HM2V8100TTI5SE
Abstract: HM216514TTI5SE M5M51008DFP-70HIST HM216514 M5M51008DFP-55HIBT hm28100tti5se R1LV1616HSA-4SI M5M51008DFP-70HI M5M5V108DVP-70HIST R1LV0408DSP-5SI
Text: LPSRAM Part Number Guide Density Configuration 256K 32k x8 Voltage 3.0-3.6 & 4.5-5.5V Package SOP28 TSOP28 4.5-5.5V SOP28 Speed 70ns 70ns 55ns 70ns TSOP28 55ns 70ns 1M 128k x8 2.7-3.6V SOP32 TSOP32 sTSOP32 4.5-5.5V SOP32 70ns 70ns 70ns 55ns 70ns TSOP32 55ns
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TSOP32
sTSOP32
M5M5256DVP-55LL
M5M5256DVP-55XL
M5M5256DVP-70LL
M5M5256DVP-70XL
M5M5256DVP-70LLI
M5M5V108DFP-70H
HM2V8100TTI5SE
HM216514TTI5SE
M5M51008DFP-70HIST
HM216514
M5M51008DFP-55HIBT
hm28100tti5se
R1LV1616HSA-4SI
M5M51008DFP-70HI
M5M5V108DVP-70HIST
R1LV0408DSP-5SI
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Untitled
Abstract: No abstract text available
Text: SOP32-P-525-1.27-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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OP32-P-525-1
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Untitled
Abstract: No abstract text available
Text: SOP32-P-525-1.27-K Mirror finish Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 1.32 TYP. 5/Feb.10,1997
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OP32-P-525-1
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Untitled
Abstract: No abstract text available
Text: SOP32-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.32 TYP. 5/Fev. 10, 1997
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OP32-P-525-1
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SOP32 525mil
Abstract: SOP32 525-mil
Text: SANYO Semiconductor Small Outline Package 32Pin Plastic SOP32 525mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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32Pin
525mil)
ED-7303A)
SOP32 525mil
SOP32
525-mil
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SOP32 data sheet
Abstract: PDIP32 PDIP-32-600
Text: U631H1708 Advanced Information SoftStore 128K x 8 nvSRAM Description 5 5 5 0 to 70 ° C -40 to 85 °C CECC 90000 Quality Standard ESD protection > 2000 V MIL STD 883C M3015.7 Packages: SOP32 (450 mil) PDIP32 (600 mil) Pin Configuration n.c. A16 A14 A12 A7
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U631H1708
M3015
PDIP32
D-01109
D-01101
SOP32 data sheet
PDIP32
PDIP-32-600
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SOP32 data sheet
Abstract: PDIP32 U632H1708 a14g
Text: U632H1708 Advanced Information PowerStore 128K x 8 nvSRAM Description 5 5 5 0 to 70 °C -40 to 85 °C CECC 90000 Quality Standard ESD protection > 2000 V MIL STD 883C M3015.7 Packages: SOP32 (450 mil) PDIP32 (600 mil) Pin Configuration VCAP A16 A14 A12 A7
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U632H1708
M3015
PDIP32
D-01109
D-01101
SOP32 data sheet
PDIP32
U632H1708
a14g
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wireless optical mouse controller
Abstract: SOP32 Package mechanical mouse wireless mouse 27 MHZ transmitter 27-MHz Wireless Mouse 27 MHZ circuit transmitter wireless SSOP-28 SSOP28
Text: The wireless communication solution provider SOP32 HP7301 SSOP28 Wireless Mouse Transmitter Controller SoC FEATURES 1K word mask ROM; 48 bytes of RAM Built-in 27 MHz PLL, 3.3 V DC-to-DC, and power amplifier with programmable Power control Low battery detection and LED alarm
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HP7301
SSOP28
SSOP28/SOP32
HP7301
SSOP-28/SOP-32
wireless optical mouse controller
SOP32 Package
mechanical mouse
wireless mouse
27 MHZ transmitter
27-MHz Wireless Mouse
27 MHZ circuit transmitter
wireless
SSOP-28
SSOP28
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1Z16
Abstract: SOP32 PRSP0032DC-A FP-32D D-3217 PSOP-32
Text: JEITA Package Code P-SOP32-11.3x20.45-1.27 RENESAS Code PRSP0032DC-A *1 Previous Code FP-32D/FP-32DV MASS[Typ.] 1.3g NOTE 1. DIMENSIONS"*1 Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F D 32 17 bp Index mark Terminal cross section
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P-SOP32-11
