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    TSOP 28 PACKAGE Search Results

    TSOP 28 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    TSOP 28 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PA28TSOP3 Data Sheet 28 pin TSOP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA28TSOP3 adapter converts the pinout of a 28 pin TSOP device to its 28 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. Several Flash EEPROM memories


    Original     		PDF PA28TSOP3 socket/28 27C256 27C512 28C16 28C64 Adapte20

    Untitled

    Abstract: No abstract text available
    Text: PA32-28-3TS Data Sheet 32 pin TSOP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32-28-3TS adapter converts the pinout of a 32 pin TSOP device to its 28 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. The AMD 27C256, and others


    Original     		PDF PA32-28-3TS socket/28 27C256, PA32-28-3TS 27C256 32283TS

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M16 28-pin plastic TSOP II Lead pitch 50mil Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M16) 28-pin plastic TSOP (II) (FPT-28P-M16) 28 * : Resin protrusion.(Each side 0.15 (.006) Max)


    Original     		PDF FPT-28P-M16 50mil 400mil 28-pin FPT-28P-M16) F28049S-1C-1

    m14 transistor

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M14 28-pin plastic TSOP II Lead pitch 50mil Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M14) * : Resin protrusion. (Each side : 0.15 (.006) Max) 28-pin plastic TSOP (II)


    Original     		PDF FPT-28P-M14 50mil 400mil 28-pin FPT-28P-M14) F28040S-2C-1 m14 transistor

    FPT-28P-M03

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M03 Lead pitch 0.55mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Normal bend 28-pin plastic TSOP I (FPT-28P-M03) 28-pin plastic TSOP (I) (FPT-28P-M03) 22 21 Details of "A" part


    Original     		PDF FPT-28P-M03 28-pin FPT-28P-M03) F28018S-5C-3 FPT-28P-M03

    BGA and QFP Package mounting

    Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
    Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M04 Lead pitch 0.55mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Reverse bend 28-pin plastic TSOP I (FPT-28P-M04) 28-pin plastic TSOP (I) (FPT-28P-M04) 22 21 Details of "A" part


    Original     		PDF FPT-28P-M04 28-pin FPT-28P-M04) F28019S-5C-3

    EME-7351

    Abstract: 140C 8361H JESD22 sumitomo silver epoxy
    Text: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4


    Original     		PDF EME-7351 EME-7351 8361H JESD22-A112 CY7C199-ZC 140C 8361H JESD22 sumitomo silver epoxy

    2420

    Abstract: TSOP 48 thermal resistance 140C JESD22
    Text: Qualification Report October 1996, QTP #95072/95516, Version 2.1 Thin Small Outline Package 28 Lead TSOP Type 1 CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 28 Lead TSOP Alloy 42 Hyundai, Korea


    Original     		PDF RE49510965 CY7C199-ZC CY7C199-ZC 2420 TSOP 48 thermal resistance 140C JESD22

    Untitled

    Abstract: No abstract text available
    Text: HN58V256A Series, HN58V257A Series Ordering Information Type No. Access time Package HN58V256AFP-12 120 ns 400 mil 28-pin plastic SOP FP-28D HN58V256AT-12 120 ns 28-pin plastic TSOP (TFP-28DB) HN58V257AT-12 120 ns 8 x 14 mm2 32-pin plastic TSOP (TFP-32DA)


    Original     		PDF HN58V256A HN58V257A HN58V256AFP-12 HN58V256AT-12 HN58V257AT-12 28-pin FP-28D) TFP-28DB) 32-pin

    051C

    Abstract: No abstract text available
    Text: ISSI PACKAGING INFORMATION Plastic TSOP - 24/28-pins Package Code: T Type II N N/2+1 E 1 N/2 D SEATING PLANE H A e B L A1 α C Plastic TSOP (T—Type II) Millimeters Inches Min Max Min Max Symbol Ref. Std. No. Leads 24/28 A 1.00 1.20 A1 0.05 0.20 B 0.36


    Original     		PDF 24/28-pins PK001-1A 051C

    cel-9200

    Abstract: Cypress 140C 8361H CEL9200 JESD22 128H copper bond wire
    Text: Cypress Semiconductor Qualification Report QTP# 97175 VERSION 1.0 June, 1997 28 Ld TSOP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97175, V. 1.0 Page 2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


    Original     		PDF CEL9200 8361H JESD22-A112 30C/60 CY7C199-ZC cel-9200 Cypress 140C 8361H CEL9200 JESD22 128H copper bond wire

    Untitled

    Abstract: No abstract text available
    Text: ISSI PACKAGING INFORMATION Plastic TSOP - 28-pins Package Code: T Type I 1 E H N D SEATING PLANE A S B e Symbol Ref. Std. No. Leads A A1 B C D E H e L α α C Plastic TSOP (T—Type I) Millimeters Inches Min Max Min Max 28 1.00 1.20 0.05 0.20 0.16 0.27 0.10


    Original     		PDF 28-pins PK13197T28

    Untitled

    Abstract: No abstract text available
    Text: ISSI PACKAGING INFORMATION Plastic TSOP - 28-pins Package Code: V Type I 1 E H N D SEATING PLANE A B e Symbol Ref. Std. No. Leads A A1 B C D E H e L α PRELIMINARY PK001-1A α C Plastic TSOP (V—Type I) Millimeters Inches Min Max Min Max 28 1.00 1.20 0.05 0.20


