC tray standard tsop
TSOP package tray
|
54-PIN
Abstract: 082I
Text: 54-PIN PLASTIC TSOP II (12.70 mm (500) 54 28 detail of lead end E P F 1 27 A D M C M N K S B L S I G J H NOTE Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 22.66 MAX. B 0.96 MAX.
|
Original
|
PDF
|
54-PIN
S54G7-80-7KF-1
082I
|
tsop 66
Abstract: No abstract text available
Text: Mounting Pad 54 pin TSOP II (500 mil) 54 28 F E 3° +7° –3° detail of lead end 1 27 A D M M L B N G K C I J H S54G7-80-7KF NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition. NEC CODE
|
Original
|
PDF
|
S54G7-80-7KF
tsop 66
|
Untitled
Abstract: No abstract text available
Text: 54 PIN PLASTIC TSOP II (500 mil) 54 28 3° E +7° –3° F detail of lead end 1 27 A H I K G J N C D B L M M S54G7-80-7JF NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS
|
Original
|
PDF
|
S54G7-80-7JF
|
tsop 66
Abstract: No abstract text available
Text: Mounting Pad 54 pin TSOP II (500 mil) 54 28 E 3° +7° –3° F detail of lead end 1 27 A H I K G J N C D B L M M S54G7-80-7JF NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition. NEC CODE
|
Original
|
PDF
|
S54G7-80-7JF
tsop 66
|
|
|
TSOP 54 PIN
Abstract: 54-PIN 082I
Text: 54-PIN PLASTIC TSOP II (12.70 mm (500) 54 detail of lead end 28 F P E 1 27 A H G I J S C D N N M S L B NOTE Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. K ITEM MILLIMETERS A 22.66 MAX. B 0.96 MAX.
|
Original
|
PDF
|
54-PIN
S54G7-80-7JF-1
TSOP 54 PIN
082I
|
tsop 54 weight
Abstract: 70-PIN
Text: 70P3S-L Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 52 54 36 E Recommended Mount Pad Symbol 17 1 19 35 A c L D L1 HE ME 70 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1
|
Original
|
PDF
|
70P3S-L
70pin
400mil
70/68-P-400-0
tsop 54 weight
70-PIN
|
70-pin
Abstract: No abstract text available
Text: 70P3S-M Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 1 17 35 Recommended Mount Pad E Symbol 54 70 52 36 A c L D L1 HE ME 19 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1
|
Original
|
PDF
|
70P3S-M
70pin
400mil
70/68-P-400-0
70-pin
|
K4S561632J
Abstract: K4S56163 K4S561632J-UI/P60 K4S561632J-UI samsung cmos dram 4m x 4 k4s5616
Text: Industrial Synchronous DRAM K4S561632J 256Mb J-die SDRAM Specification 54 TSOP-II with Pb-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
|
Original
|
PDF
|
K4S561632J
256Mb
A10/AP
K4S561632J
K4S56163
K4S561632J-UI/P60
K4S561632J-UI
samsung cmos dram 4m x 4
k4s5616
|
samsung capacitance year code
Abstract: No abstract text available
Text: Industrial Synchronous DRAM K4S561632J 256Mb J-die SDRAM Specification 54 TSOP-II with Pb-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
|
Original
|
PDF
|
K4S561632J
256Mb
A10/AP
samsung capacitance year code
|
54-PIN
Abstract: U27A
Text: 54-PIN PLASTIC TSOP II (10.16 mm (400) 54 28 detail of lead end S T R L Q 1 U 27 A*2 H I S G N C S J B K D M M NOTES 1. Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 22.42 mm MAX.)
|
Original
|
PDF
|
54-PIN
S54G5-80-9NF-1
U27A
|
54-PIN
Abstract: No abstract text available
Text: 54-PIN PLASTIC TSOP II (10.16 mm (400) 54 28 detail of lead end F P E 1 27 A H I G J S L N C D M S B K M NOTES 1. Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. 2. Dimension "A" does not include mold fiash, protrusions or gate
|
Original
|
PDF
|
54-PIN
S54G5-80-9JF-2
|
TSOP II 54
Abstract: TSOP 54 Package tsop-54 54P3G-C 54PIN TSOP 54PIN
Text: E HE 1 54 e EIAJ Package Code TSOP II 54-P-400-0.80 D JEDEC Code – y Weight g b 27 28 F Lead Material Alloy 42 L1 Detail F A2 A c A1 b2 ME I2 b2 A A1 A2 b c D E e HE L L1 y Symbol Mar.’98 Dimension in Millimeters Min Nom Max – – 1.2 0.125 0.2 0.05
|
Original
|
PDF
|
54-P-400-0
54pin
400mil
54P3G-C
TSOP II 54
TSOP 54 Package
tsop-54
54P3G-C
TSOP 54PIN
|
M390S3253HU1
Abstract: No abstract text available
Text: 256MB, 512MB Registered DIMM SDRAM SDRAM Registered Module 168pin Registered Module based on 256Mb H-die 54 TSOP-II with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
|
Original
|
PDF
|
256MB,
512MB
168pin
256Mb
64Mx4
K4S560432H
PC133
M390S3253HU1
|
Untitled
Abstract: No abstract text available
Text: GMM27317230ATG LG Semicon Co.,Ltd. Description 16,777,216 WORDS x72BIT SYNCHRONOUS DYNAMIC RAM MODULE Features The GMM27317230ATG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II
|
OCR Scan
|
PDF
|
GMM27317230ATG
72bits
7317230A
GMM27317230ATG
|