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    TSMC DESIGN RULE Search Results

    TSMC DESIGN RULE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    TSMC DESIGN RULE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TSMC Flash

    Abstract: linear handbook E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 automatic heat detector project report
    Text: Cyclone III Design Guidelines November 2008 AN-466-1.2 Introduction The Cyclone III FPGA family offered by Altera ® is a cost-optimized, memory-rich FPGA family. Cyclone III FPGAs are built on Taiwan Semiconductor Manufacturing Company's TSMC 65-nm low-power (LP) process technology with additional silicon


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    PDF AN-466-1 65-nm TSMC Flash linear handbook E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 automatic heat detector project report

    018U

    Abstract: Nordic Semiconductor ADC Verilog Implementation TSMC 0.18Um
    Text: PhysicalExpress H HA AN ND DO OFFFF A AN ND DM MA AN NU UFFA AC CTTU UR RIIN NG GS SE ER RV VIIC CE E What is PhysicalExpress? Through several years of experience with Handoff projects, Nordic Semiconductor is able to present customers with a well-proven methodology and a simple, streamlined interface. Combining this methodology with state-of-the-art EDA tools and silicon proven IP, we


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    JESD22-A114F

    Abstract: JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: W-1002-01(R4) DATE: October 4, 2010 Affected Products: Refer to the attached list of products transferring from IDT Fab 4 to TSMC


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    PDF JESD22-A115B, JESD78B AV265 JESD22-B116-A, EIA/JESD22-A110B, EIA/JESD22-A102C, 168hrs JESD22-A113 JESD22-A114F JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C

    tsmc 130nm metal process

    Abstract: tsmc 130 lp 65nm tsmc design rule Qualcomm "power management" 2010 Altera Cyclone III qualcomm power
    Text: White Paper Achieving Low Power in 65-nm Cyclone III FPGAs With the introduction of the 65-nm Cyclone III family, Altera continues to deliver greater capabilities to designers of cost-sensitive high-volume applications. The move to the 65-nm process node provides the benefits associated with


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    PDF 65-nm 90-nm tsmc 130nm metal process tsmc 130 lp 65nm tsmc design rule Qualcomm "power management" 2010 Altera Cyclone III qualcomm power

    Broadcom product roadmap

    Abstract: 65-nm 65nm sources tsmc 130nm metal process 2015 static ram BROADCOM "heat sink" Qualcomm "power management" 2010 WP-01002-1 65nm
    Text: White Paper Altera’s Strategy for Delivering the Benefits of the 65-nm Semiconductor Process Introduction Altera's strategy for delivering the benefits of the 65-nm semiconductor manufacturing process focuses on leveraging advanced technologies and methods to provide the most capable and highest performance devices at the lowest cost,


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    PDF 65-nm 65-nm Broadcom product roadmap 65nm sources tsmc 130nm metal process 2015 static ram BROADCOM "heat sink" Qualcomm "power management" 2010 WP-01002-1 65nm

    TSMC fuse

    Abstract: TSMC 40nm TSMC 90nm sram 65nm sram TSMC 40nm layout issue TSMC 40nm SRAM 32nm tsmc tsmc 130nm metal process SONY GERMANIUM TRANSISTOR germanium power devices corporation
    Text: White Paper Leveraging the 40-nm Process Node to Deliver the World’s Most Advanced Custom Logic Devices Introduction Altera’s launch of the Stratix IV and HardCopy® IV device families in the second quarter of 2008 marked the introduction of the world’s first 40-nm FPGAs and the industry’s only risk-free path to 40-nm ASICs. For Altera, the


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    PDF 40-nm TSMC fuse TSMC 40nm TSMC 90nm sram 65nm sram TSMC 40nm layout issue TSMC 40nm SRAM 32nm tsmc tsmc 130nm metal process SONY GERMANIUM TRANSISTOR germanium power devices corporation

    TSMC 0.35Um

    Abstract: TSMC 1P4M HP83K cmos tsmc 0.18 tsmc FAB10 FAB-10 tsmc cmos 0.35 PI7C8150B PI7C8150A PI7C8152A
    Text: 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 06-04 Date Issued: June 30, 2006 Product(s) Affected: PI7C8150A, 8150A-33, 8150B, 8150B-33, PI7C8152A, 8152B Manufacturing Location Affected: TSMC Fab 7 and 10


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    PDF PI7C8150A, 150A-33, 8150B, 8150B-33, PI7C8152A, 8152B FAB10 TSMC 0.35Um TSMC 1P4M HP83K cmos tsmc 0.18 tsmc FAB10 FAB-10 tsmc cmos 0.35 PI7C8150B PI7C8150A PI7C8152A

