QII53013-7
Abstract: No abstract text available
Text: 10. PowerPlay Power Analysis QII53013-7.1.0 Introduction As designs grow larger and process technology continues to shrink, power becomes an increasingly important design consideration. When designing a printed circuit board PCB , the power consumed by a device
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J971
Abstract: Teradyne J971 Digital Test system seeker missile seeker catalyst tester teradyne catalyst mathcad J953 Teradyne Communications tower
Text: Mixed-Signal Processing and Power Conversion Solutions for Military/Aerospace ANALOG DEVICES: THE LEADER IN MIXED-SIGNAL INTEGRATION When mixed-signal design is in your critical path, or if standard PCB interconnects are limiting your ability to meet challenging
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D-81373
H3422-5-10/98
J971
Teradyne J971 Digital Test system
seeker
missile seeker
catalyst tester
teradyne catalyst
mathcad
J953
Teradyne
Communications tower
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Melcor peltier
Abstract: peltier melcor Peltier element Melcor thermo peltier Melcor footprint soic28 Melcor peltier 40 peltier peltier cooler peltier application notes
Text: MEASURING THE EFFECTS OF ENERGY FLOW ON IC PACKAGE THERMAL PERFORMANCE APPLICATION NOTE AN-160 Integrated Device Technology, Inc. By Chris Wyland ABSTRACT Heat to Air This paper is an examination of how to model PCB conduction effects when modeling IC package thermal performance.
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AN-160
EIA/JESD51-1
MRL-92-TIR-2
EIA/JESD51-3
Melcor peltier
peltier melcor
Peltier element
Melcor thermo peltier
Melcor
footprint soic28
Melcor peltier 40
peltier
peltier cooler
peltier application notes
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LGA voiding
Abstract: AN1091 international rectifier application note AN-1091 AN-1028 AN-1029 AN10912 vias
Text: Application Note AN-1091 Recommended PCB Via Design for International Rectifier’s BGA and LGA Packages By Kevin Hu, International Rectifier Table of Contents Page Introduction . 2
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AN-1091
AN-1028.
AN-1029.
LGA voiding
AN1091
international rectifier application note
AN-1091
AN-1028
AN-1029
AN10912
vias
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Untitled
Abstract: No abstract text available
Text: Ultrathin Discrete Capacitors for Emerging Embedded Technology Radim Uher AVX Czech Republic, Za Olsavkou 303, 686 01 Uherske Hradiste Czech Republic Tomas Zednicek AVX Czech Republic, Dvorakova 328, 563 01 Lanskroun, Czech Republic ABSTRACT Passive components can represent as much as 70% of PCB footprint in today’s
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QII53013-10
Abstract: No abstract text available
Text: 12. PowerPlay Power Analysis QII53013-10.0.0 This chapter describes how to use the Altera Quartus® II PowerPlay Power Analysis tools to accurately estimate device power consumption. As designs grow larger and process technology continues to shrink, power becomes
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5M80ZT100
Abstract: 5M570ZM100 5M2210ZF256 5M160ZE64 5m240Zt100 5M1270ZF324 5m570ZT144 EP4CE15F17 5M40ZE64A5 5M1270ZT
Text: The Automotive-Grade Device Handbook The Automotive-Grade Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com AUT5V1-2.0 Document last updated for Altera Complete Design Suite version: Document publication date: 11.0 May 2011 Subscribe 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.
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Abstract: No abstract text available
Text: R R series Thermal Emission Microscope IAHEAI New High-sensitivity detector thermal detector InSb Motorized turret with objective lenses • Two objective lenses for analyzing thermal emissions • Three objective lenses for probing and laser scanning Thermal Emission Microscope
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B1201
SSMS0012E15
JUN/2015
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AWT6264
Abstract: R3003 AWT6264R AN-0003
Text: Application Note Thermal Design for AWT6264R Rev 0 RELEVANT PRODUCTS • AWT6264R INTRODUCTION ANADIGICS’ AWT6264 Mobile WiMAX Power Amplifier is a high performance device that delivers exceptional linearity and efficiency at high output power levels. The device operates over the voltage
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AWT6264R
AWT6264
R3003
AWT6264R
AN-0003
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R3003
Abstract: thermal analysis on pcb 858C AN-0003 AWM6431 AWM6432
Text: Application Note Thermal Design for AWM6432 Rev 0 Relevant products • • AWM6432 AWM6431 OVERVIEW ANADIGICS’ AWM6432 WiMAX Power Amplifier is a high performance device that delivers exceptional linearity and efficiency at high output power levels. The device operates over the voltage supply range
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AWM6432
AWM6431
AWM6432
R3003
thermal analysis on pcb
858C
AN-0003
AWM6431
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Yamaichi IC51-0444-1568
Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
Text: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production
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QII53013-7
Abstract: No abstract text available
Text: Section III. Power Estimation and Analysis As FPGA designs grow larger and processes continue to shrink, power becomes an ever-increasing concern. When designing a printed circuit board, the power consumed by a device needs to be accurately estimated to develop an appropriate power budget, and to design the power
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NCS5650
Abstract: AND8402
Text: AND8402 Thermal Considerations for the NCS5650 Prepared by: Roger Stout ON Semiconductor http://onsemi.com APPLICATION NOTE Overview Note 1 . On the other hand, because of the small footprint of the package, board−to−ambient thermal resistance (which