PRSP0032DC-A
FP-32D/FP-32DV
1Z16
SOP32
PRSP0032DC-A
FP-32D
D-3217
PSOP-32
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4x20
Abstract: PRSP0032DA-A PSOP-32 SOP32 P-SOP32-11
Text: JEITA Package Code P-SOP32-11.4x20.75-1.27 RENESAS Code PRSP0032DA-A Previous Code 32P2M-A E 17 *1 F 1 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Index mark 16 c A2 *2 Reference Symbol D A S
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P-SOP32-11
PRSP0032DA-A
32P2M-A
4x20
PRSP0032DA-A
PSOP-32
SOP32
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JEP95
Abstract: SOP32 MO-119
Text: March 1997 1. Amendment November 1997 ZMD-Standard Package SOP32 300 mil MDS 745 Dimensions in millimetres Based on JEDEC: JEP95 MO-119 A2 X A 1 Dimensions View X k x 45 0,1 1 Z bp e HE E 0,2 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax
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JEP95
MO-119
QS-000745-HD-01
SOP32
MO-119
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diode 447
Abstract: SOP32 SOP32 Package SOP32-L1 SOP32L
Text: PACKAGE DIMENSIONS SOP32-L1 0 ~ 8° 17 1 16 0. 8 11. 3 ± 0. 2 32 14. 1 ± 0. 4 20. 447 ± 0. 2 2. 7 ± 0. 15 0. 2 ± 0. 05 0. 2 ± 0. 1 0. 935 0. 10 1. 27 0. 4 ± 0. 1 0. 12 M UNIT : mm
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OP32-L1
diode 447
SOP32
SOP32 Package
SOP32-L1
SOP32L
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Untitled
Abstract: No abstract text available
Text: U634H256 PowerStore 32K x 8 nvSRAM Features Description S High-performance CMOS non- S RoHS compliance and Pb- free S Packages: SOP32 300 mil , S S S S S S S S S S S S S S S volatile static RAM 32768 x 8 bits 25, 35 and 45 ns Access Times 10, 15 and 20 ns Output Enable
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U634H256
U634H256
U634H256SA
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303F
Abstract: PDIP32 U634H256
Text: U634H256 PowerStore 32K x 8 nvSRAM F Packages: PDIP32 600 mil Features F F F F F F F F F F F F F F F F SOP32 (300 mil) High-performance CMOS nonvolatile static RAM 32768 x 8 bits 25, 35 and 45 ns Access Times 10, 15 and 20 ns Output Enable Access Times ICC = 15 mA at 200 ns Cycle Time
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U634H256
PDIP32
D-01109
D-01101
303F
PDIP32
U634H256
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SOP32 525mil
Abstract: FA-1 SOP32
Text: E HE 1 32 b EIAJ Package Code SOP32-P-525-1.27 D e JEDEC Code – y 16 17 Weight g 1.29 A Lead Material Alloy 42 L1 32P2M-A A2 c Detail F F A1 e1 L b2 b2 e1 I2 A A1 A2 b c D E e HE L L1 y Symbol Mar.’98 Dimension in Millimeters Min Nom Max – – 3.05
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OP32-P-525-1
32P2M-A
32pin
525mil
SOP32 525mil
FA-1
SOP32
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i232
Abstract: 525mil
Text: 32P2M-A Plastic 32pin 525mil SOP EIAJ Package Code SOP32-P-525-1.27 JEDEC Code – Weight g 1.29 Lead Material Alloy 42 e 17 E Recommended Mount Pad Symbol 1 16 F A A2 D e y L b A1 L1 HE e1 I2 32 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters
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32P2M-A
32pin
525mil
OP32-P-525-1
i232
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SOP32
Abstract: 32P2W-A 32P2W
Text: 32P2W-A Plastic 32pin 450mil SOP EIAJ Package Code SOP32-P-450-1.27 Weight g 0.67 JEDEC Code – Lead Material Alloy 42 e1 17 E Recommended Mount Pad Symbol 1 16 A F D A2 b L e A1 L1 HE 32 b2 I2 e y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
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32P2W-A
32pin
450mil
OP32-P-450-1
SOP32
32P2W-A
32P2W
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SOP32 525mil
Abstract: No abstract text available
Text: 32P2M-B Plastic 32pin 525mil SOP EIAJ Package Code SOP32-P-525-1.27 Weight g 1.29 JEDEC Code – Lead Material Alloy 42 e I2 A 17 e1 32 b2 1 F Symbol L1 HE E Recommended Mount Pad A A1 A2 b c D E e HE L L1 y 16 y b L e A1 A2 D c Detail F b2 e1 I2 Dimension in Millimeters
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32P2M-B
