Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M08 Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 48-pin plastic TSOP I (FPT-48P-M08) 48-pin plastic TSOP (I) (FPT-48P-M08) LEAD No. 48 1 Details of "A" part
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FPT-48P-M08
48-pin
FPT-48P-M08)
F48016S-4C-3
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PA48TS20-OT
Abstract: 48TS20-1
Text: PA48TS20- 1 OT Data Sheet 48 pin TSOP socket/48 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect the pins of a 48 pin TSOP device to a 48 pin DIP equivalent. They accept a TSOP device and plug into a DIP socket. The adapter is made up of 2 sub-assemblies. They assemble via
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PA48TS20-
socket/48
PA48TS20-OT
48TSJ-W20
48TS20
PA48TS20-1OT
48TS20-1
PA48TS20-OT
PA48TS20-1OT
48TS20-1
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FPT-48P-M19
Abstract: 50REF
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC FPT-48P-M19 48-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-48P-M19) 48-pin plastic TSOP (I)
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FPT-48P-M19
48-pin
FPT-48P-M19)
50REF
F48029S-2C-2
FPT-48P-M19
50REF
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FPT-48P-M20
Abstract: FPT48P
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC FPT-48P-M20 48-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-48P-M20) 48-pin plastic TSOP (I)
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FPT-48P-M20
48-pin
FPT-48P-M20)
F48030S-2C-2
FPT-48P-M20
FPT48P
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package 1218
Abstract: TSOP048-P-1218-1
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M07 EIAJ code : TSOP048-P-1218-1 Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 48-pin plastic TSOP I (FPT-48P-M07) 48-pin plastic TSOP (I) (FPT-48P-M07)
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FPT-48P-M07
TSOP048-P-1218-1
48-pin
FPT-48P-M07)
F48015S-4C-3
package 1218
TSOP048-P-1218-1
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FPT-48P-M20
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M20 Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 48-pin plastic TSOP I (FPT-48P-M20) 48-pin plastic TSOP (I) (FPT-48P-M20) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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FPT-48P-M20
48-pin
FPT-48P-M20)
F48030S-2on
FPT-48P-M20
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FPT-48P-M19
Abstract: 50REF
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M19 48-pin plastic TSOP I Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-48P-M19) 48-pin plastic TSOP (I) (FPT-48P-M19) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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FPT-48P-M19
48-pin
FPT-48P-M19)
50REF
F48029S-2Cion
FPT-48P-M19
50REF
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48-PIN
Abstract: LRS1338A 1338a2
Text: LRS1338A Data Sheet Stacked Chip 8M Flash Memory and 2M SRAM FEATURES PIN CONFIGURATION • Flash memory and SRAM • Stacked die chip scale package • 48-pin TSOP TSOP48-P-1014 plastic package 48-PIN TSOP TOP VIEW S-A16/F-A15 1 48 S-A17/F-A16 S-A15/F-A14
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LRS1338A
48-pin
TSOP48-P-1014)
S-A16/F-A15
S-A17/F-A16
S-A15/F-A14
I/O15
S-A14/F-A13
S-A13/F-A12
LRS1338A
1338a2
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TSOP 48 LAYOUT
Abstract: TSOP 28 SPI memory Package tsop 38 atmel 134
Text: DataFlash TSOP Migration Path This application note describes how one can design a single PCBA to accommodate the full range of DataFlash products offered in the TSOP package. A board can be laid out for a larger TSOP e.g., 48-lead TSOP and smaller TSOP packages can be
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48-lead
28-lead
32-lead,
40-lead
3316E
TSOP 48 LAYOUT
TSOP 28 SPI memory Package
tsop 38
atmel 134
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29f800 29f400
Abstract: No abstract text available
Text: PA48TS29F Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of AMD flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While these devices are not available in 44 pin DIP
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PA48TS29F
socket/44
29F100
29F200
29F400
29F800
29f800 29f400
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Untitled
Abstract: No abstract text available
Text: PA48-40-1TS Data Sheet 48 pin TSOP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48-40-1TS adapter converts the pinout of Intel E28F200CV/400CV flash memories in 48 pin TSOP packages to a 40 pin DIP footprint for use on several programmers.
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PA48-40-1TS
socket/40
E28F200CV/400CV
E28F200CR/
40DIP
E28F400CR/
E28F800CR/
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29F800 equivalent
Abstract: No abstract text available
Text: PA48TS29F-800 Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of the AMD 29F800 flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While this device is not available in 44 pin DIP
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PA48TS29F-800
socket/44
PA48TS29F
29F800
29F800
29F100,
29F800 equivalent
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Untitled
Abstract: No abstract text available
Text: PA29F-S4-TS Data Sheet 48 pin TSOP Socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter converts the AMD 29Fx00 in its 48 pin TSOP package to a 32 pin DIP programming footprint for the Dataman S4 programmer. The adapter is made up of 3 sub-assemblies. They assemble via
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PA29F-S4-TS
Socket/32
29Fx00
29F200
29F400
29F0x0.