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NCS5650
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AND8402
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Altera Flip Chip BGA warpage
Abstract: ansys graphite thermal spreader graphite thermal 1998 ansys cfd
Text: Thermal Interface Material TIM Design Guidance For Flip Chip BGA Package Thermal Performance T.D. Yuan, Hsin-yu Pan Taiwan Semiconductor Manufacturing Company, Ltd. No. 6, Creation Rd. 2, Science-Based Industrial Park Hsin-Chu, Taiwan, 300-77, R.O.C. [email protected], [email protected]
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peltier element schematic
Abstract: peltier cooler schematic peltier schematic pitarresi IC SEM 2005 smema A356 Theory of Modern Electronic Semiconductor Device
Text: Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-free Solder Joints Kaushik Setty1, Ganesh Subbarayan1 and Luu Nguyen2 School of Mechanical Engineering, Purdue University, W. Lafayette, IN 47907-2088 2 National Semiconductor Corporation, Santa Clara, CA 95051
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Untitled
Abstract: No abstract text available
Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)
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DS571J
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thermal analysis on pcb
Abstract: EPM1270 EPM2210 EPM240 EPM570
Text: 17. Understanding and Evaluating Power in MAX II Devices MII51018-2.1 Introduction Power consumption has become an important factor for CPLD applications with the increased use of CPLDs in low power designs. Overall low standby static and dynamic power is becoming increasingly important to reduce system power, and can
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thermal analysis on pcb
EPM1270
EPM2210
EPM240
EPM570
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Application Note 32
Abstract: Vishay power PhotoTRIAC TRIAC RCA "optotriac" Thermal Resistance Calculation TO 731 triac
Text: VISHAY SEMICONDUCTORS www.vishay.com Optocouplers and Solid-State Relays Application Note 32 Thermal Characteristics of Power Phototriac INTRODUCTION Behavior of any semiconductor device depends on the temperature of its die. Hence, electrical parameters are
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VO3526
DIP-16
21-Oct-11
Application Note 32
Vishay power PhotoTRIAC
TRIAC RCA
"optotriac"
Thermal Resistance Calculation TO
731 triac
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SCHEMATIC POWER SUPPLY WITH IGBTS
Abstract: No abstract text available
Text: Product Line Overview Applications Key Products Energy Saving Products • Appliances • Digital Control ICs Integrated design platforms that enable customers to add energyconserving features that achieve lower operating energy costs and manufacturing Bill of Material
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0328A
SCHEMATIC POWER SUPPLY WITH IGBTS
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wireless charging through microwaves
Abstract: 9824 motorola wireless mobile charging through microwaves BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS RCA designers handbook Solid-State Power Circuits SLWA009 AN4A506 Plessey TRF7610
Text: Thermal Considerations for RF Power Amplifier Devices Application Report 1998 Mixed Signal Products Printed in U.S.A. 2/98 SLWA009 Thermal Considerations for RF Power Amplifier Devices SLWA009 February 1998 Printed on Recycled Paper Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
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SLWA009
wireless charging through microwaves
9824 motorola
wireless mobile charging through microwaves
BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS
RCA designers handbook Solid-State Power Circuits
SLWA009
AN4A506
Plessey
TRF7610
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Position Estimation
Abstract: 8B10B
Text: PowerPlay Early Power Estimator User Guide For Arria GX FPGAs 101 Innovation Drive San Jose, CA 95134 www.altera.com Document Version: Document Date: 1.1 May 2008 Copyright 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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murata GRM MTBF
Abstract: ABC-V-10 EN61000-4-3 EN61000-4-4 SR-332 TCE 0141 5J21
Text: NEW Product SIL15E-12M - 12Vin Single Application Note 172 1. Introduction 2 2. Models Features 2 3. General Description Electrical Description Physical Construction Mechanical Outline Drawing Pin-out Table PCB Layout Information 4 4 5 6. Packaging Information
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SIL15E-12M
12Vin
00HEX
45HEX
80HEX
SIL15E-12M
sil15e
murata GRM MTBF
ABC-V-10
EN61000-4-3
EN61000-4-4
SR-332
TCE 0141
5J21
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JEDEC MO-187
Abstract: JEDEC MO-153
Text: LEADFRAME Data Sheet TSSOP/MSOP/VSSOP Thermal Performance Forced Convection, Single-layer PCB Pkg Thin Shrink Small Outline Package, Micro Small Outline Package, Very-Thin Shrink Small Outline Package TSSOP/MSOP/ VSSOP TSSOP, MSOP and VSSOP are leadframe based, plastic
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AND8433
Abstract: NSI45020AT1G 220v ac to 110v dc regulator NSI50090DDT1G NSI45020T1G IS141 NSI50010YT1G NSI50035DZT1G regulator 220v AC VRS transformer
Text: AND8433/D Using ON Semiconductor Constant Current Regulator CCR Devices in AC Applications http://onsemi.com Prepared by: Mike Sweador APPLICATION NOTE Introduction temperature coefficient, thus as power is dissipated by the CCR (increased temperature), its internal resistance
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AND8433/D
AND8433
NSI45020AT1G
220v ac to 110v dc regulator
NSI50090DDT1G
NSI45020T1G
IS141
NSI50010YT1G
NSI50035DZT1G
regulator 220v AC
VRS transformer
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