    DC04 display

    Abstract: how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt
    Text: Quality And Reliability Report 2005 DC04-0001 Page 1 of 79


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    PDF DC04-0001 DC04 display how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt

    PCN9805

    Abstract: tsmc 0.35 EPF10K100A EPF10K50V C42-43
    Text: PROCESS CHANGE NOTIFICATION FLEX 10K AND FLEX 6000 ADDITIONAL SOURCE OF SUPPLY Altera is adding WaferTech as an additional source of supply for FLEX 10K and FLEX 6000 products currently run at TSMC. WaferTech is a joint venture with TSMC, Altera and other


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    PDF 35-micron EPF10K50V EPF10K100A LCZ42# LCZ43# XCZ42YYWW XCZ43YYWW PCN9805 PCN9805 tsmc 0.35 EPF10K100A EPF10K50V C42-43

    TSMC 0.35um

    Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
    Text: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:


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    Untitled

    Abstract: No abstract text available
    Text: QUALITY & RELIABILITY CYPRESS 2000 Q4 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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    cmos tsmc 0.18

    Abstract: reliability data analysis report failure test report
    Text: QUALITY & RELIABILITY CYPRESS 2000 Q3 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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    cmos tsmc 0.18

    Abstract: No abstract text available
    Text: CYPRESS QUALITY & RELIABILITY 2000 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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    Ablebond 84-1*SR4

    Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
    Text: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:


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    PDF PI6CV857A Ablebond 84-1*SR4 z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4

    TSMC 0.18 um CMOS

    Abstract: vhdl coding for analog to digital converter adc vhdl cmos tsmc 0.18 0.18-um CMOS technology characteristics TSMC 0.18 um CMOS silicon AD8138 AD8351 N-7075 vlsi design physical verification
    Text: PRELIMINARY PRODUCT SPECIFICATION nAD12110-18a 12-bit 110 MSPS Analog-to-Digital Converter IP FEATURES • • • • • • 12-bit ADC Up to 110 MSPS Conversion Rate Single 1.8 V Power Supply 1.5 V p-p Differential Input Excellent Dynamic Performance 67 dBc SNR at FIN = 10 MHz


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    PDF nAD12110-18a 12-bit nAD12110-18a N-7075 TSMC 0.18 um CMOS vhdl coding for analog to digital converter adc vhdl cmos tsmc 0.18 0.18-um CMOS technology characteristics TSMC 0.18 um CMOS silicon AD8138 AD8351 vlsi design physical verification

    TSMC 0.18 um CMOS

    Abstract: TSMC rf cmos 0.18 um IFSR15 N-7075 cmos tsmc 0.18 1/TSMC rf cmos 0.18 um
    Text: PRELIMINARY PRODUCT SPECIFICATION nDA10200x2-18a Dual 10-bit 200 MSPS Digital-to-Analog Converter IP FEATURES • • • • • • OPM[2:0] CLK Dual 10-bit Current Output Transmit DAC Up to 200 MSPS Update Rate Single 1.8 V Power Supply Complementary Current Outputs


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    PDF nDA10200x2-18a 10-bit nDA10200x2-18a N-7075 TSMC 0.18 um CMOS TSMC rf cmos 0.18 um IFSR15 cmos tsmc 0.18 1/TSMC rf cmos 0.18 um

    verilog code pipeline square root

    Abstract: AD8138 AD8351 N-7075 tsmc cmos 0.13 um tsmc cmos 0.13 um ADC vhdl coding pipeline adc digital error correction TSMC Flash IP
    Text: PRELIMINARY PRODUCT SPECIFICATION nAD10120-13a 10-bit 120 MSPS Analog-to-Digital Converter IP FEATURES • • • • • • 10-bit ADC Up to 120 MSPS Conversion Rate Single 1.2 V Power Supply 1.0 V p-p Differential Input Excellent Dynamic Performance 59 dBFS SNR at FIN = 10 MHz


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    PDF nAD10120-13a 10-bit nAD10120-13a N-7075 verilog code pipeline square root AD8138 AD8351 tsmc cmos 0.13 um tsmc cmos 0.13 um ADC vhdl coding pipeline adc digital error correction TSMC Flash IP

    tsmc cmos 0.13 um

    Abstract: digital to analog converter vhdl coding vlsi design physical verification 12 bit DAC VHDL CODE N-7075 vhdl coding for analog to digital converter IFSR10 TSMC 0.13 um CMOS
    Text: PRELIMINARY PRODUCT SPECIFICATION nDA10400-13a 10-bit 400 MSPS Digital-to-Analog Converter IP FEATURES • • • • • 10-bit Current Output Transmit DAC Up to 400 MSPS Update Rate Single 1.2 V Power Supply Complementary Current Outputs 1 – 10 mA Adjustable Full Scale Current


