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    SOT-113 Search Results

    SOT-113 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR2LF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    SOT-113 Datasheets (14)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1130A NXP Semiconductors Flanged ceramic package; 2 mounting holes; 4 leads Original PDF
    SOT1131-1 NXP Semiconductors Footprint for reflow soldering SOT1131-1 Original PDF
    SOT1133-1_515 NXP Semiconductors HXQFN60(U); Reel dry pack; SMD, 7"Q1/T1 Standard product orientationOrderable part number ending ,515 or ZOrdering code (12NC) ending 515 Original PDF
    SOT1134-1 NXP Semiconductors Plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals Original PDF
    SOT1134-1 NXP Semiconductors Footprint for reflow soldering SOT1134-1 Original PDF
    SOT1134-1_518 NXP Semiconductors Standard product orientation 12NC ending 518 Original PDF
    SOT1134-2 NXP Semiconductors Plastic compatible thermal enhanced extremely thin quad flat package; no leads Original PDF
    SOT1134-2 NXP Semiconductors Footprint for reflow soldering SOT1134-2 Original PDF
    SOT1135A NXP Semiconductors Flanged ceramic package; 2 mounting holes; 2 leads Original PDF
    SOT1135B NXP Semiconductors earless flanged ceramic package; 2 leads Original PDF
    SOT1136-1 NXP Semiconductors Plastic ball grid array package; 420 balls Original PDF
    SOT1138 NXP Semiconductors OMP 4 leads (flat) Original PDF
    SOT1138-1 NXP Semiconductors Plastic, heatsink small outline package; 4 leads(flat) Original PDF
    SOT1139-1 NXP Semiconductors Plastic ball grid array package; 582 balls Original PDF