    Original     		PDF 28-pins PK001-1A

    EME-7351

    Abstract: Ablestik 8361 140C JESD22 JESD22-A112
    Text: Cypress Semiconductor Qualification Report QTP# 97098 VERSION 1.0 April, 1997 28 Ld Thin Small Outline Package TSOP Anam, Philippines Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP QTP# 97098, V. 1.0 Page 2 of 4 April, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


    Original     		PDF 209mil JESD22-A11 85C/85 CY7C199-ZC EME-7351 Ablestik 8361 140C JESD22 JESD22-A112

    TSOP 86 Package

    Abstract: MBH32A MBS28A MDA44 MDB44
    Text: Thin Small Outline Package TSOP 28 Lead Molded Thin Small Outline Package NS Package Number MBS28A 1999 National Semiconductor Corporation MS101177 www.national.com Thin Small Outline Package (TSOP) May 1999 32 Lead Molded Thin Small Outline Package, EIAJ, Type I


    Original     		PDF MBS28A MS101177 MBH32A MDA44 MDB44 TSOP 86 Package MBH32A MBS28A MDA44 MDB44

    TSOP package tray

    Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
    Text: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)


    Original     		PDF 28-pin 32-pin SSD-A-H7033-1 TSOP package tray JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1

    TSOP package tray

    Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)


    Original     		PDF 400MIL18 28-pin 44-pin SSD-A-H6111-2 TSOP package tray TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop

    JEDEC tray standard tsop

    Abstract: TSOP 28 Package TSOP package tray JEDEC TRAY DIMENSIONS
    Text: UNIT : mm HEAT PROOF 7 109.36 PPE NEC 135°C MAX 13.67 13.27 TSOP 2 400MIL18 18.8 A' 20.42 14.56 285.88 315.0 (322.6) SECTION A-A' 18.8 5.62 (6.35) 15.0 7.62 135.9 9x15=135 12.2 A Applied Package Quantity (pcs) 28-pin Plastic TSOP(II)(400mil) MAX. 135 Material


    Original     		PDF 400MIL18 28-pin 400mil) 44-pin JEDEC tray standard tsop TSOP 28 Package TSOP package tray JEDEC TRAY DIMENSIONS

    ZA104

    Abstract: zu107 p028
    Text: SONY CXK58257CTM/CYM/CM/CP -70LLX 32768-word x 8-bit High Speed CMOS Static RAM Description CXK58257CTM CXK58257CYM 28 pin TSOP Plastic 28 pin TSOP (Plastic) CXK58257CM CXK58257CP 28 pin SOP (Plastic) 28 pin DIP (Plastic) The CXK58257CTM/CYM/CM/CP is 262,144 bits


    OCR Scan     		PDF CXK58257CTM/CYM/CM/CP -70LLX 32768-word CXK58257CTM/CYM TSOP-28P-L01R CXK58257CTM/CYM/CM/CP ZA104 zu107 p028

    Untitled

    Abstract: No abstract text available
    Text: M O SEL VITELIC PRELIM INARY V62C318256 2 .7 VOL T 3 2 K X 8 STA TIC RAM Features • Packages - 28-pin TSOP Standard - 28-pin TSOP (Reverse) - 28-pin 600 mil PDIP - 28-pin 300 mil SOP (450 mil pin-to-pin) ■ High-speed: 35, 45, 55, 70 ns ■ Ultra low DC operating current of 3mA (max.)


    OCR Scan     		PDF V62C318256 28-pin V62C318256 144-bit b3S3311 0D047S4

    cxk58257btm

    Abstract: No abstract text available
    Text: SONY CXK58257BTM/BYM -7 0 L L X /1 0 L L X 32768-word x 8-bit High Speed CMOS Static RAM Description CXK582S7BTM The CXK58257BTM/BYM is 262.144 bits high CXK58257BYM 28 pin TSOP Plastic 28 pin TSOP (Plastic) speed CMOS static RAM organized as 32,768 words by 8 bits.


    OCR Scan     		PDF 32768-word CXK58257BTM/BYM -70LLX/1QLLX CXK58257BTM CXK58257BYM CXK58257BTM/BYM 70LLX 10LLX

    Untitled

    Abstract: No abstract text available
    Text: SONY CXK58257BTM/BYM - 7 0 L L X /1 0 L L X 32768-word x 8-bit High Speed CMOS Static RAM Description The CXK58257BTM/BYM is 262.144 bits high speed C M O S static RAM organized as 3 2,768 CXK58257BTM CXK58257BYM 28 pin TSOP Plastic 28 pin TSOP (Plastic)


    OCR Scan     		PDF CXK58257BTM/BYM CXK58257BTM 32768-word CXK58257BTM/BYM CXK58257BYM 70LLX -10LLX 28PINTSOP

    Untitled

    Abstract: No abstract text available
    Text: 2 MEG X 8 FPM DRAM MICRON HR AM MT4C2M8B1 MT4LC2M8B1 U r iM IV I FEATURES PIN ASSIGNMENT (Top View OPTIONS LC C • Packages Plastic 28-pin SOJ (300 mil) Plastic 28-pin SOJ (400 mil) Plastic 28-pin TSOP (300 mil) DJ DW TG • Timing 60ns access 28-Pin SOJ


    OCR Scan     		PDF 28-Pin