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    PDF nDA10400-13a 10-bit nDA10400-13a N-7075 tsmc cmos 0.13 um digital to analog converter vhdl coding vlsi design physical verification 12 bit DAC VHDL CODE vhdl coding for analog to digital converter IFSR10 TSMC 0.13 um CMOS

    tsmc cmos 0.13 um

    Abstract: N-7075
    Text: PRELIMINARY PRODUCT SPECIFICATION nDA10400x2-13a Dual 10-bit 400 MSPS Digital-to-Analog Converter IP FEATURES • • • • • DIGITAL CONTROL OPM[2:0] CLK0 IOUT0 LATCH • Dual 10-bit Current Output Transmit DAC Up to 400 MSPS Update Rate Single 1.2 V Power Supply


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    PDF nDA10400x2-13a 10-bit nDA10400x2-13a N-7075 tsmc cmos 0.13 um

    tsmc mos 45

    Abstract: CY7C981-JC EME-6300H JESD22 140C repeater high sensitivity
    Text: Cypress Semiconductor Qualification Report QTP# 96441 VERSION 1.0 March, 1997 10-Base-T Multiport Repeater CY7C981 Cypress Semiconductor Multiport Repeater Device: CY7C981 Package: PLCC QTP# 96441, V. 1.0 Page 2 of 7 March, 1997 PRODUCT DESCRIPTION for qualification


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    PDF 10-Base-T CY7C981 MY301A7 85C/85 CY7C981-JC AF1074 tsmc mos 45 CY7C981-JC EME-6300H JESD22 140C repeater high sensitivity

    vhdl coding for analog to digital converter

    Abstract: analog to digital converter vhdl coding TSMC 0.18 um CMOS digital to analog converter vhdl coding AD8138 AD8351 N-7075 verilog code pipeline square root vlsi design physical verification vhdl code for digital to analog converter
    Text: PRELIMINARY PRODUCT SPECIFICATION nAD10120x2-13a Dual 10-bit 120 MSPS Analog-to-Digital Converter IP FEATURES • • • • • OPM[1:0] CLK EXTREF INP0 • • • • PIPELINE ADC VCM0 INN0 REFP REFN VOLTAGE REFERENCE VCM1 PIPELINE ADC INN1 Communication Receive Channel


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    PDF nAD10120x2-13a 10-bit nAD10120x2-13a N-7075 vhdl coding for analog to digital converter analog to digital converter vhdl coding TSMC 0.18 um CMOS digital to analog converter vhdl coding AD8138 AD8351 verilog code pipeline square root vlsi design physical verification vhdl code for digital to analog converter

    TSMC 0.18 um CMOS

    Abstract: verilog code for adc verilog code pipeline square root vhdl coding for analog to digital converter AD8138 AD8351 N-7075 0.18-um CMOS technology characteristics vhdl coding for pipeline TSMC Flash IP
    Text: PRELIMINARY PRODUCT SPECIFICATION nAD10110x2-18a Dual 10-bit 110 MSPS Analog-to-Digital Converter IP FEATURES • • • • • OPM[1:0] CLK EXTREF INP0 • • • • PIPELINE ADC VCM0 INN0 REFP REFN VOLTAGE REFERENCE VCM1 PIPELINE ADC INN1 Communication Receive Channel


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    PDF nAD10110x2-18a 10-bit nAD10110x2-18a N-7075 TSMC 0.18 um CMOS verilog code for adc verilog code pipeline square root vhdl coding for analog to digital converter AD8138 AD8351 0.18-um CMOS technology characteristics vhdl coding for pipeline TSMC Flash IP

    tsmc mos 45

    Abstract: CY37032 CY37032V tsmc eeprom 8361H CY37032VP Nitto-8000
    Text: Cypress Semiconductor Qualification Report QTP# 99252 VERSION 1.0 September, 1999 High-Performance CPLDs CY37032P* UltraLogic 32-Macrocell ISR™ CPLDs 5V CY37032VP* UltraLogic™ 32-Macrocell ISR™ CPLDs (3V) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:


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    PDF CY37032P* 32-Macrocell CY37032VP* CY37032 CY37256P160-AC tsmc mos 45 CY37032V tsmc eeprom 8361H CY37032VP Nitto-8000

    tsop 928

    Abstract: No abstract text available
    Text: QUALITY & RELIABILITY CYPRESS 2001 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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