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Untitled
Abstract: No abstract text available
Text: ISSI PACKAGING INFORMATION Plastic TSOP - 48 pins Package Code: T Type I A A1 1 N E b e D1 SEATING PLANE D Lα Plastic TSOP (T - Type I) Millimeters Inches Symbol Min Max Min Max Ref. Std. N 48 A — 1.20 — 0.047 A1 0.05 0.15 0.002 0.006 b 0.17 0.27 0.007 0.011
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PK13197T48
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TSOP 48 socket
Abstract: No abstract text available
Text: SOCKETS/SOCKET TOOLS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile ENPLAS’ open-top TSOP Type I series
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000MOhm
TSOP 48 socket
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TSOP 48-P-1218-0.50 JEDEC Code
Abstract: 2425L1
Text: 48P3Q-E Plastic 48pin 12✕18mm TSOP JEDEC Code – Weight(g) 0.48 Lead Material Alloy 42 MD e EIAJ Package Code TSOP 48-P-1218-0.50 e b2 HD D 48 1 I2 Recommended Mount Pad E y b Symbol 24 25 L1 A1 c A2 A F L Detail F A A1 A2 b c D E e HD L L1 y b2 I2 MD
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48P3Q-E
48pin
48-P-1218-0
TSOP 48-P-1218-0.50 JEDEC Code
2425L1
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TSOP 48-P-1218-0.50 JEDEC Code
Abstract: No abstract text available
Text: 48P3Q-F JEDEC Code – Weight g 0.48 Lead Material Alloy 42 MD e EIAJ Package Code TSOP 48-P-1218-0.50 Plastic 48pin 12✕18mm TSOP( ) HD e 1 48 b2 D I2 y E Recommended Mount Pad b Symbol 25 24 L1 A1 c A2 A F L Detail F A A1 A2 b c D E e HD L L1 y b2 I2 MD
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48P3Q-F
48-P-1218-0
48pin
TSOP 48-P-1218-0.50 JEDEC Code
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Untitled
Abstract: No abstract text available
Text: 48PTC-B Plastic 48pin 10✕14mm TSOP Weight(g) JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code TSOP 48-P-1014-0.40 Under Planning HD e b2 D l2 48 1 Recommended Mount Pad E y Symbol 24 c A2 L1 A1 F A b 25 A A1 A2 b c D E e HD L L1 y L Detail F
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48PTC-B
48pin
48-P-1014-0
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DSA00373
Abstract: No abstract text available
Text: 48P3E-C JEDEC Code – Weight g Lead Material Cu Alloy MD e EIAJ Package Code TSOP 48-P-1220-0.50 Plastic 48pin 12✕20mm TSOP( ) b2 HD e D 1 48 l2 Recommended Mount Pad E y Symbol 25 b 24 A F A1 c A2 L1 L Detail F A A1 A2 b c D E e HD L L1 y b2 I2 MD Dimension in Millimeters
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48P3E-C
48-P-1220-0
48pin
DSA00373
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48P3E-B
Abstract: 48-P-1220-0
Text: 48P3E-B Plastic 48pin 12✕20mm TSOP JEDEC Code – Weight(g) Lead Material Cu Alloy MD e EIAJ Package Code TSOP 48-P-1220-0.50 b2 HD D l2 e 48 1 Recommended Mount Pad E y 24 b Symbol 25 F A1 c A2 A L1 L Detail F A A1 A2 b c D E e HD L L1 y b2 I2 MD Dimension in Millimeters
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48P3E-B
48pin
48-P-1220-0
48P3E-B
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Untitled
Abstract: No abstract text available
Text: 48P3P-F JEDEC Code – Weight g Lead Material Alloy 42 MD e EIAJ Package Code TSOP 48-P-1216-0.50 Plastic 48pin 12✕16mm TSOP( ) HD e 1 48 b2 D I2 Recommended Mount Pad E y b Symbol 25 24 L1 A1 c A2 A F A A1 A2 b c D E e HD L L1 y L Detail F b2 I2 MD Dimension in Millimeters
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48P3P-F
48-P-1216-0
48pin
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DSA00373
Abstract: No abstract text available
Text: 48P3P-E Plastic 48pin 12✕16mm TSOP JEDEC Code – Weight(g) Lead Material Alloy 42 MD e EIAJ Package Code TSOP 48-P-1216-0.50 HD e 48 1 b2 D I2 Recommended Mount Pad E y b Symbol 24 c A2 L1 A1 F A 25 A A1 A2 b c D E e HD L L1 y L Detail F b2 I2 MD Dimension in Millimeters
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48P3P-E
48pin
48-P-1216-0
DSA00373
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Untitled
Abstract: No abstract text available
Text: 48PTC-D Plastic 48pin 10✕14mm TSOP 1 (SMCP) Weight(g) JEDEC Code – Lead Material Alloy 42 MD e EIAJ Package Code TSOP(1)48-P-1014-0.40 x D b2 M HD I2 48 b 1 Recommended Mount Pad E Symbol y G 24 A F e 25 L1 A A1 A2 b c D E e HD L L1 Lp z Z1 x y Detail F
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48PTC-D
48pin
48-P-1014-0
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48P3R
Abstract: No abstract text available
Text: 48P3R-C JEDEC Code – Weight g Lead Material Alloy 42 MD e EIAJ Package Code TSOP 48-P-1220-0.50 Plastic 48pin 12✕20mm TSOP( ) HD e b2 D 48 1 I2 Recommended Mount Pad E y b Symbol 24 25 A F A1 c A2 L1 L Detail F A A1 A2 b c D E e HD L L1 y b2 I2 MD Dimension in Millimeters
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48P3R-C
48-P-1220-0
48pin
48P3R
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