32pin
525mil
OP32-P-525-1
SOP32 525mil
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SOP32 525mil
Abstract: SOP32
Text: SANYO Semiconductor Small Outline Package 32Pin Plastic SOP32 525mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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32Pin
525mil)
ED-7303A
SOP32 525mil
SOP32
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em78p372nso14j
Abstract: em78p372 EM78P259ND18J EM78P259NS EM78P153SP EM78P372N EM78P153SN EM78P374 IC51-0644-1972 EM78F661NA
Text: UWTR EM78 series USB writer UWTR v1.05.09 support body list 1 Support body sort by Body : (The Red line is update for v1.05.09) IC body Supporting Devices Package Type Package UWTR ADPNum UWTR SMD socket number Textool Part number EM78F541N EM78F541NAD16
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EM78F541N
EM78F541NAD16
DIP16
300mil
UWTR-ADP037
EM78F541NASO16A
150mil
UWTR-SO16/14-150
OTS-16-1
em78p372nso14j
em78p372
EM78P259ND18J
EM78P259NS
EM78P153SP
EM78P372N
EM78P153SN
EM78P374
IC51-0644-1972
EM78F661NA
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GM76C256CLLFW70
Abstract: GM76C8128CLLFW70 GM76C8128CLLFW55 GM76C256CLLFW55 SOP28 gm76U8128 GM76V8 SOP32 GM76C256CLLFW-70 gm76U8128CLL
Text: C M O S S TAT I C R A M CMOS SRAMS Part Number GM76C256CLLFW-55 GM76C256CLLT-55 GM76V256CLLFW-85 GM76V256CLLT-85 GM76U256CLLFW-100 GM76U256CLLT-100 GM76C256CLLFW-70 GM76C256CLLT-70 GM76V256CLLFW-100 GM76V256CLLT-100 GM76U256CLLFW-120 GM76U256CLLT-120 GM76C8128CLLFW-55
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GM76C256CLLFW-55
GM76C256CLLT-55
GM76V256CLLFW-85
GM76V256CLLT-85
GM76U256CLLFW-100
GM76U256CLLT-100
GM76C256CLLFW-70
GM76C256CLLT-70
GM76V256CLLFW-100
GM76V256CLLT-100
GM76C256CLLFW70
GM76C8128CLLFW70
GM76C8128CLLFW55
GM76C256CLLFW55
SOP28
gm76U8128
GM76V8
SOP32
gm76U8128CLL
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GM76C256CLLFW70
Abstract: GM76V256CLLT-85 SOP28 GM76C8128CLLFW70 uPD431000 GM76C8128CLLT70 GM76C8128CLLFW55
Text: C M O S S TAT I C R A M CMOS SRAMS • • • • • • • • • • • • • • • • • • • • • • • New Product Part Number GM76C256CLLFW-55 GM76C256CLLT-55 GM76V256CLLFW-85 GM76V256CLLT-85 GM76U256CLLFW-100 GM76U256CLLT-100 GM76C256CLLFW-70
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GM76C256CLLFW-55
GM76C256CLLT-55
GM76V256CLLFW-85
GM76V256CLLT-85
GM76U256CLLFW-100
GM76U256CLLT-100
GM76C256CLLFW-70
GM76C256CLLT-70
GM76V256CLLFW-100
GM76V256CLLT-100
GM76C256CLLFW70
SOP28
GM76C8128CLLFW70
uPD431000
GM76C8128CLLT70
GM76C8128CLLFW55
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M5M5256DFP-70LL*bm
Abstract: HM2V8100TTI5SE R1LV1616HSA-4SI HM216514TTI5SE M5M5V108DVP-70HIBT M5M5V108DVP M5M5256DFP-70LLISM M5M5W816TP-55HI R1LP0408CSP-7LC M5M51008DFP-70HI
Text: LPSRAM Part Number Guide Density 256K Configuration 32k x8 Voltage Package 3.0-3.6 & 4.5-5.5V SOP28 Speed 70ns Temp Range Catalog / Data Sheet Part Number 0 ~ 70'C. M5M5256DFP-70G 0 ~ 70'C. M5M5256DFP-70XG -40 ~ 85'C M5M5256DFP-70GI TSOP28 4.5-5.5V SOP28 70ns
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M5M5256DFP-70G
M5M5256DVP-70G
M5M5256DVP-70XG
M5M5256DVP-70GI
M5M5256DFP-55LL
M5M5256DFP-55XL
M5M5256DFP-70LL
M5M5256DFP-70XL
M5M5256DFP-70LLI
M5M5256DVP-55LL
M5M5256DFP-70LL*bm
HM2V8100TTI5SE
R1LV1616HSA-4SI
HM216514TTI5SE
M5M5V108DVP-70HIBT
M5M5V108DVP
M5M5256DFP-70LLISM
M5M5W816TP-55HI
R1LP0408CSP-7LC
M5M51008DFP-70HI
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stsop32
Abstract: BGA-36 T68K1M T68R1M T68S1M
Text: T68 K/S/R 1M Family Low Power 1M 128Kx8 -Bits Static RAM ¢ DESCRIPTION The T68K1M, T68S1M, and T68R1M device family is a low power and high performance CMOS SRAM organized as 131,072 words by 8 bits. It operates from 2.7V to 3.6V, 2.2V to 2.7V, and 1.65V to 2.2V. Easy memory expansion is provided by an active LOW chip enable 1
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128Kx8
T68K1M,
T68S1M,
T68R1M
2003-REV
stsop32
BGA-36
T68K1M
T68S1M
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